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公开(公告)号：US4632295A
公开(公告)日：1986-12-30
申请号：US764710
申请日：1985-08-12
申请人： Vlasta A. Brusic , Peter J. Elmgren , Charles J. Owen , David W. Sissenstein, Jr. , Helen L. Yeh
发明人： Vlasta A. Brusic , Peter J. Elmgren , Charles J. Owen , David W. Sissenstein, Jr. , Helen L. Yeh
CPC分类号： B23K35/38 , B23K35/3612 , H05K3/3489
摘要： A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or polyol and the resulting assembly is heated in a reducing atmosphere.
摘要翻译： 工件通过使用焊料并将二醇和/或其多元醇和/或醚衍生物施加到基材上而与基板接合。 将工件放置成与二醇和/或多元醇接触，并将所得组件在还原气氛中加热。
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公开(公告)号：US4919729A
公开(公告)日：1990-04-24
申请号：US346241
申请日：1989-05-02
申请人： Peter J. Elmgren , Alan J. Emerick , Dennis L. Rivenburg, Sr. , Mukund K. Saraiya , David W. Sissenstein, Jr.
发明人： Peter J. Elmgren , Alan J. Emerick , Dennis L. Rivenburg, Sr. , Mukund K. Saraiya , David W. Sissenstein, Jr.
CPC分类号： B23K35/3612 , B23K35/22 , B23K35/26
摘要： A solder paste for use in a reducing atmosphere is disclosed. The solder paste includes a solder powder and an alcohol binder. The reducing atmosphere serves as a flux, thereby eliminating flux residues and the problems associated therewith. Solder splattering is reduced by using a polyhydric alcoholic binder which vaporizes or decomposes before the solder liquifies during heating. The use of such a solder paste in a reducing atmosphere results in no hazardous chemical by-products and, because the solder is handled in the form of a paste, is compatible with electrical components requiring precise dimensional tolerances.
摘要翻译： 公开了一种用于还原气氛的焊膏。 焊膏包括焊料粉末和醇粘合剂。 还原气氛用作助熔剂，从而消除助熔剂残余物和与之相关的问题。 通过使用在加热期间焊料液化之前蒸发或分解的多元醇粘合剂来降低焊料飞溅。 在还原气氛中使用这种焊膏导致没有有害的化学副产物，并且由于焊料以糊状的形式被处理，所以与需要精确的尺寸公差的电气部件兼容。
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公开(公告)号：US5495089A
公开(公告)日：1996-02-27
申请号：US71557
申请日：1993-06-04
CPC分类号： B23K26/0884 , B23K1/0056 , B23K26/08 , H05K3/3494 , B23K2201/40 , H05K2203/107 , H05K3/3421 , Y10T29/49144
摘要： This disclosure relates to a process for laser soldering surface mount components on a printed circuit board using the continuous wave laser scanning technique. The process involves factoring together the scan rate, the beam diameter, and the laser power level, in order to determine what these specific process variables should be. In addition, the process also involves taking account of the depth of a metallic layer, such as a reference plane, inside the printed circuit board to determine its effect on other process variables. On the other hand, if the board does not have a metallic layer, the process takes account of the thickness of the board being processed. Preferred ranges for process variables are identified, as well as optimization techniques which further refine the process variables to achieve production efficiency or bonding pull strength.
摘要翻译： 本公开涉及使用连续波激光扫描技术在印刷电路板上激光焊接表面安装部件的方法。 该过程包括将扫描速率，光束直径和激光功率水平分解在一起，以确定这些特定过程变量应该是什么。 此外，该方法还涉及考虑印刷电路板内的金属层（例如参考平面）的深度，以确定其对其它工艺变量的影响。 另一方面，如果电路板没有金属层，则该过程考虑到被处理板的厚度。 识别过程变量的优选范围，以及进一步改进过程变量以实现生产效率或结合拉力的优化技术。
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公开(公告)号：US5274210A
公开(公告)日：1993-12-28
申请号：US25197
申请日：1993-03-02
CPC分类号： B23K26/18 , B23K1/0056 , H05K3/3421 , B23K2201/40 , H05K2201/0112 , H05K2201/09781 , H05K2201/10681 , H05K2201/10689 , H05K2201/10909 , H05K2203/107 , H05K3/3494 , Y02P70/613
摘要： This disclosure relates to laser bonding electrical components having conductive elements which are naturally reflective of the laser beam wavelength. Component leads or pads which are made of copper or have a gold coating, for example, will reflect the wavelength of an Nd:YAG laser, making it difficult to form physical and electrical bonds using the laser bonding technique. In preferred embodiments, the conductive elements are coated with a non-flux, non-metallic, coating material which is less reflective of the laser energy than the conductive elements, making it possible to efficiently use a laser to accomplish bonding.
摘要翻译： 本公开涉及具有天然反射激光束波长的导电元件的激光键合电气部件。 例如，由铜制成或具有金涂层的部件引线或焊盘将反映Nd：YAG激光器的波长，使得难以使用激光焊接技术形成物理和电连接。 在优选实施例中，导电元件涂覆有非导通的非金属涂层材料，其比导电元件更少地反映激光能量，使得可以有效地使用激光来实现粘合。
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公开(公告)号：US5175410A
公开(公告)日：1992-12-29
申请号：US724412
申请日：1991-06-28
CPC分类号： B23K3/087 , B23K1/0056 , H05K3/3421 , H05K2201/10689 , H05K2203/0195 , H05K2203/107 , H05K3/3494 , Y02P70/613 , Y10T29/53265
摘要： The present invention involves a hold-down fixture which is usable in connection with bonding an integrated circuit package to a printed circuit board in a surface mount environment. The purpose of the fixture is to hold each of the leads of the package in intimate contact with corresponding contact pads on the printed circuit board during the bonding process. The fixture includes a base with two bars for each group of leads extending from the perimeter of the housing of the package. Together the bars compressively force the entire foot of each lead to set flatly against its pad. The bars are spaced such that an aperture, which is defined by an opening through the base and positioned between the bars, can admit a bonding means, such as a laser beam, to reflow a solder composition at the lead/pad junction. Accordingly, with the leads compressed against the pads by the bars of the fixture, and with the reflow of the solder composition by means of the laser, a good bond between each lead and pad will be formed.
摘要翻译： 本发明涉及一种压紧夹具，其可用于将表面安装环境中的集成电路封装与印刷电路板的结合。 夹具的目的是在接合过程中将包装的每个引线与印刷电路板上的对应接触垫紧密接触。 该固定装置包括一个底座，该基座具有两个杆，用于从包装壳体的周边延伸的每组引线。 钢筋一起压缩地将每根导线的整个脚部平坦地压在其垫上。 这些杆间隔开，使得由通过基座的开口限定并定位在杆之间的孔可允许诸如激光束的接合装置在引线/焊盘接合处回流焊料组合物。 因此，当引线通过固定装置的杆压靠在焊盘上时，并且借助于激光焊接组合物的回流，将形成每个引线和焊盘之间良好的结合。
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