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公开(公告)号:US06675852B2
公开(公告)日:2004-01-13
申请号:US09882239
申请日:2001-06-15
申请人: Varaprasad Venkata Calmidi , Donald S. Farquhar , Michael Joseph Klodowski , Randall Joseph Stutzman
发明人: Varaprasad Venkata Calmidi , Donald S. Farquhar , Michael Joseph Klodowski , Randall Joseph Stutzman
IPC分类号: B30B1506
CPC分类号: B30B5/067 , B32B37/08 , B32B37/10 , B32B38/0036 , B32B2457/08 , H05K3/022 , H05K2203/068 , H05K2203/1121
摘要: A platen for use in a laminating press is provided which includes a body of material having first and second faces and spaced first and second ends. Preferably, at least one heating device is disposed in the body of material. First and second spaced cooling channels are formed in the body of material, the first cooling channel being adjacent the first face and having a fluid inlet port adjacent to or in the first end, and a fluid outlet port adjacent to or in the second end, and a second cooling channel being adjacent the second face and having a fluid inlet port adjacent to or in said second end, and a fluid outlet port adjacent to or in the first end. The invention also contemplates using such platens for laminating a book or stack of sheets of material to form a unitary single member having reduced stresses.
摘要翻译: 提供了一种用于层压机的压板,其包括具有第一和第二表面以及间隔开的第一和第二端的材料体。 优选地,至少一个加热装置设置在材料体内。 第一和第二间隔开的冷却通道形成在材料体中,第一冷却通道邻近第一面并具有与第一端相邻或在第一端的流体入口,以及与第二端相邻或在第二端的流体出口, 以及第二冷却通道,其邻近所述第二面并且具有与所述第二端部相邻或所述第二端部的流体入口端口以及与所述第一端口相邻或在所述第一端部的流体出口。 本发明还考虑使用这种压板来层压书或堆叠的材料片以形成具有减小的应力的单一单个构件。
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公开(公告)号:US06883593B2
公开(公告)日:2005-04-26
申请号:US10762904
申请日:2004-01-22
IPC分类号: H01L23/367 , H01L23/467 , F28F7/00
CPC分类号: H01L23/467 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要: A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.
摘要翻译: 提供了一种用于水平应用中自由对流冷却的散热器。 具体地,散热器包括多个间隔开的冷却翅片,其由倾斜的基座支撑。 冷却翅片横向地附接到基部并且在基本垂直的方向上延伸。 此外,冷却翅片延伸超过基座的外边缘,使得空气可以水平地在基座下方流动,然后垂直地流过间隔开的散热片。
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公开(公告)号:US06691769B2
公开(公告)日:2004-02-17
申请号:US09924210
申请日:2001-08-07
IPC分类号: F28F700
CPC分类号: H01L23/467 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要: A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.
摘要翻译: 提供了一种用于水平应用中自由对流冷却的散热器。 具体地,散热器包括多个间隔开的冷却翅片,其由倾斜的基座支撑。 冷却翅片横向地附接到基部并且在基本垂直的方向上延伸。 此外,冷却翅片延伸超过基座的外边缘,使得空气可以水平地在基座下方流动,然后垂直地流过间隔开的散热片。
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公开(公告)号:US06740959B2
公开(公告)日:2004-05-25
申请号:US09921062
申请日:2001-08-01
申请人: David James Alcoe , Jeffrey Thomas Coffin , Michael Anthony Gaynes , Harvey Charles Hamel , Mario J. Interrante , Brenda Lee Peterson , Megan J. Shannon , William Edward Sablinski , Christopher Todd Spring , Randall Joseph Stutzman , Renee L. Weisman , Jeffrey Allen Zitz
发明人: David James Alcoe , Jeffrey Thomas Coffin , Michael Anthony Gaynes , Harvey Charles Hamel , Mario J. Interrante , Brenda Lee Peterson , Megan J. Shannon , William Edward Sablinski , Christopher Todd Spring , Randall Joseph Stutzman , Renee L. Weisman , Jeffrey Allen Zitz
IPC分类号: H01L23552
CPC分类号: H01L23/552 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01087 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16195 , H01L2924/3025 , H01L2924/00
摘要: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.
摘要翻译: 包括EMI屏蔽的电子封装,特别是包含嵌入其中具有接地带的半导体芯片 - 载体结构的半导体器件,其适于减少高速开关电子封装的输出和入射EMI发射。
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