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1.发明申请公开(公告)号：US20090152235A1
公开(公告)日：2009-06-18
申请号：US11956292
申请日：2007-12-13
IPC分类号： B44C1/22
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3146 , G11B5/315 , G11B5/3166 , G11B5/3169
摘要： A method for manufacturing a magnetic write head having a stepped trailing shield. The stepped trailing shield is formed by forming a non-magnetic bump over a write pole prior to electroplating a wrap-around magnetic shield. The method allows the location of the front edge of the bump relative to the back edge of the wrap-around shield to be monitored by measuring the electrical resistance of an electrical lapping guide formed concurrently with these features. This concurrent formation of a lapping guide can be used to define the relative location of other features as well, such as the location of a back edge of a wrap-around shield relative to a flare point of a write pole.
摘要翻译： 一种用于制造具有阶梯式后挡板的磁写头的方法。 在电镀环绕磁屏蔽之前，通过在写入极上形成非磁性凸块来形成阶梯式后屏蔽。 该方法允许通过测量与这些特征同时形成的电研磨引导件的电阻来监测凸块的前边缘相对于环绕护罩的后边缘的位置。 研磨引导件的这种同时形成也可以用于限定其它特征的相对位置，例如环绕屏蔽件的后边缘相对于写入极点的扩张点的位置。
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2.发明授权Method of manufacturing a perpendicular magnetic write head with stepped trailing magnetic shield with electrical lapping guide control 有权使用带电研磨导向器控制的具有阶梯式后跟磁屏蔽的垂直磁性写头的制造方法公开(公告)号：US07990651B2
公开(公告)日：2011-08-02
申请号：US11956292
申请日：2007-12-13
IPC分类号： G11B5/187
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3146 , G11B5/315 , G11B5/3166 , G11B5/3169
摘要： A method for manufacturing a magnetic write head having a stepped trailing shield. The stepped trailing shield is formed by forming a non-magnetic bump over a write pole prior to electroplating a wrap-around magnetic shield. The method allows the location of the front edge of the bump relative to the back edge of the wrap-around shield to be monitored by measuring the electrical resistance of an electrical lapping guide formed concurrently with these features. This concurrent formation of a lapping guide can be used to define the relative location of other features as well, such as the location of a back edge of a wrap-around shield relative to a flare point of a write pole.
摘要翻译： 一种用于制造具有阶梯式后挡板的磁写头的方法。 在电镀环绕磁屏蔽之前，通过在写入极上形成非磁性凸块来形成阶梯式后屏蔽。 该方法允许通过测量与这些特征同时形成的电研磨引导件的电阻来监测凸块的前边缘相对于环绕护罩的后边缘的位置。 研磨引导件的这种同时形成也可以用于限定其它特征的相对位置，例如环绕屏蔽件的后边缘相对于写入极点的扩张点的位置。
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3.发明授权Method and apparatus for integrating a stair notch and a gap bump at a pole tip in a write head 失效用于将台阶缺口和间隙凸起集成在写头中的极尖处的方法和装置公开(公告)号：US07536774B2
公开(公告)日：2009-05-26
申请号：US11399821
申请日：2006-04-07
申请人： Daniel Wayne Bedell , Wen-Chien David Hsiao , Ming Jiang , Hieu Lam , Kim Y. Lee , Jyh-Shuey Lo , Aron Pentek
发明人： Daniel Wayne Bedell , Wen-Chien David Hsiao , Ming Jiang , Hieu Lam , Kim Y. Lee , Jyh-Shuey Lo , Aron Pentek
IPC分类号： G11B5/127
CPC分类号： G11B5/3163 , Y10T29/49043
摘要： A method and apparatus for integrating a stair notch and a gap bump at a pole tip in a write head is disclosed. A protective plated layer is formed over the bump to prevent the bump form being damaged during formation of the notch at the pole tip. The flux from the second pole outside of the track will be effectively channeled to the first pole piece under the alumina bump.
摘要翻译： 公开了一种用于将写入头中的极尖处的台阶缺口和间隙凸起集成的方法和装置。 在凸起之上形成保护镀层，以防止在极尖处形成凹口期间凸起形状被损坏。 来自轨道外部的第二极的磁通将有效地引导到氧化铝凸块下方的第一极靴。
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4.发明授权公开(公告)号：US07536777B2
公开(公告)日：2009-05-26
申请号：US11595764
申请日：2006-11-10
申请人： Hieu Lam , Patrick Rush Webb , Yi Zheng
发明人： Hieu Lam , Patrick Rush Webb , Yi Zheng
CPC分类号： C25D5/022 , C23C28/021 , C23C28/023 , C23C28/04 , C23C28/343 , G11B5/112 , G11B5/1278 , G11B5/3146 , G11B5/315 , G11B5/3163 , Y10T29/49039 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.
摘要翻译： 公开了用于制造垂直薄膜头的方法和结构。 在沉积屏蔽结构之前，利用具有双层结构的封盖种子层，在屏蔽电镀之前，不需要沉积，然后去除传统的无机抗反射涂层，从而提高光致抗蚀剂粘附性和电镀屏蔽粘附性。
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5.发明授权公开(公告)号：US07631417B2
公开(公告)日：2009-12-15
申请号：US11595765
申请日：2006-11-10
申请人： Hieu Lam , Patrick Rush Webb , Yi Zheng
发明人： Hieu Lam , Patrick Rush Webb , Yi Zheng
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/314 , G11B5/3163 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, seed layers having anti-reflective properties are utilized, eliminating the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.
摘要翻译： 公开了用于制造垂直薄膜头的方法和结构。 在沉积屏蔽结构之前，利用具有抗反射特性的种子层，消除了在屏蔽电镀之前沉积，然后去除传统的无机抗反射涂层的需要。
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6.发明申请公开(公告)号：US20080113090A1
公开(公告)日：2008-05-15
申请号：US11595765
申请日：2006-11-10
申请人： Hieu Lam , Patrick Rush Webb , Yi Zheng
发明人： Hieu Lam , Patrick Rush Webb , Yi Zheng
IPC分类号： B05D5/12
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/314 , G11B5/3163 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： Methods and structures for the fabrication of wrap around and trailing shield structures are disclosed. Seed layers having anti-reflective properties are utilized, eliminating the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.
摘要翻译： 公开了用于制造包裹和后挡板结构的方法和结构。 利用具有抗反射性能的种子层，消除了在屏蔽电镀之前沉积，然后去除传统的无机抗反射涂层的需要。
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7.发明申请公开(公告)号：US20080110761A1
公开(公告)日：2008-05-15
申请号：US11595764
申请日：2006-11-10
申请人： Hieu Lam , Patrick Rush Webb , Yi Zheng
发明人： Hieu Lam , Patrick Rush Webb , Yi Zheng
IPC分类号： C25D3/56
CPC分类号： C25D5/022 , C23C28/021 , C23C28/023 , C23C28/04 , C23C28/343 , G11B5/112 , G11B5/1278 , G11B5/3146 , G11B5/315 , G11B5/3163 , Y10T29/49039 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： Methods and structures for the fabrication of wrap around and trailing shield structures are disclosed. Capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.
摘要翻译： 公开了用于制造包裹和后挡板结构的方法和结构。 利用具有双层结构的覆盖种子层，提高光致抗蚀剂粘附性和镀层屏蔽粘附性，而不需要在屏蔽电镀之前沉积，然后除去传统的无机抗反射涂层。
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公开(公告)号：US20130001188A1
公开(公告)日：2013-01-03
申请号：US13174321
申请日：2011-06-30
申请人： David Kuo , Michael R. Feldbaum , Paritosh Rajora , Hieu Lam
发明人： David Kuo , Michael R. Feldbaum , Paritosh Rajora , Hieu Lam
CPC分类号： H01L43/12 , Y10T428/24628
摘要： The embodiments disclose a method to protect magnetic bits during carbon field planarization, including depositing a stop layer upon magnetic bits and magnetic film of a patterned stack, depositing a carbon fill layer on the stop layer and using the stop layer during planarization and etch-back of the carbon field to protect the patterned stack magnetic bits during the carbon field planarization.
摘要翻译： 这些实施例公开了一种在碳场平坦化期间保护磁头的方法，包括在图案化堆叠的磁头和磁性膜上沉积停止层，在停止层上沉积碳填充层并在平坦化和回蚀刻期间使用停止层 的碳场以在碳场平坦化期间保护图案化的堆叠磁性位。
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9.发明申请Methods Of Making Magnetic Write Heads With Use Of A Resist Channel Shrinking Solution Having Corrosion Inhibitors 失效使用具有腐蚀抑制剂的抗蚀剂通道收缩溶液制造磁性写头的方法公开(公告)号：US20100107402A1
公开(公告)日：2010-05-06
申请号：US12685455
申请日：2010-01-11
申请人： Christian Rene Bonhote , Jila Tabib , Dennis Richard Mckean , Daniel Wayne Bedell , Jyh-Shuey Lo , Hieu Lam , Kim Y. Lee
发明人： Christian Rene Bonhote , Jila Tabib , Dennis Richard Mckean , Daniel Wayne Bedell , Jyh-Shuey Lo , Hieu Lam , Kim Y. Lee
CPC分类号： G11B5/3116 , G11B5/3163 , Y10T29/49032 , Y10T29/49039 , Y10T29/49043 , Y10T29/49044 , Y10T29/49048 , Y10T29/49052
摘要： One preferred method for use in making a device structure with use of the resist channel shrinking solution includes the steps of forming a first pedestal portion within a channel of a patterned resist; applying a resist channel shrinking solution comprising a resist channel shrinking film and corrosion inhibitors within the channel of the patterned resist; baking the resist channel shrinking solution over the patterned resist to thereby reduce a width of the channel of the patterned resist; removing the resist channel shrinking solution; and forming a second pedestal portion within the reduced-width channel of the patterned resist. Advantageously, the oxide layer and the corrosion inhibitors of the resist channel shrinking solution reduce corrosion in the pedestal during the act of baking the resist channel shrinking solution.
摘要翻译： 用于制造使用抗蚀剂通道收缩溶液的器件结构的一种优选方法包括在图案化抗蚀剂的通道内形成第一基座部分的步骤; 在图案化的抗蚀剂的通道内施加包含抗蚀剂通道收缩膜和腐蚀抑制剂的抗蚀剂通道收缩溶液; 在图案化的抗蚀剂上烘烤抗蚀剂通道收缩溶液，从而减小图案化抗蚀剂的通道的宽度; 去除抗蚀剂通道收缩溶液; 以及在所述图案化抗蚀剂的所述减小宽度的通道内形成第二基座部分。 有利地，抗蚀剂通道收缩溶液的氧化物层和腐蚀抑制剂在烘烤抗蚀剂通道收缩溶液的作用下降低了基座中的腐蚀。
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10.发明授权Methods for improving positioning performance of electron beam lithography on magnetic wafers 失效改善电子束光刻在磁晶片上的定位性能的方法公开(公告)号：US07172786B2
公开(公告)日：2007-02-06
申请号：US10845956
申请日：2004-05-14
IPC分类号： B05D5/12
摘要： The present invention discloses a method for the production of sub-micron structures on magnetic materials using electron beam lithography. A subtractive process is disclosed wherein a portion of a magnetic material layer is removed from the substrate using conventional lithography, and the remaining portion of the magnetic material layer is patterned by e-beam lithography. A additive process is also disclosed wherein a thin magnetic seed layer is deposited on the substrate, a portion of which is removed by conventional lithography and replaced with a non-magnetic conducting layer. The remaining portion of magnetic seed layer is patterned by e-beam lithography and the final magnetic structure produced by electroplating.
摘要翻译： 本发明公开了一种使用电子束光刻在磁性材料上生产亚微米结构的方法。 公开了一种消减方法，其中使用常规光刻将磁性材料层的一部分从衬底上除去，并且通过电子束光刻将磁性材料层的剩余部分图案化。 还公开了一种添加方法，其中将薄的磁性种子层沉积在基底上，其一部分通过常规的光刻法被去除并被非磁性导电层代替。 通过电子束光刻和通过电镀产生的最终磁性结构对磁性种子层的剩余部分进行构图。
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