Method for forming bit lines for semiconductor devices
    1.
    发明授权
    Method for forming bit lines for semiconductor devices 有权
    用于形成半导体器件的位线的方法

    公开(公告)号:US07811915B2

    公开(公告)日:2010-10-12

    申请号:US12048549

    申请日:2008-03-14

    IPC分类号: H01L21/22

    摘要: A method for forming a semiconductor device includes forming a first dielectric layer over a first portion of a substrate, forming a charge storage layer over the first dielectric layer and etching a trench in the charge storage layer and the first dielectric layer, where the trench extends to the substrate. The method also includes implanting n-type impurities into the substrate to form an n-type region having a first depth and a first width and implanting p-type impurities into the substrate after implanting the n-type impurities, the p-type impurities forming a p-type region having a second depth and a second width. The method further includes forming a second dielectric layer over the charge storage layer and forming a control gate over the second dielectric layer.

    摘要翻译: 一种形成半导体器件的方法包括在衬底的第一部分上形成第一介电层,在第一介电层上形成电荷存储层,并蚀刻电荷存储层和第一介电层中的沟槽,其中沟槽延伸 到基底。 该方法还包括将n型杂质注入到衬底中以形成具有第一深度和第一宽度的n型区域,并且在植入n型杂质之后将p型杂质注入到衬底中,形成p型杂质 具有第二深度和第二宽度的p型区域。 该方法还包括在电荷存储层上形成第二电介质层,并在第二电介质层上形成控制栅极。

    Method for forming bit lines for semiconductor devices
    3.
    发明授权
    Method for forming bit lines for semiconductor devices 有权
    用于形成半导体器件的位线的方法

    公开(公告)号:US07972948B2

    公开(公告)日:2011-07-05

    申请号:US12880541

    申请日:2010-09-13

    IPC分类号: H01L21/22

    摘要: A memory device includes a number of memory cells and a number of bit lines. Each of the bit lines includes a first region having a first width and a first depth and a second region having a second width and a second depth, where the first width is less than the second width. The first region may include an n-type impurity and the second region may include a p-type impurity.

    摘要翻译: 存储器件包括多个存储器单元和多个位线。 每个位线包括具有第一宽度和第一深度的第一区域和具有第二宽度和第二深度的第二区域,其中第一宽度小于第二宽度。 第一区域可以包括n型杂质,第二区域可以包括p型杂质。

    METHOD FOR FORMING BIT LINES FOR SEMICONDUCTOR DEVICES
    4.
    发明申请
    METHOD FOR FORMING BIT LINES FOR SEMICONDUCTOR DEVICES 有权
    用于形成半导体器件的位线的方法

    公开(公告)号:US20100330762A1

    公开(公告)日:2010-12-30

    申请号:US12880541

    申请日:2010-09-13

    IPC分类号: H01L21/336

    摘要: A memory device includes a number of memory cells and a number of bit lines. Each of the bit lines includes a first region having a first width and a first depth and a second region having a second width and a second depth, where the first width is less than the second width. The first region may include an n-type impurity and the second region may include a p-type impurity,

    摘要翻译: 存储器件包括多个存储器单元和多个位线。 每个位线包括具有第一宽度和第一深度的第一区域和具有第二宽度和第二深度的第二区域,其中第一宽度小于第二宽度。 第一区域可以包括n型杂质,第二区域可以包括p型杂质,

    Hard mask spacer for sublithographic bitline
    5.
    发明授权
    Hard mask spacer for sublithographic bitline 有权
    用于亚光刻位线的硬掩模垫片

    公开(公告)号:US06962849B1

    公开(公告)日:2005-11-08

    申请号:US10729732

    申请日:2003-12-05

    CPC分类号: H01L27/115 H01L27/11521

    摘要: A technique for forming at least part of an array of a dual bit memory core is disclosed. Spacers are utilized in the formation process to reduce the size of buried bitlines in the memory, which is suitable for use in storing data for computers and the like. The smaller (e.g., narrower) bitlines facilitate increased packing densities while maintaining an effective channel length between the bitlines. The separation between the bitlines allows dual bits that are stored above the channel within a charge trapping layer to remain sufficiently separated so as to not interfere with one another. In this manner, one bit can be operated on (e.g., for read, write or erase operations) without substantially or adversely affecting the other bit. Additionally, bit separation is preserved and leakage currents, cross talk, as well as other adverse effects that can result from narrow channels are mitigated, and the memory device is allowed to operate as desired.

    摘要翻译: 公开了一种用于形成双位存储器核心的阵列的至少一部分的技术。 在形成过程中使用间隔物来减小存储器中的掩埋位线的尺寸,这适用于存储用于计算机等的数据。 较小(例如较窄)的位线有助于增加打包密度,同时保持位线之间的有效通道长度。 位线之间的间隔允许存储在电荷俘获层内的通道上方的双位保持充分分离,以便彼此不干扰。 以这种方式,一个位可以被操作(例如,用于读取,写入或擦除操作)而基本上或不利地影响另一个位。 此外,保留位分离,并且减轻了可能由窄通道产生的漏电流,串扰以及其他不利影响,并且允许存储器件根据需要进行操作。

    Narrow bitline using Safier for mirrorbit
    6.
    发明授权
    Narrow bitline using Safier for mirrorbit 有权
    使用Safier进行镜像位的窄位线

    公开(公告)号:US06872609B1

    公开(公告)日:2005-03-29

    申请号:US10755430

    申请日:2004-01-12

    CPC分类号: H01L27/11568 H01L27/115

    摘要: A technique for forming at least part of an array of a dual bit memory core is disclosed. A Safier material is utilized in the formation process to reduce the size of buried bitlines in the memory, which is suitable for use in storing data for computers and the like. The smaller (e.g., narrower) bitlines facilitate increased packing densities while maintaining an effective channel length between the bitlines. The separation between the bitlines allows dual bits that are stored above the channel within a charge trapping layer to remain sufficiently separated so as to not interfere with one another. In this manner, one bit can be operated on (e.g., for read, write or erase operations) without substantially or adversely affecting the other bit. Additionally, bit separation is preserved and leakage currents, cross talk, as well as other adverse effects that can result from narrow channels are mitigated, and the memory device is allowed to operate as desired.

    摘要翻译: 公开了一种用于形成双位存储器核心的阵列的至少一部分的技术。 在形成过程中采用Safier材料以减小存储器中的埋置位线的尺寸,其适用于存储用于计算机等的数据。 较小(例如较窄)的位线有助于增加打包密度,同时保持位线之间的有效通道长度。 位线之间的间隔允许存储在电荷俘获层内的通道上方的双位保持充分分离,以便彼此不干扰。 以这种方式,一个位可以被操作(例如,用于读取,写入或擦除操作)而基本上或不利地影响另一个位。 此外,保留位分离,并且减轻了可能由窄通道产生的漏电流,串扰以及其他不利影响,并且允许存储器件根据需要进行操作。

    Bit line implant
    9.
    发明授权
    Bit line implant 有权
    位线植入

    公开(公告)号:US07432178B2

    公开(公告)日:2008-10-07

    申请号:US11254769

    申请日:2005-10-21

    IPC分类号: H01L21/04

    CPC分类号: H01L27/11568 H01L27/115

    摘要: A method for performing a bit line implant is disclosed. The method includes forming a group of structures on an oxide-nitride-oxide stack of a semiconductor device. Each structure of the group of structures includes a polysilicon portion and a hard mask portion. A first structure of the group of structures is separated from a second structure of the group of structures by less than 100 nanometers. The method further includes using the first structure and the second structure to isolate a portion of the semiconductor device for the bit line implant.

    摘要翻译: 公开了一种用于执行位线植入的方法。 该方法包括在半导体器件的氧化物 - 氮化物 - 氧化物堆叠上形成一组结构。 该组结构的每个结构包括多晶硅部分和硬掩模部分。 该组结构的第一结构与该组结构的第二结构分开小于100纳米。 该方法还包括使用第一结构和第二结构来隔离位线植入物的半导体器件的一部分。