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公开(公告)号：US20080105967A1
公开(公告)日：2008-05-08
申请号：US11946424
申请日：2007-11-28
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/48
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dice on a new base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dice with a side by side structure or a stacking structure.
摘要翻译： 在新的基础上选择和放置标准骰子，以获得骰子之间适当和更宽的距离，而不是晶片上骰子的原始距离。 包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。 此外，管芯可以与被动部件或其他具有并排结构或堆叠结构的管芯封装。
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公开(公告)号：US20090051025A1
公开(公告)日：2009-02-26
申请号：US12255868
申请日：2008-10-22
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/48
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
摘要翻译： 在新的基座上选择和放置标准模具，以获得模具之间适当和更宽的距离，而不是晶片上的模具的原始距离。 包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。 此外，模具可以与被动部件或具有并排结构或堆叠结构的其它模具一起封装。
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公开(公告)号：US20060091514A1
公开(公告)日：2006-05-04
申请号：US11301303
申请日：2005-12-12
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/02
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
摘要翻译： 在新的基座上选择和放置标准模具，以获得模具之间适当和更宽的距离，而不是晶片上的模具的原始距离。 包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。 此外，模具可以与被动部件或具有并排结构或堆叠结构的其它模具一起封装。
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公开(公告)号：US20050236696A1
公开(公告)日：2005-10-27
申请号：US11169722
申请日：2005-06-30
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/12 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/58 , H01L21/60 , H01L23/00 , H01L23/14 , H01L23/31 , H01L23/48 , H01L23/485 , H01L23/52 , H01L23/522 , H01L23/538 , H01L23/552 , H01L25/065
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure .
摘要翻译： 在新的基座上选择和放置标准模具，以获得模具之间适当和更宽的距离，而不是晶片上的模具的原始距离。 包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。 此外，模具可以与被动部件或具有并排结构或堆叠结构的其它模具一起封装。
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公开(公告)号：US07667318B2
公开(公告)日：2010-02-23
申请号：US12255868
申请日：2008-10-22
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/12 , H01L23/053
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
摘要翻译： 在新的基座上选择和放置标准模具，以获得模具之间适当和更宽的距离，而不是晶片上的模具的原始距离。 包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。 此外，模具可以与被动部件或具有并排结构或堆叠结构的其它模具一起封装。
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公开(公告)号：US20050124093A1
公开(公告)日：2005-06-09
申请号：US10725933
申请日：2003-12-03
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/12 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/58 , H01L21/60 , H01L23/00 , H01L23/14 , H01L23/31 , H01L23/48 , H01L23/485 , H01L23/52 , H01L23/522 , H01L23/538 , H01L23/552 , H01L25/065
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
摘要翻译： 在新的基座上选择和放置标准模具，以获得模具之间适当和更宽的距离，而不是晶片上的模具的原始距离。 包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。 此外，模具可以与被动部件或具有并排结构或堆叠结构的其它模具一起封装。
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公开(公告)号：US07557437B2
公开(公告)日：2009-07-07
申请号：US11946424
申请日：2007-11-28
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/02
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dice on a new base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dice with a side by side structure or a stacking structure.
摘要翻译： 在新的基础上选择和放置标准骰子，以获得骰子之间适当和更宽的距离，而不是晶片上骰子的原始距离。 包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。 此外，管芯可以与被动部件或其他具有并排结构或堆叠结构的管芯封装。
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公开(公告)号：US07196408B2
公开(公告)日：2007-03-27
申请号：US11301303
申请日：2005-12-12
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/02
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
摘要翻译： 在新的基座上选择和放置标准模具，以获得模具之间适当和更宽的距离，而不是晶片上的模具的原始距离。 包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。 此外，模具可以与被动部件或具有并排结构或堆叠结构的其它模具一起封装。
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公开(公告)号：US07459781B2
公开(公告)日：2008-12-02
申请号：US10725933
申请日：2003-12-03
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/12 , H01L23/053
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
摘要翻译： 在新的基座上选择和放置标准模具，以获得模具之间适当和更宽的距离，而不是晶片上的模具的原始距离。 包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。 此外，模具可以与被动部件或具有并排结构或堆叠结构的其它模具一起封装。
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公开(公告)号：US07262081B2
公开(公告)日：2007-08-28
申请号：US11169722
申请日：2005-06-30
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L21/00
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
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