METHOD OF MANUFACTURING A PERPENDICULAR MAGNETIC WRITE HEAD WITH STEPPED TRAILING MAGNETIC SHIELD WITH ELECTRICAL LAPPING GUIDE CONTROL
    1.
    发明申请
    METHOD OF MANUFACTURING A PERPENDICULAR MAGNETIC WRITE HEAD WITH STEPPED TRAILING MAGNETIC SHIELD WITH ELECTRICAL LAPPING GUIDE CONTROL 有权
    使用带电导线控制的步进式磁屏蔽制造全磁性写磁头的方法

    公开(公告)号:US20090152235A1

    公开(公告)日:2009-06-18

    申请号:US11956292

    申请日:2007-12-13

    IPC分类号: B44C1/22

    摘要: A method for manufacturing a magnetic write head having a stepped trailing shield. The stepped trailing shield is formed by forming a non-magnetic bump over a write pole prior to electroplating a wrap-around magnetic shield. The method allows the location of the front edge of the bump relative to the back edge of the wrap-around shield to be monitored by measuring the electrical resistance of an electrical lapping guide formed concurrently with these features. This concurrent formation of a lapping guide can be used to define the relative location of other features as well, such as the location of a back edge of a wrap-around shield relative to a flare point of a write pole.

    摘要翻译: 一种用于制造具有阶梯式后挡板的磁写头的方法。 在电镀环绕磁屏蔽之前,通过在写入极上形成非磁性凸块来形成阶梯式后屏蔽。 该方法允许通过测量与这些特征同时形成的电研磨引导件的电阻来监测凸块的前边缘相对于环绕护罩的后边缘的位置。 研磨引导件的这种同时形成也可以用于限定其它特征的相对位置,例如环绕屏蔽件的后边缘相对于写入极点的扩张点的位置。

    Method of manufacturing a perpendicular magnetic write head with stepped trailing magnetic shield with electrical lapping guide control
    2.
    发明授权
    Method of manufacturing a perpendicular magnetic write head with stepped trailing magnetic shield with electrical lapping guide control 有权
    使用带电研磨导向器控制的具有阶梯式后跟磁屏蔽的垂直磁性写头的制造方法

    公开(公告)号:US07990651B2

    公开(公告)日:2011-08-02

    申请号:US11956292

    申请日:2007-12-13

    IPC分类号: G11B5/187

    摘要: A method for manufacturing a magnetic write head having a stepped trailing shield. The stepped trailing shield is formed by forming a non-magnetic bump over a write pole prior to electroplating a wrap-around magnetic shield. The method allows the location of the front edge of the bump relative to the back edge of the wrap-around shield to be monitored by measuring the electrical resistance of an electrical lapping guide formed concurrently with these features. This concurrent formation of a lapping guide can be used to define the relative location of other features as well, such as the location of a back edge of a wrap-around shield relative to a flare point of a write pole.

    摘要翻译: 一种用于制造具有阶梯式后挡板的磁写头的方法。 在电镀环绕磁屏蔽之前,通过在写入极上形成非磁性凸块来形成阶梯式后屏蔽。 该方法允许通过测量与这些特征同时形成的电研磨引导件的电阻来监测凸块的前边缘相对于环绕护罩的后边缘的位置。 研磨引导件的这种同时形成也可以用于限定其它特征的相对位置,例如环绕屏蔽件的后边缘相对于写入极点的扩张点的位置。

    Method of multi-angled bump processing for magnetic pole fabrication and systems thereof
    5.
    发明授权
    Method of multi-angled bump processing for magnetic pole fabrication and systems thereof 有权
    用于磁极制造的多角度凸块加工方法及其系统

    公开(公告)号:US08085497B2

    公开(公告)日:2011-12-27

    申请号:US12341834

    申请日:2008-12-22

    IPC分类号: G11B5/127

    CPC分类号: G11B5/3116 G11B5/3163

    摘要: A system according to one embodiment includes a magnetic pole; a bump structure above the pole, the bump structure having a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the pole, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the pole, wherein the second angle is greater than the first angle; and a shield above the bump structure. A method according to one embodiment includes forming a bump layer above a magnetic pole; removing a portion of the bump layer for forming a step therein; and milling the bump layer for defining thereon a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the bump layer, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the bump layer, wherein the second angle is greater than the first angle.

    摘要翻译: 根据一个实施例的系统包括磁极; 所述凸起结构具有从所述极的沉积平面以1°至89°之间的第一角度定向的第一表面,并且所述第一表面以与所述极的沉积的平面成1°至89°之间的第二角度定向 所述极的沉积平面,其中所述第二角度大于所述第一角度; 和凸块结构之上的屏蔽。 根据一个实施例的方法包括在磁极上形成凸起层; 去除所述凸起层的一部分以在其中形成台阶; 并且研磨所述凸起层,以在其上限定从凸起层的沉积平面以1°至89°之间的第一角度定向的第一表面,以及从该平面以1°至89°之间的第二角度定向的第二表面 所述凸起层的沉积,其中所述第二角度大于所述第一角度。

    METHOD OF MULTI-ANGLED BUMP PROCESSING FOR MAGNETIC POLE FABRICATION AND SYSTEMS THEREOF
    6.
    发明申请
    METHOD OF MULTI-ANGLED BUMP PROCESSING FOR MAGNETIC POLE FABRICATION AND SYSTEMS THEREOF 有权
    用于磁极制造及其系统的多重保护加工方法

    公开(公告)号:US20100157474A1

    公开(公告)日:2010-06-24

    申请号:US12341834

    申请日:2008-12-22

    IPC分类号: G11B5/127

    CPC分类号: G11B5/3116 G11B5/3163

    摘要: A system according to one embodiment includes a magnetic pole; a bump structure above the pole, the bump structure having a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the pole, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the pole, wherein the second angle is greater than the first angle; and a shield above the bump structure. A method according to one embodiment includes forming a bump layer above a magnetic pole; removing a portion of the bump layer for forming a step therein; and milling the bump layer for defining thereon a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the bump layer, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the bump layer, wherein the second angle is greater than the first angle.

    摘要翻译: 根据一个实施例的系统包括磁极; 所述凸起结构具有从所述极的沉积平面以1°至89°之间的第一角度定向的第一表面,并且所述第一表面以与所述极的沉积的平面成1°至89°之间的第二角度定向 所述极的沉积平面,其中所述第二角度大于所述第一角度; 和凸块结构之上的屏蔽。 根据一个实施例的方法包括在磁极上形成凸起层; 去除所述凸起层的一部分以在其中形成台阶; 并且研磨所述凸起层,以在其上限定从凸起层的沉积平面以1°至89°之间的第一角度定向的第一表面,以及从该平面以1°至89°之间的第二角度定向的第二表面 所述凸起层的沉积,其中所述第二角度大于所述第一角度。

    Method of manufacturing a perpendicular magnetic write head having a wrap-around trailing shield and a concave trailing edge main pole
    10.
    发明授权
    Method of manufacturing a perpendicular magnetic write head having a wrap-around trailing shield and a concave trailing edge main pole 有权
    制造具有环绕后挡板和凹后缘主极的垂直磁写头的方法

    公开(公告)号:US07506431B2

    公开(公告)日:2009-03-24

    申请号:US11744022

    申请日:2007-05-03

    IPC分类号: G11B5/127 H04R31/00

    摘要: A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method allows the write head to be formed with a write pole having a concave trailing edge. The method further allows the amount of concavity of the trailing edge to be accurately and carefully controlled both within a wafer and between wafers. A write pole is formed using a mask that includes a hard mask, a RIEable layer and an endpoint detection layer. A layer of non-magnetic material (ALD layer) is deposited, and then, an ion milling process is used to remove a portion of the ALD layer disposed over the write pole and mask. A reactive ion etch process is performed to remove the RIEable layer leaving the ALD layer to form non-magnetic side walls with upper portions that extend above the write pole. Another ion milling is then performed, preferably at an angle relative to normal, such that shadowing from the upper portions of the non-magnetic side walls causes the ion milling to form the write pole with a concave trailing edge.

    摘要翻译: 一种用于制造用于垂直磁记录的磁写头的方法。 该方法允许写头形成有具有凹形后缘的写入极。 该方法还允许在晶片内和晶片之间精确地和仔细地控制后缘的凹陷量。 使用包括硬掩模,RIEable层和端点检测层的掩模形成写入极。 沉积一层非磁性材料(ALD层),然后使用离子铣削工艺去除设置在写入极和掩模上的ALD层的一部分。 执行反应离子蚀刻工艺以去除离开ALD层的RIEable层以形成非磁性侧壁,其上部在写极上方延伸。 然后进行另一个离子铣削,优选以相对于法线成一角度,使得来自非磁性侧壁的上部的阴影使得离子铣削形成具有凹形后缘的写入极。