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    Fused diimidazodiazepine compounds and methods of use and manufacture thereof
    5.
    发明授权
    Fused diimidazodiazepine compounds and methods of use and manufacture thereof 有权
    融合的二咪唑二氮化合物及其使用和制造方法

    公开(公告)号：US08518901B2

    公开(公告)日：2013-08-27

    申请号：US13061612

    申请日：2009-09-23

    申请人： Ramachandra S. Hosmane ,  Venu Raman ,  Raj Kumar

    发明人： Ramachandra S. Hosmane ,  Venu Raman ,  Raj Kumar

    IPC分类号： A01N43/04 ,  A61K31/70 ,  C07H19/00 ,  C07H19/22 ,  C07D491/00

    CPC分类号： C07D487/14

    摘要： The invention encompasses novel compounds and pharmaceutically acceptable salts thereof and compositions including therapeutically or prophylactically effective amounts of such compounds or pharmaceutically acceptable salts thereof. The invention also encompasses methods for treating or preventing diseases and disorders associated abnormal cell growth, for example, treating or preventing cancer or tumor growth, which methods include administering to a mammal in need thereof a composition comprising a therapeutically or prophylactically effective amount of a compound of the invention or a pharmaceutically acceptable salt thereof.

    摘要翻译： 本发明包括新的化合物及其药学上可接受的盐，以及包括治疗或预防有效量的这些化合物或其药学上可接受的盐的组合物。 本发明还包括用于治疗或预防与异常细胞生长相关的疾病和病症的方法，例如治疗或预防癌症或肿瘤生长，所述方法包括向有需要的哺乳动物施用包含治疗或预防有效量的化合物 或其药学上可接受的盐。

    METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO VIAS
    6.
    发明申请
    METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS WITH STACKED MICRO VIAS 有权
    用微型VIAS制造印刷电路板的方法

    公开(公告)号：US20110041330A1

    公开(公告)日：2011-02-24

    申请号：US12938265

    申请日：2010-11-02

    申请人： Raj Kumar ,  Monte Dreyer ,  Michael J. Taylor

    发明人： Raj Kumar ,  Monte Dreyer ,  Michael J. Taylor

    IPC分类号： H05K3/36

    CPC分类号： H05K3/4623 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09309 ,  H05K2201/096 ,  H05K2203/0191 ,  H05K2203/0271 ,  H05K2203/0502 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1461 ,  H05K2203/1536 ,  H05K2203/304 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.

    摘要翻译： 一种制造印刷电路板的至少一部分的方法。 该方法包括：在第一多层基板上施加层压粘合剂，该第一多层基板包括多个电路层，在第一多层基板的第一侧具有至少一个第一金属焊盘; 在层压粘合剂上涂上保护膜; 将至少一个通孔形成到所述层压粘合剂中以暴露所述第一多层基板的第一侧上的所述至少一个金属焊盘; 将至少一个导电浆料填充到在层压粘合剂中形成的至少一个通孔中; 去除所述保护膜以将所述层叠粘合剂暴露在所述第一多层基板上; 以及在所述第二多层基板的第二面上，将具有包含多个电路层的第二多层基板与至少一个第二金属焊盘连接的第一多层基板。

    Persistent key-value repository with a pluggable architecture to abstract physical storage
    7.
    发明授权
    Persistent key-value repository with a pluggable architecture to abstract physical storage 有权
    具有可插拔架构的持久键值存储库，用于抽象物理存储

    公开(公告)号：US07617218B2

    公开(公告)日：2009-11-10

    申请号：US11404159

    申请日：2006-04-13

    申请人： Surojit Chatterjee ,  Raj Kumar ,  Jonathan Creighton ,  Alok K. Srivastava ,  Sameer Joshi

    发明人： Surojit Chatterjee ,  Raj Kumar ,  Jonathan Creighton ,  Alok K. Srivastava ,  Sameer Joshi

    IPC分类号： G06F7/00 ,  G06F17/30 ,  G06F17/00 ,  G06F12/00

    CPC分类号： G06F17/3056 ,  Y10S707/99931 ,  Y10S707/99932 ,  Y10S707/99943 ,  Y10S707/99953

    摘要： A system and techniques are described for managing key-value pairs using an architecture that does not restrict its users to any specific platform or storage subsystem. According to one aspect of the invention, the repository is portable in that the architecture need not change based on the environment and platform in which the repository is used. Rather, the portion of the architecture that is platform-specific is limited to plug-ins at a storage abstraction layer of the repository. The plug-ins expose the same storage abstraction interface to the other layers of the repository, but are implemented to interact with different platforms and storage subsystems. Consequently, in response to being ported from one platform to another, the repository may simply change the plug-in to invoke for persistent storage operations.

    摘要翻译： 描述了使用不将其用户限制到任何特定平台或存储子系统的架构来管理键值对的系统和技术。 根据本发明的一个方面，存储库是可移植的，因为架构不需要基于使用存储库的环境和平台来改变。 相反，平台特定的架构部分仅限于存储库的存储抽象层的插件。 插件将相同的存储抽象接口暴露给存储库的其他层，但实现为与不同平台和存储子系统进行交互。 因此，响应于从一个平台移植到另一个平台，存储库可以简单地改变插件以调用永久存储操作。

    Methods of manufacturing printed circuit boards with stacked micro vias
    8.
    发明申请
    Methods of manufacturing printed circuit boards with stacked micro vias 有权
    制造具有堆叠微通孔的印刷电路板的方法

    公开(公告)号：US20090178274A1

    公开(公告)日：2009-07-16

    申请号：US12381925

    申请日：2009-03-17

    申请人： Raj Kumar

    发明人： Raj Kumar

    IPC分类号： H05K3/36

    CPC分类号： H05K3/4623 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09309 ,  H05K2201/096 ,  H05K2203/0191 ,  H05K2203/0271 ,  H05K2203/0502 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1461 ,  H05K2203/1536 ,  H05K2203/304 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： Methods of manufacturing printed circuit boards having circuit layers laminated with stacked (or staggered) micro via(s). Aspects of embodiments of the present invention are directed to a method of manufacturing a printed circuit board with Z-axis interconnect(s) or micro via(s) that can eliminate a need for plating micro vias and/or eliminate a need for planarizing plated bumps of a surface, that can be fabricated with one or two lamination cycles, and/or that can have carrier-to-carrier (or substrate-to-substrate) attachments with conductive vias, each filled with a conductive material (e.g., with a conductive paste) in the Z-axis. In one embodiment, a printed circuit board having a plurality of circuit layers with at least one z-axis interconnect can be fabricated using a single lamination cycle.

    摘要翻译： 制造印刷电路板的方法，其具有层压（或交错）微通道的电路层。 本发明的实施例的方面涉及一种制造具有Z轴互连或微通孔的印刷电路板的方法，其可以消除电镀微通孔的需要和/或消除对平面化电镀的需要 可以用一个或两个层压循环制造的表面的凸起，和/或可以具有导电通孔的载流子到载体（或基底到基底）附件，每个填充有导电材料（例如， 导电糊）在Z轴上。 在一个实施例中，可以使用单个层压循环来制造具有具有至少一个z轴互连的多个电路层的印刷电路板。

    Online instance deletion in a multi-instance computer system
    10.
    发明申请
    Online instance deletion in a multi-instance computer system 有权
    多实例计算机系统中的在线实例删除

    公开(公告)号：US20070234292A1

    公开(公告)日：2007-10-04

    申请号：US11711241

    申请日：2007-02-26

    申请人： Raj Kumar ,  Jonathan Creighton ,  Alok Srivastava

    发明人： Raj Kumar ,  Jonathan Creighton ,  Alok Srivastava

    IPC分类号： G06F9/44 ,  G06F9/45 ,  G06F9/46

    CPC分类号： G06F9/4868 ,  H04L69/32 ,  Y10S707/99931 ,  Y10S707/99944

    摘要： In an application executing in multiple computers connected by a network, an instance of the application is deleted from a group of instances that share a resource, such as a database. Specifically the to-be-deleted instance is shut down, followed by deleting connectivity between the to-be-deleted instance and the network, and then deleting an object of the to-be-deleted instance. Each of these acts is performed automatically without user input, once the user issues an instruction to delete the to-be-deleted instance.

    摘要翻译： 在由网络连接的多台计算机中执行的应用程序中，从共享资源的一组实例（例如数据库）中删除应用程序的实例。 具体来说，要删除的实例被关闭，然后删除待删除实例与网络之间的连接，然后删除待删除实例的对象。 一旦用户发出删除要删除的实例的指令，这些动作中的每一个都将自动执行，无需用户输入。