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    Capacitive filtered feedthrough array for an implantable medical device
    1.
    发明授权
    Capacitive filtered feedthrough array for an implantable medical device 有权

    公开(公告)号：US06660116B2

    公开(公告)日：2003-12-09

    申请号：US10124134

    申请日：2002-04-18

    申请人： William D. Wolf ,  James Strom ,  Craig L. Wiklund ,  Mary A. Fraley ,  Lynn M. Seifried ,  James E. Volmering ,  Patrick F. Malone ,  Samuel F. Haq

    发明人： William D. Wolf ,  James Strom ,  Craig L. Wiklund ,  Mary A. Fraley ,  Lynn M. Seifried ,  James E. Volmering ,  Patrick F. Malone ,  Samuel F. Haq

    IPC分类号： B32B3126

    CPC分类号： H01G4/35 ,  A61N1/3754 ,  H05K1/0306 ,  H05K1/112 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629

    摘要： A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path. Bonding pads are attached to the internally disposed ends of each feedthrough conductive path, and corrosion resistant, conductive buttons are attached to and seal the externally disposed ends of each feedthrough conductive path. A plurality of conductive, substrate ground paths are formed extending through the co-fired metal-ceramic substrate between internally and externally facing layer surfaces thereof and electrically isolated from the substrate conductive paths. The capacitor ground electrodes are coupled electrically to the plurality of conductive, substrate ground paths and to the ferrule.

    Capacitive filtered feedthrough array for an implantable medical device
    2.
    发明授权
    Capacitive filtered feedthrough array for an implantable medical device 有权
    用于可植入医疗设备的电容滤波馈通阵列

    公开(公告)号：US06414835B1

    公开(公告)日：2002-07-02

    申请号：US09515385

    申请日：2000-03-01

    申请人： William D. Wolf ,  James Strom ,  Craig L. Wiklund ,  Mary A. Fraley ,  Lynn M. Seifried ,  James E. Volmering ,  Patrick F. Malone ,  Samuel F. Haq

    发明人： William D. Wolf ,  James Strom ,  Craig L. Wiklund ,  Mary A. Fraley ,  Lynn M. Seifried ,  James E. Volmering ,  Patrick F. Malone ,  Samuel F. Haq

    IPC分类号： H01G435

    CPC分类号： H01G4/35 ,  A61N1/3754 ,  H05K1/0306 ,  H05K1/112 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629

    摘要： A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path. Bonding pads are attached to the internally disposed ends of each feedthrough conductive path, and corrosion resistant, conductive buttons are attached to and seal the externally disposed ends of each feedthrough conductive path. A plurality of conductive, substrate ground paths are formed extending through the co-fired metal-ceramic substrate between internally and externally facing layer surfaces thereof and electrically isolated from the substrate conductive paths. The capacitor ground electrodes are coupled electrically to the plurality of conductive, substrate ground paths and to the ferrule.

    摘要翻译： 电容滤波的馈通组件以固态方式形成，以采用高度小型化的导电路径，每个导电路径由嵌入在电容滤波器阵列中的盘状电容滤波器滤波。 不导电的共烧金属陶瓷基板由多个支撑一个或多个基板导电路径的层形成，并且被钎焊到适于被焊接到壳体上的导电套圈上，使用导电的，耐腐蚀的 钎焊材料。 金属陶瓷衬底附接到内部设置的电容性滤波器阵列，该阵列围绕耦合到滤波器阵列导电路径的一个或多个电容滤波器电容器有源电极和至少一个电容器接地电极。 每个电容性滤波器阵列导电路径与金属 - 陶瓷导电路径连接以形成馈通导电路径。 接合垫连接到每个馈通导电路径的内部设置的端部，并且耐腐蚀的导电按钮附接到每个馈通导电路径的外部设置的端部并将其密封。 多个导电的衬底接地路径形成为延伸穿过共烧金属陶瓷衬底的内表面和外表面之间的层表面，并与衬底导电通路电绝缘。 电容器接地电极电耦合到多个导电的衬底接地路径和套圈。

    Accelerometer for implantable medical device
    3.
    发明授权
    Accelerometer for implantable medical device 有权
    用于可植入医疗器械的加速计

    公开(公告)号：US06216537B1

    公开(公告)日：2001-04-17

    申请号：US09282485

    申请日：1999-03-31

    申请人： Mark E. Henschel ,  David Brian Hall ,  Scott B. Sleeper ,  Lary R. Larson ,  Brian S. Child ,  Patrick F. Malone ,  Samuel F. Haq ,  David A. Ruben ,  Joan A. O'Gara ,  James E. Volmering ,  Roy L. Inman

    发明人： Mark E. Henschel ,  David Brian Hall ,  Scott B. Sleeper ,  Lary R. Larson ,  Brian S. Child ,  Patrick F. Malone ,  Samuel F. Haq ,  David A. Ruben ,  Joan A. O'Gara ,  James E. Volmering ,  Roy L. Inman

    IPC分类号： G01P102

    CPC分类号： G01P15/125 ,  A61B2562/0219 ,  A61N1/36542 ,  G01P1/023 ,  H05K3/3442

    摘要： An accelerometer device which can be mounted on a substrate, e.g., a circuit board enclosed in a medical device, includes an accelerometer sensing element having an axis of sensitivity and further includes first and second multilayer end caps. The substrate generally defines a mounting plane. The accelerometer sensing element includes a device body having a longitudinal axis extending between generally parallel first and second ends thereof and further includes a principal surface extending between the first and second ends of the device body parallel to the longitudinal axis. The axis of sensitivity of the sensing element is generally perpendicular to a plane defined by the principal surface. Further, the accelerometer sensing element includes conductive pad regions on each of the first and second ends of the device body. Each of the first and second multilayer end caps includes conductive elements on one side thereof and further includes conductive traces electrically connected to the conductive elements thereof. Each of the conductive traces of the first and second multilayer end caps terminate at a surface mount contact region along at least one edge thereof. The first and second multilayer end caps are attached to the first and second ends of the device body such that, when the accelerometer device is mounted on a substrate, the axis of sensitivity of the accelerometer sensing element is perpendicular to the mounting plane defined thereby.

    摘要翻译： 可以安装在基板上的加速度计装置，例如封装在医疗装置中的电路板，包括具有灵敏度轴的加速度计传感元件，还包括第一和第二多层端盖。 基板通常限定安装平面。 加速度计传感元件包括具有在其大致平行的第一和第二端之间延伸的纵向轴线的装置本体，并且还包括在平行于纵向轴线的装置主体的第一和第二端之间延伸的主表面。 感测元件的灵敏度轴通常垂直于由主表面限定的平面。 此外，加速度计感测元件包括在装置主体的第一和第二端的每一个上的导电焊盘区域。 第一和第二多层端盖中的每一个在其一侧上包括导电元件，并且还包括电连接到其导电元件的导电迹线。 第一和第二多层端盖的每个导电迹线沿着其至少一个边缘终止于表面安装接触区域。 第一和第二多层端盖附接到装置主体的第一和第二端，使得当加速度计装置安装在基板上时，加速度计感测元件的灵敏度轴垂直于由其限定的安装平面。