公开(公告)号：US06774000B2

公开(公告)日：2004-08-10

申请号：US10300239

申请日：2002-11-20

申请人： Wesley C. Natzle ,  Marc W. Cantell ,  Louis D. Lanzerotti ,  Effendi Leobandung ,  Brian L. Tessier ,  Ryan W. Wuthrich

发明人： Wesley C. Natzle ,  Marc W. Cantell ,  Louis D. Lanzerotti ,  Effendi Leobandung ,  Brian L. Tessier ,  Ryan W. Wuthrich

IPC分类号： H01L21336

CPC分类号： H01L21/31116 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/02639 ,  H01L21/28035 ,  H01L21/28114 ,  H01L21/28247 ,  H01L21/28525 ,  H01L21/28562 ,  H01L29/66628

摘要： A process for manufacturing an FET device. A semiconductor substrate is covered with a gate dielectric layer and with a conductive gate electrode formed over the gate dielectric. Blanket layers of silicon oxide may be added. An optional collar of silicon nitride may be formed over the silicon oxide layer around the gate electrode. Two precleaning steps are performed. Chemical oxide removal gases are then deposited, covering the device with an adsorbed reactant film. The gate dielectric (aside from the gate electrode) is removed, as the adsorbed reactant film reacts with the gate dielectric layer to form a rounded corner of silicon oxide at the base of the gate electrode. One or two in-situ doped silicon layers are deposited over the source/drain regions to form single or laminated epitaxial raised source/drain regions over the substrate protruding beyond the surface of the gate dielectric.

公开(公告)号：US06858903B2

公开(公告)日：2005-02-22

申请号：US10881449

申请日：2004-06-30

申请人： Wesley C. Natzle ,  Marc W. Cantell ,  Louis D. Lanzerotti ,  Effendi Leobandung ,  Brian L. Tessier ,  Ryan W. Wuthrich

发明人： Wesley C. Natzle ,  Marc W. Cantell ,  Louis D. Lanzerotti ,  Effendi Leobandung ,  Brian L. Tessier ,  Ryan W. Wuthrich

IPC分类号： H01L21/20 ,  H01L21/28 ,  H01L21/285 ,  H01L21/336 ,  H01L27/76

CPC分类号： H01L21/31116 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/02639 ,  H01L21/28035 ,  H01L21/28114 ,  H01L21/28247 ,  H01L21/28525 ,  H01L21/28562 ,  H01L29/66628

摘要： A process for manufacturing an FET device. A semiconductor substrate is covered with a gate dielectric layer and with a conductive gate electrode formed over the gate dielectric. Blanket layers of silicon oxide may be added. An optional collar of silicon nitride may be formed over the silicon oxide layer around the gate electrode. Two precleaning steps are performed. Chemical oxide removal gases are then deposited, covering the device with an adsorbed reactant film. The gate dielectric (aside from the gate electrode) is removed, as the adsorbed reactant film reacts with the gate dielectric layer to form a rounded corner of silicon oxide at the base of the gate electrode. One or two in-situ doped silicon layers are deposited over the source/drain regions to form single or laminated epitaxial raised source/drain regions over the substrate protruding beyond the surface of the gate dielectric.

摘要翻译： 一种用于制造FET器件的工艺。 半导体衬底被栅极电介质层覆盖，并且在栅极电介质上形成导电栅电极。 可以加入氧化硅的毯层。 可以在栅电极周围的氧化硅层上形成可选的氮化硅环。 执行两个预清洗步骤。 然后沉积化学氧化物去除气体，用吸附的反应物膜覆盖该装置。 由于吸附的反应物膜与栅极电介质层反应，在栅电极的底部形成氧化硅的圆角，所以除去栅极电介质（除了栅电极之外）。 一个或两个原位掺杂的硅层沉积在源极/漏极区上，以在衬底上方突出超过栅极电介质的表面形成单个或层叠的外延凸起的源/漏区。

公开(公告)号：US07592245B2

公开(公告)日：2009-09-22

申请号：US12014127

申请日：2008-01-15

申请人： David M. Dobuzinsky ,  Byeong Y. Kim ,  Effendi Leobandung ,  Munir D. Naeem ,  Brian L. Tessier

发明人： David M. Dobuzinsky ,  Byeong Y. Kim ,  Effendi Leobandung ,  Munir D. Naeem ,  Brian L. Tessier

IPC分类号： H01L21/44

CPC分类号： H01L21/84

摘要： Embodiments herein present a method for forming a poly filled substrate contact on a SOI structure. The method forms an insulator on a substrate and forms a substrate contact hole within the insulator. The insulator surface level is higher than final structure. Next, a poly overfill is performed, comprising filling the substrate contact hole with polysilicon and covering the insulator with the polysilicon. Specifically, the thickness of the polysilicon is greater than the size of the substrate contact hole. Following this, the polysilicon is etched, wherein a portion of the polysilicon is removed, and wherein the substrate contact hole is left partially filled with the polysilicon. Further, the etching of the polysilicon forms a concave recess within a top portion of the polysilicon. The etching of said polysilicon does not contact the substrate. The excess of insulator is polished off to the desired level.

摘要翻译： 本文的实施方案提供了一种用于在SOI结构上形成多孔填充衬底接触的方法。 该方法在衬底上形成绝缘体，并在绝缘体内形成衬底接触孔。 绝缘子表面水平高于最终结构。 接下来，执行聚过填料，包括用多晶硅填充衬底接触孔并用多晶硅覆盖绝缘体。 具体地，多晶硅的厚度大于基板接触孔的尺寸。 接下来，蚀刻多晶硅，其中去除多晶硅的一部分，并且其中衬底接触孔部分地被多晶硅填充。 此外，多晶硅的蚀刻在多晶硅的顶部内形成凹形凹部。 所述多晶硅的蚀刻不与衬底接触。 绝缘体的过剩被抛光到所需的水平。

公开(公告)号：US07358172B2

公开(公告)日：2008-04-15

申请号：US11307762

申请日：2006-02-21

申请人： David M. Dobuzinsky ,  Byeong Y. Kim ,  Effendi Leobandung ,  Munir D. Naeem ,  Brian L. Tessier

发明人： David M. Dobuzinsky ,  Byeong Y. Kim ,  Effendi Leobandung ,  Munir D. Naeem ,  Brian L. Tessier

IPC分类号： H01L21/44

CPC分类号： H01L21/84

摘要： Embodiments herein present a method for forming a poly filled substrate contact on a SOI structure. The method forms an insulator on a substrate and forms a substrate contact hole within the insulator. The insulator surface level is higher than final structure. Next, a poly overfill is performed, comprising filling the substrate contact hole with polysilicon and covering the insulator with the polysilicon. Specifically, the thickness of the polysilicon is greater than the size of the substrate contact hole. Following this, the polysilicon is etched, wherein a portion of the polysilicon is removed, and wherein the substrate contact hole is left partially filled with the polysilicon. Further, the etching of the polysilicon forms a concave recess within a top portion of the polysilicon. The etching of said polysilicon does not contact the substrate. The excess of insulator is polished off to the desired level.

摘要翻译： 本文的实施方案提供了一种用于在SOI结构上形成多孔填充衬底接触的方法。 该方法在衬底上形成绝缘体，并在绝缘体内形成衬底接触孔。 绝缘子表面水平高于最终结构。 接下来，执行聚过填料，包括用多晶硅填充衬底接触孔并用多晶硅覆盖绝缘体。 具体地，多晶硅的厚度大于基板接触孔的尺寸。 接下来，蚀刻多晶硅，其中去除多晶硅的一部分，并且其中衬底接触孔部分地被多晶硅填充。 此外，多晶硅的蚀刻在多晶硅的顶部内形成凹形凹部。 所述多晶硅的蚀刻不与衬底接触。 绝缘体的过剩被抛光到所需的水平。

公开(公告)号：US08723262B2

公开(公告)日：2014-05-13

申请号：US13606893

申请日：2012-09-07

申请人： Veeraraghavan S. Basker ,  Huiming Bu ,  Effendi Leobandung ,  Theodorus E. Standaert ,  Tenko Yamashita ,  Chun-Chen Yeh

发明人： Veeraraghavan S. Basker ,  Huiming Bu ,  Effendi Leobandung ,  Theodorus E. Standaert ,  Tenko Yamashita ,  Chun-Chen Yeh

IPC分类号： H01L27/01 ,  H01L27/12 ,  H01L31/0392

CPC分类号： H01L29/7843 ,  H01L29/6656 ,  H01L29/66795

摘要： FinFETS and methods for making FinFETs with a recessed stress liner. A method includes providing an SOI substrate with fins, forming a gate over the fins, forming an off-set spacer on the gate, epitaxially growing a film to merge the fins, depositing a dummy spacer around the gate, and recessing the merged epi film. Silicide is then formed on the recessed merged epi film followed by deposition of a stress liner film over the FinFET. By using a recessed merged epi process, a MOSFET with a vertical silicide (i.e. perpendicular to the substrate) can be formed. The perpendicular silicide improves spreading resistance.

摘要翻译： FinFET和用于制造具有凹陷应力衬垫的FinFET的方法。 一种方法包括向SOI衬底提供翅片，在鳍片上形成栅极，在栅极上形成偏置间隔物，外延生长膜以合并鳍片，在栅极周围沉积虚拟间隔物，并使合并的膜片膜凹陷 。 然后在凹陷的合并epi膜上形成硅化物，然后在FinFET上沉积应力衬垫膜。 通过使用凹入的合并epi工艺，可以形成具有垂直硅化物（即垂直于衬底）的MOSFET。 垂直硅化物提高了耐扩散性。

公开(公告)号：US08586449B1

公开(公告)日：2013-11-19

申请号：US13603872

申请日：2012-09-05

申请人： Josephine B. Chang ,  Paul Chang ,  Michael A. Guillorn ,  Effendi Leobandung

发明人： Josephine B. Chang ,  Paul Chang ,  Michael A. Guillorn ,  Effendi Leobandung

IPC分类号： H01L21/76

CPC分类号： H01L21/845 ,  H01L21/76229

摘要： Raised isolation structures can be formed at the same level as semiconductor fins over an insulator layer. A template material layer can be conformally deposited to fill the gaps among the semiconductor fins within each cluster of semiconductor fins on an insulator layer, while the space between adjacent clusters is not filled. After an anisotropic etch, discrete template material portions can be formed within each cluster region, while the buried insulator is physically exposed between cluster regions. A raised isolation dielectric layer is deposited and planarized to form raised isolation structures employing the template material portions as stopping structures. After removal of the template material portions, a cluster of semiconductor fins are located within a trench that is self-aligned to outer edges of the cluster of semiconductor fins. The trench can be employed to confine raised source/drain regions to be formed on the cluster of semiconductor fins.

摘要翻译： 升高的隔离结构可以在与绝缘体层上的半导体鳍片相同的水平上形成。 可以共形沉积模板材料层以填充绝缘体层上的每个半导体翅片簇内的半导体鳍片之间的间隙，而相邻簇之间的空间未被填充。 在各向异性蚀刻之后，可以在每个簇区域内形成离散的模板材料部分，而埋入的绝缘体在簇区域之间物理暴露。 沉积并平坦化凸起的隔离介电层以形成采用模板材料部分作为停止结构的凸起隔离结构。 在去除模板材料部分之后，一组半导体鳍片位于与半导体鳍片簇的外边缘自对准的沟槽内。 沟槽可以用来限制要形成在半导体鳍片簇上的凸起的源极/漏极区域。

公开(公告)号：US08513085B2

公开(公告)日：2013-08-20

申请号：US13409693

申请日：2012-03-01

申请人： Sunfei Fang ,  Brian J. Greene ,  Effendi Leobandung ,  Qingqing Liang ,  Edward P. Maciejewski ,  Yanfeng Wang

发明人： Sunfei Fang ,  Brian J. Greene ,  Effendi Leobandung ,  Qingqing Liang ,  Edward P. Maciejewski ,  Yanfeng Wang

IPC分类号： H01L21/8238

CPC分类号： H01L21/823857 ,  H01L21/28247 ,  H01L21/823842 ,  H01L21/823864 ,  H01L29/517 ,  H01L29/6659 ,  H01L29/66636

摘要： Threshold voltage controlled semiconductor structures are provided in which a conformal nitride-containing liner is located on at least exposed sidewalls of a patterned gate dielectric material having a dielectric constant of greater than silicon oxide. The conformal nitride-containing liner is a thin layer that is formed using a low temperature (less than 500° C.) nitridation process.

摘要翻译： 提供了阈值电压控制的半导体结构，其中共形含氮化物的衬垫位于具有大于氧化硅的介电常数的图案化栅极电介质材料的至少暴露的侧壁上。 含氮氮化物的内衬是使用低温（小于500℃）的氮化工艺形成的薄层。

公开(公告)号：US20130173214A1

公开(公告)日：2013-07-04

申请号：US13343186

申请日：2012-01-04

申请人： Tenko Yamashita ,  Huiming Bu ,  Effendi Leobandung ,  Theodorus Eduardus Standaert

发明人： Tenko Yamashita ,  Huiming Bu ,  Effendi Leobandung ,  Theodorus Eduardus Standaert

IPC分类号： G01B7/02 ,  H01L23/58 ,  G06F19/00

CPC分类号： G01B7/023 ,  G01B2210/56 ,  H01L22/12 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method and test circuit for electrically measuring the critical dimension of a fin of a FinFET is disclosed. The method comprises measuring the resistance of a first gate test structure, measuring the resistance of a second gate test structure, computing a linear equation relating sheet resistance to gate width, computing a Y intercept value of the linear equation to derive an external resistance value, computing a sheet resistance value for the first gate test structure based on the external resistance value, measuring the resistance of a doped fin test structure, and computing a critical dimension of a fin based on the sheet resistance value.

摘要翻译： 公开了一种用于电测量FinFET的鳍的临界尺寸的方法和测试电路。 该方法包括测量第一栅极测试结构的电阻，测量第二栅极测试结构的电阻，计算相关薄层电阻与栅极宽度的线性方程，计算线性方程的Y截距值以导出外部电阻值， 基于外部电阻值计算第一栅极测试结构的薄层电阻值，测量掺杂散热片测试结构的电阻，以及基于薄层电阻值计算散热片的临界尺寸。

公开(公告)号：US20110031554A1

公开(公告)日：2011-02-10

申请号：US12535183

申请日：2009-08-04

申请人： Sunfei Fang ,  Brian J. Greene ,  Effendi Leobandung ,  Qingqing Liang ,  Edward P. Maciejewski ,  Yanfeng Wang

发明人： Sunfei Fang ,  Brian J. Greene ,  Effendi Leobandung ,  Qingqing Liang ,  Edward P. Maciejewski ,  Yanfeng Wang

IPC分类号： H01L27/092 ,  H01L21/336 ,  H01L29/78

CPC分类号： H01L21/823857 ,  H01L21/28247 ,  H01L21/823842 ,  H01L21/823864 ,  H01L29/517 ,  H01L29/6659 ,  H01L29/66636

摘要： A method of forming threshold voltage controlled semiconductor structures is provided in which a conformal nitride-containing liner is formed on at least exposed sidewalls of a patterned gate dielectric material having a dielectric constant of greater than silicon oxide. The conformal nitride-containing liner is a thin layer that is formed using a low temperature (less than 500° C.) nitridation process.

摘要翻译： 提供了形成阈值电压控制的半导体结构的方法，其中在至少暴露的具有大于氧化硅的介电常数的栅极介电材料的侧壁上形成共形氮化物衬里。 含氮氮化物的内衬是使用低温（小于500℃）的氮化工艺形成的薄层。

公开(公告)号：US07268049B2

公开(公告)日：2007-09-11

申请号：US10954838

申请日：2004-09-30

申请人： Huilong Zhu ,  Effendi Leobandung ,  Anda C. Mocuta ,  Dan M. Mocuta

发明人： Huilong Zhu ,  Effendi Leobandung ,  Anda C. Mocuta ,  Dan M. Mocuta

IPC分类号： H01L21/336

CPC分类号： H01L29/7842 ,  H01L21/26586 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/105 ,  H01L29/1608 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/66636 ,  H01L29/7833 ,  H01L29/7848

摘要： The present invention comprises a method for forming a semiconducting device including the steps of providing a layered structure including a substrate, a low diffusivity layer of a first-conductivity dopant; and a channel layer; forming a gate stack atop a protected surface of the channel layer; etching the layered structure selective to the gate stack to expose a surface of the substrate, where a remaining portion of the low diffusivity layer provides a retrograded island substantially aligned to the gate stack having a first dopant concentration to reduce short-channel effects without increasing leakage; growing a Si-containing material atop the recessed surface of the substrate; and doping the Si-containing material with a second-conductivity dopant at a second dopant concentration. The low diffusivity layer may be Si1-x-yGexZy, where Z can be carbon (C), xenon (Xe), germanium (Ge), krypton (Kr), argon (Ar), nitrogen (N), or combinations thereof.

摘要翻译： 本发明包括一种形成半导体器件的方法，包括以下步骤：提供包括衬底，第一导电掺杂剂的低扩散层的分层结构; 和通道层; 在沟道层的受保护表面上方形成栅极堆叠; 蚀刻对栅极堆叠选择性的层状结构以暴露衬底的表面，其中低扩散层的剩余部分提供基本上与具有第一掺杂剂浓度的栅极堆叠对准的退化岛，以减少短沟道效应而不增加泄漏 ; 在衬底的凹陷表面的顶部生长含Si材料; 并且以第二掺杂剂浓度用第二导电掺杂剂掺杂含Si材料。 低扩散性层可以是Si 1-xy X z Z z，其中Z可以是碳（C），氙（Xe）， 锗（Ge），氪（Kr），氩（Ar），氮（N）或其组合。