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    Plating bath and method for depositing a metal layer on a substrate
    3.
    发明授权
    Plating bath and method for depositing a metal layer on a substrate 有权
    电镀浴和在基板上沉积金属层的方法

    公开(公告)号：US06773573B2

    公开(公告)日：2004-08-10

    申请号：US09970224

    申请日：2001-10-02

    申请人： David R. Gabe ,  Andrew J. Cobley ,  Leon R. Barstad ,  Mark J. Kapeckas ,  Erik Reddington ,  Wade Sonnenberg ,  Thomas Buckley

    发明人： David R. Gabe ,  Andrew J. Cobley ,  Leon R. Barstad ,  Mark J. Kapeckas ,  Erik Reddington ,  Wade Sonnenberg ,  Thomas Buckley

    IPC分类号： C25D338

    CPC分类号： C25D3/02 ,  C25D3/38 ,  H05K3/241

    摘要： A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

    摘要翻译： 含有抑制或延缓电镀浴添加剂消耗的醇化合物的金属电镀液。 添加剂是改善电镀金属的亮度，电镀金属的物理性质，特别是相对于延展性和微投能力以及电镀液的宏投射功率的化学化合物。 抑制或延缓添加剂消耗的酒精化合物会增加镀液的使用寿命，并提高电镀工艺的效率。 可以使用含有抑制或延迟添加剂消耗的醇化合物的电镀浴来镀铜，金，银，钯，铂，钴，镉，铬，铋，铟，铑，钌和铱。

    Plating bath and method for depositing a metal layer on a substrate
    5.
    发明授权
    Plating bath and method for depositing a metal layer on a substrate 有权
    电镀浴和在基板上沉积金属层的方法

    公开(公告)号：US06911068B2

    公开(公告)日：2005-06-28

    申请号：US09970171

    申请日：2001-10-02

    申请人： Andrew J. Cobley ,  Mark J. Kapeckas ,  Erik Reddington ,  Wade Sonnenberg ,  Leon R. Barstad ,  Thomas Buckley

    发明人： Andrew J. Cobley ,  Mark J. Kapeckas ,  Erik Reddington ,  Wade Sonnenberg ,  Leon R. Barstad ,  Thomas Buckley

    IPC分类号： C25D3/00 ,  C25D3/02 ,  C25D3/38 ,  C25D17/10 ,  H05K3/24 ,  C23C16/00 ,  C23C18/00 ,  C25D3/10 ,  C25D3/50

    CPC分类号： C25D3/38 ,  C25D3/02 ,  H05K3/241

    摘要： A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

    摘要翻译： 含有抑制或延缓电镀浴添加剂消耗的有机化合物的金属镀液。 添加剂是改善电镀金属的亮度，电镀金属的物理性质，特别是相对于延展性和微投能力以及电镀液的宏投射功率的化学化合物。 抑制或延缓添加剂消耗的有机化合物可增加电镀液的使用寿命，提高电镀工艺的效率。 含有抑制或延迟添加剂消耗的有机化合物的电镀液可以用于铜，金，银，钯，铂，钴，镉，铬，铋，铟，铑，钌和铱。

    Plating bath and method for depositing a metal layer on a substrate
    6.
    发明授权
    Plating bath and method for depositing a metal layer on a substrate 有权
    电镀浴和在基板上沉积金属层的方法

    公开(公告)号：US06736954B2

    公开(公告)日：2004-05-18

    申请号：US09970348

    申请日：2001-10-02

    申请人： Andrew J. Cobley ,  Mark J. Kapeckas ,  Erik Reddington ,  Wade Sonnenberg ,  Leon R. Barstad ,  Thomas Buckley

    发明人： Andrew J. Cobley ,  Mark J. Kapeckas ,  Erik Reddington ,  Wade Sonnenberg ,  Leon R. Barstad ,  Thomas Buckley

    IPC分类号： C25D356

    CPC分类号： C25D3/02 ,  C25D3/38 ,  H05K3/241 ,  H05K3/242

    摘要： A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

    摘要翻译： 金属电镀浴和金属镀层的方法，其中金属电镀浴含有预防或抑制金属电镀浴添加剂消耗的杂原子有机化合物。 金属电镀浴添加剂可以提高电镀金属的亮度，以及镀浴的延展性，微投能力和抛光力。 添加消耗抑制杂原子有机化合物的添加改善了电镀金属的物理性能以及电镀工艺的效率。 杂原子有机化合物可以含有硫，氧或氮杂原子。

    Process for treating adhesion promoted metal surfaces
    7.
    发明授权
    Process for treating adhesion promoted metal surfaces 失效
    处理粘合的方法促进金属表面

    公开(公告)号：US06752878B2

    公开(公告)日：2004-06-22

    申请号：US09956386

    申请日：2001-09-19

    申请人： Joseph R. Montano ,  Wade Sonnenberg ,  Mark J. Kapeckas

    发明人： Joseph R. Montano ,  Wade Sonnenberg ,  Mark J. Kapeckas

    IPC分类号： C23C2200

    CPC分类号： C23C22/52 ,  C23C22/83 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389

    摘要： A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous wetting agent composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.

    摘要翻译： 一种用于处理微粗化金属表面以改善金属表面和聚合物材料之间的结合的方法。 该方法包括在用粘附促进组合物形成微粗糙化转化涂覆的金属表面后，用水性润湿剂组合物对微粗糙化转化涂覆的金属表面进行后处理。 该方法可用于电路板工业中以改善多层电路板中的层之间的结合。