公开(公告)号：US4632295A

公开(公告)日：1986-12-30

申请号：US764710

申请日：1985-08-12

申请人： Vlasta A. Brusic ,  Peter J. Elmgren ,  Charles J. Owen ,  David W. Sissenstein, Jr. ,  Helen L. Yeh

发明人： Vlasta A. Brusic ,  Peter J. Elmgren ,  Charles J. Owen ,  David W. Sissenstein, Jr. ,  Helen L. Yeh

IPC分类号： B23K1/00 ,  B23K1/008 ,  B23K35/36 ,  B23K35/38 ,  B23K101/42 ,  H05K3/34

CPC分类号： B23K35/38 ,  B23K35/3612 ,  H05K3/3489

摘要： A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or polyol and the resulting assembly is heated in a reducing atmosphere.

摘要翻译： 工件通过使用焊料并将二醇和/或其多元醇和/或醚衍生物施加到基材上而与基板接合。 将工件放置成与二醇和/或多元醇接触，并将所得组件在还原气氛中加热。

公开(公告)号：US5360946A

公开(公告)日：1994-11-01

申请号：US761182

申请日：1991-09-17

申请人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

发明人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC分类号： H01L24/45 ,  H01L21/481 ,  H01L23/49572 ,  H01L23/49894 ,  H01L24/85 ,  H05K3/363 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/176 ,  H05K3/0017 ,  H05K3/3452 ,  Y10T29/49121 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.

摘要翻译： 本发明涉及适用于硅载体或其它类型的芯片载体应用的改进的柔性（或TAB）产品，其中例如通过Cu热循环引起的柔性可靠性问题被显着地减少或消除。 更具体地，本发明体现了用于这种产品中的许多涂层以及制造和使用它们的各种方法。

公开(公告)号：US5225711A

公开(公告)日：1993-07-06

申请号：US667489

申请日：1991-03-11

申请人： Chin-An Chang ,  Nicholas G. Koopman ,  Judith M. Roldan ,  Steven Strickman ,  Kamalesh K. Srivastava ,  Helen L. Yeh

发明人： Chin-An Chang ,  Nicholas G. Koopman ,  Judith M. Roldan ,  Steven Strickman ,  Kamalesh K. Srivastava ,  Helen L. Yeh

IPC分类号： B23K35/00 ,  H01L21/60 ,  H01R43/02 ,  H05K3/34

CPC分类号： H01L24/81 ,  B23K35/001 ,  H01R43/02 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3457

摘要： The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.

摘要翻译： 在包含铜的集成电路触点的还原气氛中，使用200至1500埃厚的钯，在熔融之前抑制氧化铜形成并减少所有氧化物以促进融合期间的润湿，从而增强了在含铜的集成电路触点的还原气氛中的无助焊接。

公开(公告)号：US4933635A

公开(公告)日：1990-06-12

申请号：US288390

申请日：1988-12-22

申请人： Alina Deutsch ,  Modest M. Oprysko ,  John J. Ritsko ,  Laura B. Rothman ,  Helen L. Yeh ,  Atilio Zupicich

发明人： Alina Deutsch ,  Modest M. Oprysko ,  John J. Ritsko ,  Laura B. Rothman ,  Helen L. Yeh ,  Atilio Zupicich

IPC分类号： H01L21/66 ,  G01R31/28 ,  H01L23/544

CPC分类号： H01L22/34 ,  G01R31/2818 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01037 ,  H01L2924/15192 ,  H01L2924/3011

摘要： A thin film region 14 of a multichip carrier 10 is provided with at least one fabrication process or tooling monitor for monitoring the quality of the fabrication process during the sequential formation of the layers of the region 14. The process monitor is formed with a desired layer or layers of the thin film region, such as by a photolithographic process. A centrally disposed active wiring region 30 of a layer is surrounded by peripherally disposed fabrication monitor sites 32. The sites 32 can be located such that they do not occupy or interfere with the surface area required for the wiring region 30 while still being disposed near enough to the wiring region such that the electrical and physical characteristics of the thin film is substantially the same. Four different types of thin film fabrication process monitors are disclosed, including a line/via monitor, a dielectric monitor, a laser assisted repair monitor and a laser assisted engineering change monitor.

公开(公告)号：US5546655A

公开(公告)日：1996-08-20

申请号：US329066

申请日：1994-10-25

申请人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

发明人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K3/02

CPC分类号： H01L24/45 ,  H01L21/481 ,  H01L23/49572 ,  H01L23/49894 ,  H01L24/85 ,  H05K3/363 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/176 ,  H05K3/0017 ,  H05K3/3452 ,  Y10T29/49121 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.

摘要翻译： 适用于芯片载体应用的柔性或TAB产品，其中在功率和热循环期间由铜枝晶生长和引线弯曲引起的柔性可靠性问题通过将特殊涂层施加到柔性带的引导区域来减少。

公开(公告)号：US5048744A

公开(公告)日：1991-09-17

申请号：US522473

申请日：1990-05-14

申请人： Chin-An Chang ,  Nicholas G. Koopman ,  Judith M. Roldan ,  Steven Strickman ,  Kamalesh K. Srivastava ,  Helen L. Yeh

发明人： Chin-An Chang ,  Nicholas G. Koopman ,  Judith M. Roldan ,  Steven Strickman ,  Kamalesh K. Srivastava ,  Helen L. Yeh

IPC分类号： B23K35/00 ,  B23K35/14 ,  H01L21/60 ,  H01R43/02 ,  H05K3/34

CPC分类号： H01L24/81 ,  B23K35/001 ,  H01R43/02 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3457

摘要： The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.

摘要翻译： 在包含铜的集成电路触点的还原气氛中，使用200至1500埃厚的钯，在熔融之前抑制氧化铜形成并减少所有氧化物以促进融合期间的润湿，从而增强了在含铜的集成电路触点的还原气氛中的无助焊接。