Capacitive filtered feedthrough array for an implantable medical device

    公开(公告)号:US06660116B2

    公开(公告)日:2003-12-09

    申请号:US10124134

    申请日:2002-04-18

    IPC分类号: B32B3126

    摘要: A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path. Bonding pads are attached to the internally disposed ends of each feedthrough conductive path, and corrosion resistant, conductive buttons are attached to and seal the externally disposed ends of each feedthrough conductive path. A plurality of conductive, substrate ground paths are formed extending through the co-fired metal-ceramic substrate between internally and externally facing layer surfaces thereof and electrically isolated from the substrate conductive paths. The capacitor ground electrodes are coupled electrically to the plurality of conductive, substrate ground paths and to the ferrule.

    Capacitive filtered feedthrough array for an implantable medical device
    2.
    发明授权
    Capacitive filtered feedthrough array for an implantable medical device 有权
    用于可植入医疗设备的电容滤波馈通阵列

    公开(公告)号:US06414835B1

    公开(公告)日:2002-07-02

    申请号:US09515385

    申请日:2000-03-01

    IPC分类号: H01G435

    摘要: A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path. Bonding pads are attached to the internally disposed ends of each feedthrough conductive path, and corrosion resistant, conductive buttons are attached to and seal the externally disposed ends of each feedthrough conductive path. A plurality of conductive, substrate ground paths are formed extending through the co-fired metal-ceramic substrate between internally and externally facing layer surfaces thereof and electrically isolated from the substrate conductive paths. The capacitor ground electrodes are coupled electrically to the plurality of conductive, substrate ground paths and to the ferrule.

    摘要翻译: 电容滤波的馈通组件以固态方式形成,以采用高度小型化的导电路径,每个导电路径由嵌入在电容滤波器阵列中的盘状电容滤波器滤波。 不导电的共烧金属陶瓷基板由多个支撑一个或多个基板导电路径的层形成,并且被钎焊到适于被焊接到壳体上的导电套圈上,使用导电的,耐腐蚀的 钎焊材料。 金属陶瓷衬底附接到内部设置的电容性滤波器阵列,该阵列围绕耦合到滤波器阵列导电路径的一个或多个电容滤波器电容器有源电极和至少一个电容器接地电极。 每个电容性滤波器阵列导电路径与金属 - 陶瓷导电路径连接以形成馈通导电路径。 接合垫连接到每个馈通导电路径的内部设置的端部,并且耐腐蚀的导电按钮附接到每个馈通导电路径的外部设置的端部并将其密封。 多个导电的衬底接地路径形成为延伸穿过共烧金属陶瓷衬底的内表面和外表面之间的层表面,并与衬底导电通路电绝缘。 电容器接地电极电耦合到多个导电的衬底接地路径和套圈。

    Capacitive filter feedthrough for implantable medical device
    3.
    发明授权
    Capacitive filter feedthrough for implantable medical device 失效
    用于可植入医疗器械的电容滤波器馈通

    公开(公告)号:US5870272A

    公开(公告)日:1999-02-09

    申请号:US852198

    申请日:1997-05-06

    IPC分类号: A61N1/375 H01G4/35 H01G4/008

    摘要: A capacitive filter feedthrough assembly and method of making the same are disclosed for shielding an implantable medical device such as pacemaker or defibrillator from electromagnetic interference or noise. A ferrule is adapted for mounting onto a conductive device housing by welding, soldering, brazing or gluing, and supports a terminal pin for feedthrough passage to a housing interior. A capacitive filter is mounted at the inboard side of a device housing, with capacitive filter electrode plate sets coupled respectively to the housing and the terminal pin by an electrically conductive combination of solder and brazing. In one embodiment of the invention, multiple capacitive filters are provided in an array within a common base structure, where each capacitive filter is associated with a respective terminal pin.

    摘要翻译: 公开了电容式滤波器馈通组件及其制造方法,用于屏蔽诸如起搏器或除颤器之类的可植入医疗装置免受电磁干扰或噪声。 套圈适于通过焊接,焊接,钎焊或胶合来安装到导电装置壳体上,并且将用于穿通通道的端子销支撑到壳体内部。 电容滤波器安装在器件壳体的内侧,电容滤波器电极板组通过焊料和钎焊的导电组合分别耦合到壳体和端子销。 在本发明的一个实施例中,多个电容滤波器以公共基底结构的阵列提供,其中每个电容滤波器与相应的端子引脚相关联。

    Method of making ultrasonically welded, staked of swaged components in an implantable medical device
    5.
    发明授权
    Method of making ultrasonically welded, staked of swaged components in an implantable medical device 有权
    在可植入医疗器械中超声波焊接,锻压组件的方法

    公开(公告)号:US06205358B1

    公开(公告)日:2001-03-20

    申请号:US09159119

    申请日:1998-09-23

    IPC分类号: A61N1362

    CPC分类号: A61N1/375 Y10T29/49174

    摘要: The present invention generally relates to implantable medical devices and more particularly to various means for ultrasonically welding, swaging or staking various components in an implantable medical device, most preferably by employing appropriately configured covers or lids. Covers or lids are attached to header or connector modules mounted on an hermetically enclosed and sealed enclosure, where the connector or header module and enclosure comprise an implantable medical device. The covers or lids preferably trap or otherwise secure any of a number of various connector or header module components within the header or connector modules. Examples of such trapped or secured components include grommets, set screw connector blocks, seals, feedthrough wires, multi-beam contacts, electrical contacts, antennas, radio-opaque markers, connector ribbons and the like.

    摘要翻译: 本发明总体上涉及可植入医疗装置,更具体地说,涉及用于在植入式医疗装置中超声波焊接,锻压或铆接各种部件的各种装置,最优选地采用适当配置的盖子或盖子。 盖子或盖子连接到安装在密封和密封的外壳上的插头或连接器模块,其中连接器或插头模块和外壳包括可植入的医疗装置。 盖子或盖子优选地捕获或以其他方式固定头部或连接器模块内的多个连接器或头部模块组件中的任何一个。 这种被捕获或固定部件的实例包括垫圈,固定螺钉连接器块,密封件,馈通线,多梁接触件,电触头,天线,不透射线的标记,连接器带等。

    IMD connector header with grommet retainer
    6.
    发明授权
    IMD connector header with grommet retainer 有权
    IMD连接器插头带有索环保持器

    公开(公告)号:US07231253B2

    公开(公告)日:2007-06-12

    申请号:US10732947

    申请日:2003-12-11

    IPC分类号: A61N1/375

    CPC分类号: A61N1/375

    摘要: An implantable medical device (IMD) includes a connector header for making electrical and mechanical connections with a proximal connector assembly of an electrical medical lead and includes a retainer for retaining a penetrable grommet within a header grommet aperture. A connector block disposed within a header body of the connector header has a threaded bore aligned with a header grommet aperture and a connector block bore aligned with a header connector bore. The penetrable grommet is disposed within the header grommet aperture, and a setscrew is threaded into the threaded bore having a setscrew socket disposed to be engaged by a tool inserted through the penetrable grommet within the header grommet aperture to enable rotation of the setscrew within the threaded bore to tighten the setscrew against or to loosen the setscrew from a lead connector element received in the header connector bore.

    摘要翻译: 可植入医疗装置(IMD)包括用于与电气医疗引线的近端连接器组件进行电气和机械连接的连接器插头,并且包括保持器,用于将可穿透的索环保持在头部密封孔内。 设置在连接器插头的插头主体内的连接器块具有与插头孔环孔对准的螺纹孔和与插头连接器孔对准的连接器块孔。 可穿透的索环设置在头部密封孔中,并且固定螺丝被拧入螺纹孔中,该螺纹孔具有固定螺丝插座,该固定螺丝插座设置成由插入到头部孔环孔内的可穿透索环的工具接合,以使固定螺丝能够旋入螺纹 用于将固定螺丝紧固或者从接头插入连接器孔中的引线连接器元件松开固定螺丝。

    Attachment apparatus and method for an implantable medical device
employing ultrasonic energy
    7.
    发明授权
    Attachment apparatus and method for an implantable medical device employing ultrasonic energy 有权
    使用超声波能量的可植入医疗装置的附件装置和方法

    公开(公告)号:US5897578A

    公开(公告)日:1999-04-27

    申请号:US140499

    申请日:1998-08-27

    IPC分类号: A61N1/375

    CPC分类号: A61N1/3752 Y10T29/49925

    摘要: A method and apparatus for attaching a pre-formed header module, e.g. a connector header module or an electrode bearing header module, etc., to a hermetically sealed enclosure of the implantable medical device, typically including electronic integrated circuits, batteries, electromechanical pumps, or the like, are disclosed. A plurality of upstanding tabs that are fixed to the hermetically sealed enclosure, e.g. to the enclosure attachment surface, extend into a like plurality of tab channels formed in the header module housing. The upstanding tab(s) are inserted into the respective tab channel(s) during seating of the module and enclosure attachment surfaces and effects an initial alignment of the header module with the hermetically sealed enclosure. Each attachment tab has a retention feature formed on or in the tab that is designed to accommodate the flow of the thermoplastic material during the application of ultrasonic energy in the region of the tab channel and to cooperate with the solidified mass of thermoplastic material. During application of the ultrasonic energy, the thermoplastic material melts and flows into the remaining space of the tab channel and encapsulate the attachment tab including the retention feature. Upon termination of the ultrasonic energy, the thermoplastic housing material cools and solidifies and forms a continuous mass that encapsulates the surface of the attachment tab and the retention feature.

    摘要翻译: 一种用于附接预成形头部模块的方法和装置,例如, 公开了通常包括电子集成电路,电池,机电泵等的可植入医疗装置的气密密封外壳中的连接器插头模块或电极支承插头模块等。 多个直立突出部,固定在密封的外壳上,例如。 到壳体附接表面,延伸到形成在头部模块壳体中的相似的多个突片通道。 在模块和机壳连接表面的座位期间,将直立的插片插入到相应的标签通道中,并且实现了头部模块与密封外壳的初始对准。 每个附接翼片具有形成在翼片上或翼片中的保持特征,该保持特征被设计成在翼片通道的区域中施加超声波能量期间适应热塑性材料的流动并且与固化的热塑性材料块配合。 在施加超声波能量期间,热塑性材料熔化并流入突片通道的剩余空间并且封装包括保持特征的连接片。 在超声波能量终止时,热塑性外壳材料冷却并固化并形成包封附着突片的表面和保持特征的连续质量。

    Attachment apparatus and method for an implantable medical device
employing ultrasonic energy

    公开(公告)号:US5871515A

    公开(公告)日:1999-02-16

    申请号:US140973

    申请日:1998-08-27

    IPC分类号: A61N1/375

    CPC分类号: A61N1/3752 Y10T29/49925

    摘要: A method and apparatus for attaching a pre-formed header module, e.g. a connector header module or an electrode bearing header module, etc., to a hermetically sealed enclosure of the implantable medical device, typically including electronic integrated circuits, batteries, electromechanical pumps, or the like, are disclosed. A plurality of upstanding tabs that are fixed to the hermetically sealed enclosure, e.g. to the enclosure attachment surface, extend into a like plurality of tab channels formed in the header module housing. The upstanding tab(s) are inserted into the respective tab channel(s) during seating of the module and enclosure attachment surfaces and effects an initial alignment of the header module with the hermetically sealed enclosure. Each attachment tab has a retention feature formed on or in the tab that is designed to accommodate the flow of the thermoplastic material during the application of ultrasonic energy in the region of the tab channel and to cooperate with the solidified mass of thermoplastic material. During application of the ultrasonic energy, the thermoplastic material melts and flows into the remaining space of the tab channel and encapsulate the attachment tab including the retention feature. Upon termination of the ultrasonic energy, the thermoplastic housing material cools and solidifies and forms a continuous mass that encapsulates the surface of the attachment tab and the retention feature.

    Attachment apparatus for an implantable medical device employing
ultrasonic energy
    10.
    发明授权
    Attachment apparatus for an implantable medical device employing ultrasonic energy 失效
    用于使用超声波能量的可植入医疗装置的附件装置

    公开(公告)号:US5871514A

    公开(公告)日:1999-02-16

    申请号:US904601

    申请日:1997-08-01

    IPC分类号: A61N1/375

    CPC分类号: A61N1/3752 Y10T29/49925

    摘要: A method and apparatus for attaching a pre-formed header module to a hermetically sealed enclosure of an implantable medical device are described. A plurality of upstanding tabs attached to the hermetically sealed enclosure extend into a plurality of corresponding tab channels formed in the header module. The upstanding tabs are inserted into the respective tab channels during seating of the module and enclosure attachment surfaces and effect an initial alignment of the header module with the hermetically sealed enclosure. Each attachment tab has a retention feature such as a recess formed on or in the tab that is designed to receive molten thermoplastic material when ultrasonic energy is applied in the region of the tab channel.

    摘要翻译: 描述了一种用于将预成形头部模块附接到可植入医疗装置的密封外壳的方法和装置。 附接到密封外壳的多个直立突出部延伸到形成在头部模块中的多个对应的突舌通道。 在模块和外壳附接表面的座位期间,直立突出部插入到相应的突出部通道中,并实现头部模块与密封外壳的初始对准。 每个附接凸片具有保持特征,例如形成在凸片上或凸片中的凹部,其设计成当超声波能量被施加在凸片通道的区域中时接收熔融的热塑性材料。