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    System for testing semiconductor components
    2.
    发明申请
    System for testing semiconductor components 有权
    半导体元件测试系统

    公开(公告)号：US20070007987A1

    公开(公告)日：2007-01-11

    申请号：US11516342

    申请日：2006-09-06

    Applicant: Warren Farnworth ,  Mark Tuttle

    Inventor： Warren Farnworth ,  Mark Tuttle

    IPC: G01R31/26

    CPC classification number: G01R31/2886

    Abstract: A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconnect for separation. The interconnect includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. The system can be utilized with a method that includes the steps of bonding the interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect.

    Abstract translation: 用于测试半导体部件的系统包括互连，用于将衬底对准互连的对准系统，用于将部件接合到互连的接合系统，以及用于加热组件和用于分离的互连的加热系统。 互连包括被配置用于结合到组件上并且然后与组件上的组件触点分离的互连触点。 该系统可以利用包括以下步骤的方法：将互连件连接到部件以形成结合的电连接，通过结合的电连接施加测试信号，然后将互连件与部件分离。 接合步骤可以使用冶金结合进行，并且分离步骤可以使用在互连或部件上的可焊接润湿和焊接不可润湿的金属层进行。 在分离步骤期间，可焊接润湿层被溶解，减少了粘合的电连接的粘合性，并允许部件和互连的分离。

    Interconnect for testing semiconductor components
    3.
    发明申请
    Interconnect for testing semiconductor components 有权
    互连用于测试半导体元件

    公开(公告)号：US20070001700A1

    公开(公告)日：2007-01-04

    申请号：US11516328

    申请日：2006-09-06

    Applicant: Warren Farnworth ,  Mark Tuttle

    Inventor： Warren Farnworth ,  Mark Tuttle

    IPC: G01R31/02

    CPC classification number: G01R31/2886

    Abstract: An interconnect for testing semiconductor components includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. The interconnect can be utilized with a method that includes the steps of bonding the interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect.

    Abstract translation: 用于测试半导体部件的互连件包括互连触点，其被配置用于与部件上的部件触点接合，然后分离。 互连可以利用包括以下步骤的方法：将互连件连接到部件以形成结合的电连接，通过结合的电连接施加测试信号，然后将互连与部件分离。 接合步骤可以使用冶金结合进行，并且分离步骤可以使用在互连或部件上的可焊接润湿和焊接不可润湿的金属层进行。 在分离步骤期间，可焊接润湿层被溶解，减少了粘合的电连接的粘合性，并允许部件和互连的分离。

    Method, interconnect and system for testing semiconductor components
    7.
    发明申请
    Method, interconnect and system for testing semiconductor components 有权
    用于测试半导体元件的方法，互连和系统

    公开(公告)号：US20060181298A1

    公开(公告)日：2006-08-17

    申请号：US11057500

    申请日：2005-02-14

    Applicant: Warren Farnworth ,  Mark Tuttle

    Inventor： Warren Farnworth ,  Mark Tuttle

    IPC: G01R31/26

    CPC classification number: G01R31/2886

    Abstract: A method for testing a semiconductor component includes the steps of bonding an interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect. The interconnect includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. A system includes the interconnect, an alignment system for aligning the substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconnect for separation.

    Abstract translation: 用于测试半导体部件的方法包括以下步骤：将互连件连接到部件以形成结合的电连接，通过结合的电连接施加测试信号，然后将该互连件与部件分离。 接合步骤可以使用冶金结合进行，并且分离步骤可以使用在互连或部件上的可焊接润湿和焊接不可润湿的金属层进行。 在分离步骤期间，可焊接润湿层被溶解，减少了粘合的电连接的粘合性，并允许部件和互连的分离。 互连包括被配置用于结合到组件上并且然后与组件上的组件触点分离的互连触点。 系统包括互连，用于将衬底对准互连的对准系统，用于将组件粘合到互连的接合系统，以及用于加热组件和用于分离的互连的加热系统。

    Method for testing semiconductor components using bonded electrical connections
    10.
    发明申请
    Method for testing semiconductor components using bonded electrical connections 有权

    公开(公告)号：US20070126459A1

    公开(公告)日：2007-06-07

    申请号：US11698678

    申请日：2007-01-26

    Applicant: Warren Farnworth ,  Mark Tuttle

    Inventor： Warren Farnworth ,  Mark Tuttle

    IPC: G01R31/26

    CPC classification number: G01R31/2886

    Abstract: A method for testing a semiconductor component includes the steps of bonding an interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect. The interconnect includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. A system includes the interconnect, an alignment system for aligning the substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconnect for separation.

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