-
公开(公告)号：US06123995A
公开(公告)日：2000-09-26
申请号：US36235
申请日：1998-03-06
CPC分类号： H05K3/424
摘要： A method of providing an electrically conductive polymer coating on a copper clad circuit board prior to electroplating is disclosed. The method teaches the application of certain organic solvents to a conductive polymer composition already applied to the board but before drying the conductive polymer composition to remove liquids therefrom to form a conductive polymer film.
摘要翻译： 公开了一种在电镀之前在铜包覆电路板上提供导电聚合物涂层的方法。 该方法教导了将某些有机溶剂应用于已经施加到板上的导电聚合物组合物，但是在干燥导电聚合物组合物以从其中除去液体以形成导电聚合物膜之前。
-
2.发明授权
公开(公告)号：US6036835A
公开(公告)日：2000-03-14
申请号：US936300
申请日：1997-09-24
CPC分类号： C25D5/02 , H05K3/424 , H05K3/429 , H05K2201/0329 , H05K2203/0789 , Y10S205/917
摘要： A microetch composition for a circuit board containing sulfuric acid in combination with a carboxylic acid having 2 to 6 carbon atoms, wherein the volume of the carboxylic acid is preferably greater than the amount of sulfuric acid. The method discloses the contacting of a electrically conductive polymer with the microetch composition disclosed above to expose copper underlying the electrically conductive polymer.
摘要翻译： 一种用于含有硫酸与具有2至6个碳原子的羧酸的电路板的微蚀刻组合物，其中羧酸的体积优选大于硫酸的量。 该方法公开了导电聚合物与上述公开的微蚀刻组合物的接触，以暴露导电聚合物下面的铜。
-
公开(公告)号：US5425873A
公开(公告)日：1995-06-20
申请号：US226012
申请日：1994-04-11
申请人： John J. Bladon , Wade Sonnenberg , Inna Sinitskaya , Jeffrey P. Burress , Christopher P. Esposito
发明人： John J. Bladon , Wade Sonnenberg , Inna Sinitskaya , Jeffrey P. Burress , Christopher P. Esposito
CPC分类号： H05K3/424 , C25D5/02 , H05K3/427 , H05K2201/0166 , H05K2203/0591 , H05K2203/121
摘要： A process for electroplating a substrate having a surface comprising metallic and non-metallic regions. The process is characterized by selectively forming a protective film over the metallic regions of the substrate surface and forming a sulfide coating selectively over the remaining portions of said substrate. The protective film enables selective sulfide formation only on metallic sites without formation of a sulfide coating on metallic surface regions of the substrate which would otherwise interfere with metal-to-metal bond during electroplating. Following formation of the sulfide conversion coating, the protective film is removed and the surface of the substrate electroplated.
摘要翻译： 一种用于电镀具有包括金属和非金属区域的表面的衬底的方法。 该方法的特征在于在衬底表面的金属区域上选择性地形成保护膜，并在所述衬底的剩余部分上选择性地形成硫化物涂层。 保护膜仅在金属位置上形成选择性硫化物形成，而不在基板的金属表面区域上形成硫化物涂层，否则在电镀期间会干扰金属 - 金属键。 在形成硫化物转化膜之后，除去保护膜，并将基板的表面电镀。
-
公开(公告)号：US06440642B1
公开(公告)日：2002-08-27
申请号：US09397301
申请日：1999-09-15
IPC分类号： G03F7004
CPC分类号： G03F7/038 , H01B3/30 , H01B3/40 , H05K3/4661 , H05K2201/015 , H05K2201/0154 , H05K2201/0158 , Y10S428/901 , Y10T428/31504
摘要： Low VOC, dielectric compositions suitable for use in circuit board manufacture are disclosed. Also disclosed are methods of making circuit boards using the low VOC, dielectric compositions.
摘要翻译： 公开了适用于电路板制造的低VOC介电组合物。 还公开了制造使用低VOC电介质组合物的电路板的方法。
-
5.发明授权Method for electroplating using stabilized dispersions of conductive particles 失效使用稳定的导电颗粒分散体进行电镀的方法
公开(公告)号：US6039859A
公开(公告)日：2000-03-21
申请号：US82437
申请日：1998-05-20
摘要： The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic--lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.
摘要翻译： 本发明涉及用于不同目的的导电分散体，例如用于电镀非导体的基底。 分散体的特征在于使用稳定剂量的具有重复的烯丙基氧基基团和亲水 - 亲油平衡的稳定剂超过12个。已经发现，用于本发明组合物中的稳定剂确实导致显着的导电性损失 由分散体形成的涂层。
-
6.发明授权Conductive polymer colloidal compositions with selectivity for non-conductive surfaces 有权导电聚合物胶体组合物，对非导电表面具有选择性公开(公告)号：US06899829B2
公开(公告)日：2005-05-31
申请号：US09998117
申请日：2001-11-30
摘要： A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.
摘要翻译： 导电聚合物胶体组合物，其选择性地在非导电表面上形成涂层。 导电聚合物胶体组合物由聚合物和磺酸盐掺杂剂组成。 导电聚合物胶体组合物还可以含有导电胶体颗粒，例如导电碳或金属盐颗粒，氧化剂，稳定剂和防腐剂。 可以使用导电聚合物胶体组合物来选择性地涂覆印刷线路板的非导电部分，使得可以在导电聚合物涂层上沉积均匀的金属层。 除了在导电聚合物上形成均匀的金属层之外，还提高了金属层和印刷线路板之间的粘附性。
-
公开(公告)号：US5800739A
公开(公告)日：1998-09-01
申请号：US626636
申请日：1996-04-11
摘要： The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic-lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.
摘要翻译： 本发明涉及用于不同目的的导电分散体，例如用于电镀非导体的基底。 分散体的特征在于使用稳定剂量的具有重复的烯丙基氧基基团和亲水 - 亲油平衡的稳定剂超过12个。已经发现，用于本发明组合物中的稳定剂确实导致显着的导电性损失 由分散体形成的涂层。
-
公开(公告)号：US5667662A
公开(公告)日：1997-09-16
申请号：US625126
申请日：1996-04-01
CPC分类号： C25D5/54 , H05K3/424 , Y10S205/92
摘要： A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer containing a polymeric stabilizer having repeating alkylene oxide groups and a hydrophilic--lipophilic balance of at least 10.
摘要翻译： 一种用于电镀非导电衬底的方法，包括在非导电衬底的表面上形成导电聚合物膜并在其上电解金属沉积。 导电膜是通过将所述导电聚合物从所述聚合物的水性悬浮液沉积到所述表面上而形成的，所述聚合物含有具有重复环氧烷基团和亲水 - 亲油平衡的至少10重量份的聚合物稳定剂。
-
公开(公告)号：US06773573B2
公开(公告)日：2004-08-10
申请号：US09970224
申请日：2001-10-02
申请人： David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
发明人： David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
IPC分类号： C25D338
摘要： A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
摘要翻译： 含有抑制或延缓电镀浴添加剂消耗的醇化合物的金属电镀液。 添加剂是改善电镀金属的亮度，电镀金属的物理性质，特别是相对于延展性和微投能力以及电镀液的宏投射功率的化学化合物。 抑制或延缓添加剂消耗的酒精化合物会增加镀液的使用寿命，并提高电镀工艺的效率。 可以使用含有抑制或延迟添加剂消耗的醇化合物的电镀浴来镀铜，金，银，钯，铂，钴，镉，铬，铋，铟，铑，钌和铱。
-
公开(公告)号：US06652731B2
公开(公告)日：2003-11-25
申请号：US09970271
申请日：2001-10-02
申请人： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
发明人： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC分类号： C25D338
摘要： A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
摘要翻译： 金属镀液和金属电镀工艺，含有醛类化合物，可防止或减少金属电镀浴添加剂的消耗。 金属电镀浴提供有效的电镀方法，因为不需要中断电镀工艺以补充镀液。 金属镀液可以用于镀铜，金，银，钯，钴，铬，镉，铋，铟，铑，铱和钌等金属。
-
-
-
-
-
-
-
-
-
搜索结果
31 条记录 (耗时 0.023 秒)
