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    Micro-electro-mechanical optical device
    1.
    发明授权
    Micro-electro-mechanical optical device 有权
    微机电光学装置

    公开(公告)号：US06392221B1

    公开(公告)日：2002-05-21

    申请号：US09390158

    申请日：1999-09-03

    申请人： Vladimir Anatolyevich Aksyuk ,  David John Bishop

    发明人： Vladimir Anatolyevich Aksyuk ,  David John Bishop

    IPC分类号： G02B2600

    CPC分类号： G02B26/0841 ,  B81B3/004 ,  B81B3/0062 ,  B81B5/00 ,  B81B7/0003 ,  B81B2201/042 ,  B81B2201/045 ,  G02B26/0866

    摘要： A micro-electro-mechanical optical device is disclosed. The micro-electro-mechanical optical device includes a micro-electro-mechanical structure coupled with an optical device. Both the micro-electro-mechanical structure and the optical device are disposed on a substrate surface. The micro-electro-mechanical structure lifts the optical device a predetermined distance above the plane of the substrate surface. Thereafter, the lifted optical device is moveable relative to the plane of the substrate surface in response to an electrostatic field generated between the optical device and the substrate.

    摘要翻译： 公开了一种微机电光学装置。 微机电光学器件包括与光学器件耦合的微电子机械结构。 微电子机械结构和光学装置均设置在基板表面上。 微电子机械结构将光学装置提升到衬底表面平面上方一预定的距离。 此后，响应于在光学器件和衬底之间产生的静电场，提升的光学器件可相对于衬底表面的平面移动。

    Surface-micromachined out-of-plane tunable optical filters
    2.
    发明授权
    Surface-micromachined out-of-plane tunable optical filters 有权
    表面微机械加工的平面外可调滤光片

    公开(公告)号：US06351577B1

    公开(公告)日：2002-02-26

    申请号：US09211185

    申请日：1998-12-14

    申请人： Vladimir Anatolyevich Aksyuk ,  David John Bishop ,  Anat Sneh

    发明人： Vladimir Anatolyevich Aksyuk ,  David John Bishop ,  Anat Sneh

    IPC分类号： G02B612

    CPC分类号： G02B6/29358 ,  G02B6/122 ,  G02B6/29395 ,  G02B26/001 ,  G02B2006/12104

    摘要： The invention provides tunable optical filters which incorporate a surface-micromachined out-of-plane plate having a moveable membrane with a high reflective (HR) coated mirror. The mirror defines one side of a Fabry-Perot (FP) filter cavity and is movable in a direction along an axis of the filter cavity. The other side of the filter cavity is defined by a second HR-coated mirror. In one illustrative embodiment, a first plate is formed on a substrate, and then subsequently released from the substrate and secured in a plane orthogonal to the substrate. The first HR-coated mirror is formed as part of a movable membrane supported in an opening through the first plate. The second mirror is formed on a second plate secured in another plane orthogonal to the plane of the substrate, such that the filter cavity is defined horizontally between the first and second mirrors. In another embodiment, the second mirror is formed on an endface of an external fiber, such that light from the fiber can pass from the second mirror through an opening in the second plate to the first mirror. In another possible embodiment, the second plate is eliminated and the second mirror is formed on the substrate. The first plate is then arranged over the second mirror, in a plane parallel to the substrate, and separated from the substrate by spacers, such that the filter cavity is defined vertically.

    摘要翻译： 本发明提供了可调谐光学滤波器，其结合了具有高反射（HR）涂覆反射镜的可移动膜的表面微加工的平面外板。 反射镜定义了法布里 - 珀罗（FP）过滤器腔的一侧，并且可沿着过滤腔的轴线的方向移动。 过滤腔的另一侧由第二HR涂层镜定义。 在一个说明性实施例中，第一板形成在衬底上，然后随后从衬底释放并固定在与衬底正交的平面中。 第一HR涂覆镜形成为支撑在通过第一板的开口中的可移动膜的一部分。 第二反射镜形成在固定在与基板的平面正交的另一平面中的第二板上，使得过滤腔在水平地限定在第一和第二反射镜之间。 在另一个实施例中，第二反射镜形成在外部光纤的端面上，使得来自光纤的光可以从第二反射镜通过第二板中的开口传递到第一反射镜。 在另一个可能的实施例中，第二板被去除并且第二反射镜形成在基板上。 然后将第一板布置在平行于基板的平面中的第二反射镜上，并且通过间隔件与基板分离，使得过滤腔垂直地限定。

    Micro-electro-mechanical optical device
    3.
    发明授权
    Micro-electro-mechanical optical device 有权
    微机电光学装置

    公开(公告)号：US06265239B1

    公开(公告)日：2001-07-24

    申请号：US09390580

    申请日：1999-09-03

    申请人： Vladimir Anatolyevich Aksyuk ,  David John Bishop

    发明人： Vladimir Anatolyevich Aksyuk ,  David John Bishop

    IPC分类号： H01L2100

    CPC分类号： G02B26/0866 ,  B81B3/004 ,  B81B3/0062 ,  B81B7/0003 ,  B81B2201/042 ,  G02B26/0841

    摘要： A method for pivoting an optical device about one or more axes thereof is disclosed. Springs couple the optical device to the micro-electro-mechanical structure. A portion of the springs are fastened on the micro-electro-mechanical structure. Fastening the portion of each spring on the electromechanical structure prevents the springs from moving the optical device in a translational direction when such optical device pivots about the one or more axes.

    摘要翻译： 公开了一种用于围绕其一个或多个轴线枢转光学装置的方法。 弹簧将光学装置耦合到微机电结构。 弹簧的一部分紧固在微机电结构上。 紧固机电结构上的每个弹簧的部分防止当这种光学装置围绕一个或多个轴枢转时弹簧沿平移方向移动光学装置。

    Micro-electro-mechanical optical device
    5.
    发明授权
    Micro-electro-mechanical optical device 有权
    微机电光学装置

    公开(公告)号：US06366414B1

    公开(公告)日：2002-04-02

    申请号：US09390157

    申请日：1999-09-03

    申请人： Vladimir Anatolyevich Aksyuk ,  David John Bishop

    发明人： Vladimir Anatolyevich Aksyuk ,  David John Bishop

    IPC分类号： G02B702

    CPC分类号： G02B26/0841 ,  B81B3/0062

    摘要： An electro-mechanical structure which controls the movement of an optical device coupled thereto is disclosed. Both the electro-mechanical structure and the optical device are disposed on a substrate surface. The electro-mechanical structure controls the movement of the optical device by first lifting the optical device a predetermined distance above the plane of the substrate surface. Thereafter, the lifted optical device is moveable relative to the plane of the substrate surface in response to an electrostatic field generated between the electro-mechanical structure and the substrate.

    摘要翻译： 公开了一种控制耦合到其上的光学装置的运动的机电结构。 机电结构和光学装置均设置在基板表面上。 机电结构通过首先将光学装置提升到衬底表面的平面上方一预定的距离来控制光学装置的运动。 此后，响应于机电结构和基板之间产生的静电场，提升的光学装置可相对于基板表面的平面移动。

    Micro-electro-mechanical optical device
    6.
    发明授权
    Micro-electro-mechanical optical device 有权
    微机电光学装置

    公开(公告)号：US06300619B1

    公开(公告)日：2001-10-09

    申请号：US09415178

    申请日：1999-10-08

    申请人： Vladimir Anatolyevich Aksyuk ,  David John Bishop ,  Cristian A. Bolle ,  Randy Clinton Giles ,  Flavio Pardo

    发明人： Vladimir Anatolyevich Aksyuk ,  David John Bishop ,  Cristian A. Bolle ,  Randy Clinton Giles ,  Flavio Pardo

    IPC分类号： G02B2600

    CPC分类号： B81B7/0003 ,  B81B2201/045 ,  B81B2203/0181 ,  B81B2203/058 ,  G02B26/0833 ,  G02B26/0841 ,  G02B26/085 ,  G02B26/0866

    摘要： A micro-electro-mechanical (MEM) optical device having a reduced footprint for increasing yield on a substrate. The MEM device includes an optical element having an outer edge and supported by a support structure disposed on a substrate. The support structure is mechanically connected to the substrate through first and second pairs of beams which move the structure to an active position for elevating the optic device above the substrate. When in an elevated position, the optical device can be selectively tilted for deflecting optic signals. The beams are connected at one end to the support structure, at the other end to the substrate and are disposed so that the first and second beam ends are located proximate the optical device outer edge. In a preferred embodiment, a stiction force reducing element is included on the outer edge of the optical device for reducing the contact area between the optic device edge and the substrate.

    摘要翻译： 一种微机电（MEM）光学装置，其具有减小的占地面积，以增加基板上的产量。 MEM装置包括具有外边缘并由设置在基板上的支撑结构支撑的光学元件。 支撑结构通过第一和第二对梁将其机械地连接到基板，所述梁将结构移动到用于将光学装置升高到基板上方的活动位置。 当处于升高位置时，可以选择性地倾斜光学装置以偏转光信号。 梁在一端连接到支撑结构，另一端连接到基板，并且被布置成使得第一和第二梁端部位于光学装置外边缘附近。 在优选实施例中，在光学装置的外边缘上包括一个减小降低力的元件，用于减小光学元件边缘和基板之间的接触面积。

    Hermatic firewall for MEMS packaging in flip-chip bonded geometry
    8.
    发明授权
    Hermatic firewall for MEMS packaging in flip-chip bonded geometry 有权
    Hermatic防火墙用于MEMS封装中的倒装芯片焊接几何

    公开(公告)号：US06400009B1

    公开(公告)日：2002-06-04

    申请号：US09419488

    申请日：1999-10-15

    申请人： David John Bishop ,  John VanAtta Gates, II ,  Jungsang Kim

    发明人： David John Bishop ,  John VanAtta Gates, II ,  Jungsang Kim

    IPC分类号： H01L2312

    CPC分类号： B81B7/0041 ,  B81C2203/019 ,  H01L23/04 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

    摘要： A package for hermetically sealing a micro-electromechanical systems (MEMS) device in a hybrid circuit comprise a firewall formed on a substrate for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be sealed. A second substrate spaced from the first substrate hermetically seals the cavity when the second substrate is flip-chip bonded to the first substrate and soldered to the first substrate with a thin film metal material placed on at least a top portion of the firewall. The resulting firewall MEMS device package can be further packaged using conventional CMOS packaging techniques. By hermetically sealing the cavity, the enclosed MEMS device is protected from deleterious conditions found in the environment of conventional CMOS packaging techniques which is often detrimental to MEMS device function.

    摘要翻译： 用于气密地密封混合电路中的微机电系统（MEMS）装置的封装包括形成在用于MEMS器件的衬底上的防火墙，其具有限定封装的空腔的高度，其中MEMS器件将被密封。 与第一基板间隔开的第二基板在第二基板被倒装芯片接合到第一基板时气密地密封空腔，并且将金属材料焊接到第一基板上，薄膜金属材料放置在防火墙的至少顶部上。 所得到的防火墙MEMS器件封装可以使用传统的CMOS封装技术进一步封装。 通过密封空腔，封装的MEMS器件得到保护，防止在常规CMOS封装技术的环境中发现有害条件，这常常对MEMS器件功能有害。

    Method and arrangement for a combined modulator/photodetector
    9.
    发明授权
    Method and arrangement for a combined modulator/photodetector 失效
    组合调制器/光电探测器的方法和装置

    公开(公告)号：US5767997A

    公开(公告)日：1998-06-16

    申请号：US675980

    申请日：1996-07-05

    申请人： David John Bishop ,  Keith Wayne Goossen ,  James A. Walker

    发明人： David John Bishop ,  Keith Wayne Goossen ,  James A. Walker

    IPC分类号： H04B10/24 ,  H04B10/00

    CPC分类号： H04B10/40

    摘要： Apparatus and methods for a combined optical modulator/photodetector are disclosed. A modulator chip is attached to a photodetector chip using a non-conductive epoxy or solder. The combined modulator/photodetector can be configured in at least two ways. In one configuration, the modulator is located on the upper surface of a chip that is attached, at its lower surface, to a photodetector containing chip. In another configuration, the modulator is located on the lower surface of the modulator chip, which is again attached at its lower surface to the pbotodetector chip. By combining the modulator and photodetector in the manner described above, they can be placed in a single package, resulting in reduced packaging costs versus a separately packaged modulator and a separately packaged photodetector. Moreover, feedback from the photodetector can used to optimize the operation of micromechanical optical modulators.

    摘要翻译： 公开了用于组合光调制器/光电检测器的装置和方法。 使用非导电环氧树脂或焊料将调制器芯片附接到光电检测器芯片。 组合的调制器/光电检测器可以至少两种方式配置。 在一种配置中，调制器位于芯片的上表面上，芯片的下表面附接到包含光电检测器的芯片。 在另一种配置中，调制器位于调制器芯片的下表面上，该调制器芯片的下表面再次连接到波导检测器芯片。 通过以上述方式组合调制器和光电检测器，它们可以放置在单个封装中，从而与单独封装的调制器和单独封装的光电检测器相比降低了封装成本。 此外，来自光电检测器的反馈可用于优化微机械光学调制器的操作。