公开(公告)号：US20090152259A1

公开(公告)日：2009-06-18

申请号：US12002381

申请日：2007-12-17

申请人： Wei Fan ,  Benjamin J. Olechnowicz ,  Marc Schaepkens ,  David M. Rusinko, JR. ,  Xiang Liu ,  John T. Mariner

发明人： Wei Fan ,  Benjamin J. Olechnowicz ,  Marc Schaepkens ,  David M. Rusinko, JR. ,  Xiang Liu ,  John T. Mariner

IPC分类号： H05B3/68 ,  G06F17/50 ,  G06G7/62

CPC分类号： H01L21/68735 ,  H01L21/67103 ,  H05B3/143

摘要： A layered heater structure including an electrode layer and a localized tuning method for tuning the electrode layer of a layered heater structure with high precision is provided. The localized tuning method tunes the electrode layer to its proper local resistance to minimize temperature offsets on the heater surface and thus provide a desired thermal profile that is in marked contrast to conventional, non-localized resistance tuning approaches based on thickness trimming practices, such as grinding or blasting, or resistivity adjustment, such as local heat treatment.

摘要翻译： 提供了包括电极层和用于高精度地调谐层状加热器结构的电极层的局部调谐方法的层状加热器结构。 局部调谐方法将电极层调整到其适当的局部电阻以最小化加热器表面上的温度偏移，并因此提供期望的热分布，其与基于厚度修整实践的常规非局部电阻调谐方法形成鲜明对比，例如 研磨或爆破，或电阻率调整，如局部热处理。

公开(公告)号：US07777160B2

公开(公告)日：2010-08-17

申请号：US12002381

申请日：2007-12-17

申请人： Wei Fan ,  Benjamin J. Olechnowicz ,  Marc Schaepkens ,  David M. Rusinko, Jr. ,  Xiang Liu ,  John T. Mariner

发明人： Wei Fan ,  Benjamin J. Olechnowicz ,  Marc Schaepkens ,  David M. Rusinko, Jr. ,  Xiang Liu ,  John T. Mariner

IPC分类号： H05B3/68 ,  C23C16/00

CPC分类号： H01L21/68735 ,  H01L21/67103 ,  H05B3/143

摘要： A layered heater structure including an electrode layer and a localized tuning method for tuning the electrode layer of a layered heater structure with high precision is provided. The localized tuning method tunes the electrode layer to its proper local resistance to minimize temperature offsets on the heater surface and thus provide a desired thermal profile that is in marked contrast to conventional, non-localized resistance tuning approaches based on thickness trimming practices, such as grinding or blasting, or resistivity adjustment, such as local heat treatment.

摘要翻译： 提供了包括电极层和用于高精度地调谐层状加热器结构的电极层的局部调谐方法的层状加热器结构。 局部调谐方法将电极层调整到其适当的局部电阻以最小化加热器表面上的温度偏移，并因此提供期望的热分布，其与基于厚度修整实践的常规非局部电阻调谐方法形成鲜明对比，例如 研磨或爆破，或电阻率调整，如局部热处理。

公开(公告)号：US20080066676A1

公开(公告)日：2008-03-20

申请号：US11549968

申请日：2006-10-16

申请人： John Mariner ,  Ajit Sane ,  Toshiki Ebata ,  Marc Schaepkens ,  Xiang Liu ,  Wei Fan

发明人： John Mariner ,  Ajit Sane ,  Toshiki Ebata ,  Marc Schaepkens ,  Xiang Liu ,  Wei Fan

IPC分类号： C23C16/00

CPC分类号： C23C16/4586 ,  H01L21/67103

摘要： A heating apparatus for regulating/controlling the surface temperature of a substrate is provided. At least a thermal pyrolytic graphite (TPG) layer is embedded in the heater to diffuse the temperature difference of the various components in the heating apparatus and provide temporal and spatial control of the surface temperature of the substrate, for a relatively uniform substrate temperature with the difference between the maximum and minimum temperature points on the substrate of less than 10° C.

摘要翻译： 提供一种用于调节/控制基板的表面温度的加热装置。 至少一个热解石墨（TPG）层嵌入在加热器中以扩散加热装置中的各种组分的温度差，并提供衬底的表面温度的时间和空间控制，对于相对均匀的衬底温度， 基板上最大和最小温度点之间的差值小于10°C

公开(公告)号：US07901509B2

公开(公告)日：2011-03-08

申请号：US11549968

申请日：2006-10-16

申请人： John Mariner ,  Ajit Sane ,  Toshiki Ebata ,  Marc Schaepkens ,  Xiang Liu ,  Wei Fan

发明人： John Mariner ,  Ajit Sane ,  Toshiki Ebata ,  Marc Schaepkens ,  Xiang Liu ,  Wei Fan

IPC分类号： C23C16/00 ,  H01L21/306

CPC分类号： C23C16/4586 ,  H01L21/67103

摘要： A heating apparatus for regulating/controlling the surface temperature of a substrate is provided. At least a thermal pyrolytic graphite (TPG) layer is embedded in the heater to diffuse the temperature difference of the various components in the heating apparatus and provide temporal and spatial control of the surface temperature of the substrate, for a relatively uniform substrate temperature with the difference between the maximum and minimum temperature points on the substrate of less than 10° C.

摘要翻译： 提供一种用于调节/控制基板的表面温度的加热装置。 至少一个热解石墨（TPG）层被嵌入在加热器中以扩散加热装置中的各种组分的温度差，并提供衬底的表面温度的时间和空间控制，对于相对均匀的衬底温度， 基板上最大和最小温度点之间的差值小于10°C

公开(公告)号：US20080006204A1

公开(公告)日：2008-01-10

申请号：US11554590

申请日：2006-10-31

申请人： David M. Rusinko ,  Xiang Liu ,  Benjamin J. Olechnowicz ,  Victor L. Lou ,  Jennifer Klug

发明人： David M. Rusinko ,  Xiang Liu ,  Benjamin J. Olechnowicz ,  Victor L. Lou ,  Jennifer Klug

IPC分类号： C23C14/00 ,  C23C16/00

CPC分类号： C23C16/4586 ,  C23C16/4581

摘要： A wafer processing apparatus characterized by having corrosion resistant connections for its electrical connections, gas feed-through channels, recessed areas, raised areas, MESA, through-holes such as lift-pin holes, threaded bolt holes, blind holes, and the like, with the special configurations employing connectors and fillers having excellent chemical resistant properties and optimized CTEs, i.e., having a coefficient of thermal expansion (CTE) that closely matches the CTE of the base substrate layer, the electrode(s), as well as the CTE of coating layer. In one embodiment, a filler composition comprising a glass-ceramic material is employed.

摘要翻译： 一种晶片处理装置，其特征在于具有用于其电连接，气体馈通通道，凹陷区域，凸起区域，MESA，诸如提升针孔，螺纹孔，盲孔等通孔的耐腐蚀连接， 具有采用具有优异的耐化学性能和优化的CTE的连接器和填料的特殊构造，即具有与基底衬底层，电极以及CTE的CTE密切匹配的热膨胀系数（CTE） 的涂层。 在一个实施方案中，使用包含玻璃 - 陶瓷材料的填料组合物。

公开(公告)号：US20080128067A1

公开(公告)日：2008-06-05

申请号：US11983288

申请日：2007-11-08

申请人： Haluk Sayir ,  Bob Marchiando ,  Evan Cooper ,  Xiang Liu ,  Marc Schaepkens

发明人： Haluk Sayir ,  Bob Marchiando ,  Evan Cooper ,  Xiang Liu ,  Marc Schaepkens

IPC分类号： B32B37/00 ,  B05D1/12 ,  B32B7/02 ,  B32B15/04

CPC分类号： H01L23/373 ,  C09K5/14 ,  H01L23/3733 ,  H01L23/3736 ,  H01L2924/0002 ,  Y10T156/10 ,  Y10T428/24967 ,  Y10T428/31678 ,  H01L2924/00

摘要： A heat transfer composite including a plurality of pyrolytic graphite parts and a non-carbonaceous matrix holding the pyrolytic graphite parts in a consolidated mass. In one embodiment, the heat transfer composite includes a quantity of pyrolytic graphite parts randomly distributed in the non-carbonaceous matrix. In another embodiment, the heat transfer composite includes distinct layers of pyrolytic graphite parts disposed in between the layers of sheets comprising non-carbonaceous materials. In still another embodiment, the heat transfer composite comprises a substrate containing at least one non-carbonaceous matrix containing at least one pyrolytic graphite part in a consolidated mass. The matrix is affixed to the substrate for conveying heat away from a heat source.

摘要翻译： 一种传热复合材料，其包括多个热解石墨部件和将热解石墨部件保持在固结质量中的非碳质基体。 在一个实施方案中，传热复合材料包括一定数量的随机分布在非碳质基质中的热解石墨部件。 在另一个实施方案中，传热复合材料包括布置在包含非碳质材料的片层之间的不同层的热解石墨部件。 在另一个实施方案中，传热复合材料包含含有至少一种在固结体中含有至少一个热解石墨部分的非碳质基质的基材。 基体固定在基板上，用于将热量从热源传送出去。

公开(公告)号：US20070053168A1

公开(公告)日：2007-03-08

申请号：US11555681

申请日：2006-11-01

申请人： Haluk Sayir ,  Arik Mehmet ,  Evan Cooper ,  Tunc Icoz ,  Marc Schaepkens ,  Xiang Liu

发明人： Haluk Sayir ,  Arik Mehmet ,  Evan Cooper ,  Tunc Icoz ,  Marc Schaepkens ,  Xiang Liu

IPC分类号： H05K7/20

CPC分类号： H01L23/3672 ,  B32B18/00 ,  B32B2315/02 ,  C04B35/522 ,  C04B35/645 ,  C04B2235/9607 ,  C04B2237/086 ,  C04B2237/32 ,  C04B2237/363 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/82 ,  C04B2237/84 ,  F28F3/02 ,  F28F3/022 ,  F28F3/025 ,  F28F13/18 ,  F28F21/02 ,  G06F1/20 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3735 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink assembly for an electronic device or a heat generating device(s) is constructed from an ultra-thin graphite layer. The ultra-thin graphite layer exhibits thermal conductivity which is anisotropic in nature and is greater than 500 W/m° C. in at least one plane and comprises at least a graphene layer. The ultra-thin graphite layer is structurally supported by a layer comprising at least one of a metal, a polymeric resin, a ceramic, and a mixture thereof, which is disposed on at least one surface of the graphite layer.

摘要翻译： 用于电子装置或发热装置的散热器组件由超薄石墨层构成。 超薄石墨层本质上具有各向异性的热导率，并且在至少一个平面中大于500W / m℃，并且至少包括石墨烯层。 超薄石墨层在结构上由包含金属，聚合物树脂，陶瓷及其混合物中的至少一种的层支撑，该层设置在石墨层的至少一个表面上。

公开(公告)号：US10347559B2

公开(公告)日：2019-07-09

申请号：US13049498

申请日：2011-03-16

申请人： Wei Fan ,  Xiang Liu ,  John Mariner

发明人： Wei Fan ,  Xiang Liu ,  John Mariner

IPC分类号： B32B9/00 ,  H01L23/373 ,  H01L23/36

摘要： A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.

公开(公告)号：US20100326645A1

公开(公告)日：2010-12-30

申请号：US12877412

申请日：2010-09-08

申请人： Wei Fan ,  Xiang Liu ,  John Mariner

发明人： Wei Fan ,  Xiang Liu ,  John Mariner

IPC分类号： F28F7/00

CPC分类号： B82Y30/00 ,  F28F3/02 ,  F28F21/02 ,  F28F2013/006 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/373 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermally conductive laminate comprising a first substrate, a second substrate, and a performance layer disposed between the first substrate and the second substrate. The performance layer comprising thermal pyrolytic graphite (TPG) and vias. The TPG board surface and the vias may be at least partially filled with a material comprising at least one of thermally conductive epoxy, soldering metal/alloy or brazing metal/alloy. In addition, the thermally conductive laminate may not contain a framing structure surrounding the performance layer.

摘要翻译： 一种导热层压板，包括第一基板，第二基板和设置在第一基板和第二基板之间的性能层。 性能层包括热解石墨（TPG）和通孔。 TPG板表面和通孔可以至少部分地填充有包括导热环氧树脂，焊接金属/合金或钎焊金属/合金中的至少一种的材料。 此外，导热层压体可以不包含围绕性能层的框架结构。

公开(公告)号：US20120234524A1

公开(公告)日：2012-09-20

申请号：US13049498

申请日：2011-03-16

申请人： Wei Fan ,  Xiang Liu ,  John Mariner

发明人： Wei Fan ,  Xiang Liu ,  John Mariner

IPC分类号： F28F7/00 ,  B32B15/04

CPC分类号： H01L23/373 ,  B32B9/007 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2307/30 ,  B32B2307/302 ,  B32B2307/304 ,  B32B2307/546 ,  B32B2457/00 ,  H01L23/36 ,  H01L2924/0002 ,  Y10T428/31678 ,  H01L2924/00

摘要： A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.

摘要翻译： 用于散热器的高热导率/低热膨胀导热复合材料系数和包括由这种复合材料形成的散热器的电子设备。 导热复合材料包括设置在具有低热膨胀系数的两个基板之间的高导热性层。 基板具有低的热膨胀系数和相对较高的弹性模量，并且即使对于具有高负载的导热材料的复合材料，该复合材料也显示出高导热性和低的热膨胀系数。