公开(公告)号：US09064699B2

公开(公告)日：2015-06-23

申请号：US14258704

申请日：2014-04-22

申请人： Wei-E Wang ,  Mark S. Rodder ,  Robert C. Bowen

发明人： Wei-E Wang ,  Mark S. Rodder ,  Robert C. Bowen

IPC分类号： H01L21/20 ,  H01L21/02 ,  H01L21/762

CPC分类号： H01L21/02488 ,  H01L21/02532 ,  H01L21/02538 ,  H01L21/02546 ,  H01L21/02639 ,  H01L21/02647 ,  H01L29/66795

摘要： Methods of forming semiconductor patterns including reduced dislocation defects and devices formed using such methods are provided. The methods may include forming an oxide layer on a substrate and forming a recess in the oxide layer and the substrate. The methods may further include forming an epitaxially grown semiconductor pattern in the recess that contacts a sidewall of the substrate at an interface between the oxide layer and the substrate and defines an upper surface of a void in the recess in the substrate.

摘要翻译： 提供了形成包括减少的位错缺陷的半导体图案的方法和使用这些方法形成的器件。 所述方法可以包括在衬底上形成氧化物层并在氧化物层和衬底中形成凹陷。 所述方法还可以包括在所述凹部中形成外延生长的半导体图案，所述外延生长的半导体图案在所述氧化物层和所述衬底之间的界面处接触所述衬底的侧壁，并且限定所述衬底的所述凹部中的空隙的上表面。

公开(公告)号：US20150093884A1

公开(公告)日：2015-04-02

申请号：US14258704

申请日：2014-04-22

申请人： Wei-E Wang ,  Mark S. Rodder ,  Robert C. Bowen

发明人： Wei-E Wang ,  Mark S. Rodder ,  Robert C. Bowen

IPC分类号： H01L21/02 ,  H01L21/762

CPC分类号： H01L21/02488 ,  H01L21/02532 ,  H01L21/02538 ,  H01L21/02546 ,  H01L21/02639 ,  H01L21/02647 ,  H01L29/66795

摘要： Methods of forming semiconductor patterns including reduced dislocation defects and devices formed using such methods are provided. The methods may include forming an oxide layer on a substrate and forming a recess in the oxide layer and the substrate. The methods may further include forming an epitaxially grown semiconductor pattern in the recess that contacts a sidewall of the substrate at an interface between the oxide layer and the substrate and defines an upper surface of a void in the recess in the substrate.

摘要翻译： 提供了形成包括减少的位错缺陷的半导体图案的方法和使用这些方法形成的器件。 所述方法可以包括在衬底上形成氧化物层并在氧化物层和衬底中形成凹陷。 所述方法还可以包括在所述凹部中形成外延生长的半导体图案，所述外延生长的半导体图案在所述氧化物层和所述衬底之间的界面处接触所述衬底的侧壁，并且限定所述衬底的所述凹部中的空隙的上表面。

公开(公告)号：US09793403B2

公开(公告)日：2017-10-17

申请号：US15054469

申请日：2016-02-26

申请人： Borna J. Obradovic ,  Robert C. Bowen ,  Titash Rakshit ,  Wei-E Wang ,  Mark S. Rodder

发明人： Borna J. Obradovic ,  Robert C. Bowen ,  Titash Rakshit ,  Wei-E Wang ,  Mark S. Rodder

IPC分类号： H01L29/78 ,  H01L29/786 ,  H01L29/06 ,  H01L29/10 ,  H01L29/66

CPC分类号： H01L29/7849 ,  H01L29/0673 ,  H01L29/1054 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/785 ,  H01L29/78648 ,  H01L29/78696

摘要： Multi-layer fin field effect transistor devices and methods of forming the same are provided. The devices may include a fin shaped channel structure on a substrate. The channel structure may include stressor layers stacked on the substrate and a channel layer between the stressor layers, and the stressor layers may include a semiconductor material having a wide bandgap that is sufficient to confine carriers to the channel layer and having a lattice constant different from a lattice constant of the channel layer to induce stress in the channel layer. The devices may also include source/drain regions on respective first opposing sides of the channel structure and a gate on second opposing sides of the channel structure and between the source/drain regions.

公开(公告)号：US10283638B2

公开(公告)日：2019-05-07

申请号：US15086015

申请日：2016-03-30

申请人： Jorge A. Kittl ,  Ganesh Hegde ,  Robert C. Bowen ,  Mark S. Rodder

发明人： Jorge A. Kittl ,  Ganesh Hegde ,  Robert C. Bowen ,  Mark S. Rodder

IPC分类号： H01L21/336 ,  H01L29/78 ,  H01L29/06 ,  H01L29/66

摘要： A stack for a semiconductor device and a method for making the stack are disclosed. The stack comprises a plurality of sacrificial layers in which each sacrificial layer comprises a first lattice parameter; and at least one channel layer comprising a second lattice parameter that is different from the first lattice parameter and in which each channel layer is disposed between and in contact with two sacrificial layers. The stack is formed on an underlayer in which a sacrificial layer is in contact with the underlayer. The underlayer comprises a third lattice parameter that substantially matches the lattice parameter that the plurality of sacrificial layers and the at least one channel layer would have if the plurality of sacrificial layers and the at least one channel layer were was allow to relax coherently.

公开(公告)号：US20150243756A1

公开(公告)日：2015-08-27

申请号：US14698402

申请日：2015-04-28

申请人： Borna J. Obradovic ,  Robert C. Bowen ,  Mark S. Rodder

发明人： Borna J. Obradovic ,  Robert C. Bowen ,  Mark S. Rodder

IPC分类号： H01L29/66

CPC分类号： H01L29/66522 ,  H01L21/3086 ,  H01L21/823431 ,  H01L21/823821 ,  H01L29/165 ,  H01L29/66795 ,  H01L29/7848 ,  H01L29/785

摘要： Methods of forming a finFET are provided. The methods may include forming a fin-shaped channel region including indium (In) on a substrate, forming a deep source/drain region adjacent to the channel region on the substrate and forming a source/drain extension region between the channel region and the deep source/drain region. Opposing sidewalls of the source/drain extension region may contact the channel region and the deep source/drain region, respectively, and the source/drain extension region may include InyGa1−yAs, and y is in a range of about 0.3 to about 0.5.

摘要翻译： 提供了形成finFET的方法。 所述方法可以包括在衬底上形成包括铟（In）的鳍状沟道区域，形成与衬底上的沟道区相邻的深源极/漏极区域，并在沟道区域和深度之间形成源极/漏极延伸区域 源/漏区。 源极/漏极延伸区域的相对侧壁可以分别接触沟道区域和深源极/漏极区域，并且源极/漏极延伸区域可以包括In y Ga 1-y As，y在约0.3至约0.5的范围内。

公开(公告)号：US20160163796A1

公开(公告)日：2016-06-09

申请号：US14952152

申请日：2015-11-25

申请人： Borna J. Obradovic ,  Ryan Hatcher ,  Robert C. Bowen ,  Mark S. Rodder

发明人： Borna J. Obradovic ,  Ryan Hatcher ,  Robert C. Bowen ,  Mark S. Rodder

IPC分类号： H01L29/06 ,  H01L29/78 ,  H01L29/16

CPC分类号： H01L29/0676 ,  B82B3/0014 ,  B82Y10/00 ,  H01L29/0642 ,  H01L29/0653 ,  H01L29/0665 ,  H01L29/16 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/66742 ,  H01L29/785 ,  H01L29/78618 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696

摘要： A device may include a nanosheet field effect transistor (FET) that may include a substrate, a well that is doped with impurities at a surface of the substrate, a channel including a plurality of stacked nanosheets, a gate, a conductive material, and an isolation layer. Ones of the plurality of stacked nanosheets may include a semiconductor material that may be doped with impurities of the same conductivity type as the impurities of the well. The conductive material may be adjacent the plurality of nanosheets and may electrically connect ones of the plurality of nanosheets to the well. The isolation layer may electrically insulate the well from the workfunction metal.

摘要翻译： 器件可以包括纳米片状场效应晶体管（FET），其可以包括衬底，在衬底的表面上掺杂有杂质的阱，包括多个堆叠的纳米片，沟道，导电材料和 隔离层 多个堆叠的纳米片的一部分可以包括半导体材料，其可掺杂与阱的杂质相同的导电类型的杂质。 导电材料可以与多个纳米片相邻，并且可以将多个纳米片中的一个纳米片电连接到该孔。 隔离层可以将孔与功函数金属电绝缘。

公开(公告)号：US20150145003A1

公开(公告)日：2015-05-28

申请号：US14534453

申请日：2014-11-06

申请人： Mark S. Rodder ,  Borna J. Obradovic ,  Robert C. Bowen

发明人： Mark S. Rodder ,  Borna J. Obradovic ,  Robert C. Bowen

IPC分类号： H01L29/78 ,  H01L27/092 ,  H01L27/12 ,  H01L29/66 ,  H01L29/165

CPC分类号： H01L29/785 ,  H01L21/845 ,  H01L27/1211 ,  H01L29/66795 ,  H01L29/7848

摘要： FinFET semiconductor devices and methods of forming the same are provided. The finFET semiconductor devices may include an insulator layer, a bottom semiconductor layer on the insulator layer, a channel fin on the bottom semiconductor layer, a source region on the bottom semiconductor layer and adjacent a first side of the channel fin, and a drain region on the bottom semiconductor layer and adjacent a second side of the channel fin opposite the first side.

摘要翻译： 提供FinFET半导体器件及其形成方法。 finFET半导体器件可以包括绝缘体层，绝缘体层上的底部半导体层，底部半导体层上的沟道鳍片，底部半导体层上的源极区域和与沟道鳍片的第一侧相邻的源区域，以及漏极区域 在底部半导体层上并且与第一侧相对的沟槽的第二侧相邻。

公开(公告)号：US20150093868A1

公开(公告)日：2015-04-02

申请号：US14489965

申请日：2014-09-18

申请人： Borna J. Obradovic ,  Robert C. Bowen ,  Mark S. Rodder

发明人： Borna J. Obradovic ,  Robert C. Bowen ,  Mark S. Rodder

IPC分类号： H01L29/66 ,  H01L29/161 ,  H01L29/165 ,  H01L21/308 ,  H01L21/265 ,  H01L21/266 ,  H01L21/306 ,  H01L29/16 ,  H01L21/02

CPC分类号： H01L29/66795 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/266 ,  H01L21/30604 ,  H01L21/308 ,  H01L21/3086 ,  H01L21/823431 ,  H01L21/823821 ,  H01L29/16 ,  H01L29/161 ,  H01L29/165 ,  H01L29/7848 ,  H01L29/785

摘要： Integrated circuit devices including fin field-effect transistors (finFETs) and methods of forming the same are provided. The methods may include forming a fin-shaped channel region including germanium on a substrate and forming a source/drain region adjacent the channel region on the substrate. The methods may further include forming a barrier layer contacting sidewalls of the channel region and the source/drain region, and the barrier layer may include SixGe1-x, and x may be in a range of about 0.05 to about 0.2.

摘要翻译： 提供包括鳍状场效应晶体管（finFET）的集成电路器件及其形成方法。 所述方法可以包括在衬底上形成包括锗的鳍状沟道区，并形成与衬底上的沟道区相邻的源极/漏极区。 所述方法还可以包括形成与沟道区域和源极/漏极区域的侧壁接触的阻挡层，并且阻挡层可以包括SixGe1-x，x可以在约0.05至约0.2的范围内。

公开(公告)号：US09178045B2

公开(公告)日：2015-11-03

申请号：US14489965

申请日：2014-09-18

申请人： Borna J. Obradovic ,  Robert C. Bowen ,  Mark S. Rodder

发明人： Borna J. Obradovic ,  Robert C. Bowen ,  Mark S. Rodder

IPC分类号： H01L29/66 ,  H01L29/16 ,  H01L21/265 ,  H01L21/266 ,  H01L21/306 ,  H01L21/308 ,  H01L21/82 ,  H01L29/161 ,  H01L29/165 ,  H01L21/8234 ,  H01L21/8238 ,  H01L29/78

CPC分类号： H01L29/66795 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/266 ,  H01L21/30604 ,  H01L21/308 ,  H01L21/3086 ,  H01L21/823431 ,  H01L21/823821 ,  H01L29/16 ,  H01L29/161 ,  H01L29/165 ,  H01L29/7848 ,  H01L29/785

摘要： Integrated circuit devices including fin field-effect transistors (finFETs) and methods of forming the same are provided. The methods may include forming a fin-shaped channel region including germanium on a substrate and forming a source/drain region adjacent the channel region on the substrate. The methods may further include forming a barrier layer contacting sidewalls of the channel region and the source/drain region, and the barrier layer may include SixGe1-x, and x may be in a range of about 0.05 to about 0.2.

摘要翻译： 提供包括鳍状场效应晶体管（finFET）的集成电路器件及其形成方法。 所述方法可以包括在衬底上形成包括锗的鳍状沟道区，并形成与衬底上的沟道区相邻的源极/漏极区。 所述方法还可以包括形成与沟道区域和源极/漏极区域的侧壁接触的阻挡层，并且阻挡层可以包括SixGe1-x，x可以在约0.05至约0.2的范围内。

公开(公告)号：US20150295084A1

公开(公告)日：2015-10-15

申请号：US14729652

申请日：2015-06-03

申请人： Borna J. Obradovic ,  Robert C. Bowen ,  Mark S. Rodder

发明人： Borna J. Obradovic ,  Robert C. Bowen ,  Mark S. Rodder

IPC分类号： H01L29/78 ,  H01L29/49 ,  H01L29/423

CPC分类号： H01L29/7845 ,  B82Y40/00 ,  H01L29/0673 ,  H01L29/20 ,  H01L29/42392 ,  H01L29/517 ,  H01L29/775 ,  H01L29/785 ,  H01L29/78681 ,  H01L29/78696

摘要： A field effect transistor includes a body layer having a strained crystalline semiconductor channel region, and a gate stack on the channel region. The gate stack includes a crystalline semiconductor gate layer that is lattice mismatched with the channel region, and a crystalline gate dielectric layer between the gate layer and the channel region. Related devices and fabrication methods are also discussed.

摘要翻译： 场效应晶体管包括具有应变晶体半导体沟道区的主体层，以及沟道区上的栅叠层。 栅极堆叠包括与沟道区域晶格失配的晶体半导体栅极层，以及栅极层和沟道区域之间的晶体栅极介电层。 还讨论了相关设备和制造方法。