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公开(公告)号：US5785535A
公开(公告)日：1998-07-28
申请号：US591206
申请日：1996-01-17
IPC分类号： G06F1/18 , H01L23/32 , H01R4/26 , H01R12/51 , H01R12/57 , H01R33/76 , H05K3/32 , H05K7/10 , H01R9/09
CPC分类号： H01R12/57 , H01R12/79 , H05K3/325 , H05K7/1061 , H01R4/26
摘要： A computer system having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate mounted in the computer system enclosure, along with a power supply, a bus system, and connectors for communicating with units external to the enclosure. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.
摘要翻译： 具有能够更换表面安装部件的能力的计算机系统。 组件通过弹簧朝向安装在计算机系统外壳中的基板上的区域阵列位置以及电源，总线系统和用于与外壳外部的单元通信的连接器而偏置。 部件和弹簧定位在邻近区域阵列部位的基座内并用联接器机械地保持下来。 提供了一种用于其的互连结构。
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公开(公告)号：US6015301A
公开(公告)日：2000-01-18
申请号：US121452
申请日：1998-07-23
IPC分类号： G06F1/18 , H01L23/32 , H01R4/26 , H01R12/51 , H01R12/57 , H01R33/76 , H05K3/32 , H05K7/10 , H01R9/09
CPC分类号： H01R12/57 , H01R12/79 , H05K3/325 , H05K7/1061 , H01R4/26
摘要： A surface mount socket having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.
摘要翻译： 具有能够更换表面安装部件的能力的表面安装插座。 组件通过弹簧偏向衬底上的区域阵列位置。 部件和弹簧定位在邻近区域阵列部位的基座内并用联接器机械地保持下来。 提供了一种用于其的互连结构。
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3.发明授权Electrical connector assembly for connecting first and second circuitized substrates 失效用于连接第一和第二电路化基板的电连接器组件
公开(公告)号：US5938454A
公开(公告)日：1999-08-17
申请号：US866102
申请日：1997-05-30
CPC分类号： H05K7/1061 , H01R12/714
摘要： An electrical connector for coupling two circuitized substrates (e.g., a ball grid array module and a printed circuit board) wherein the connector includes a base member fixedly secured (e.g., soldered) to the printed circuit board and having one substrate oriented therein. The connector further includes a 2-part retention member including one part movably oriented in the base and a second part for directly engaging the retained substrate to cause it to move downwardly (and thus in a completely different direction than the direction of rotation of the movable one part within the base) to thereby provide effective connection between substrates. An interposer may be used if desired. An information handling system including a microprocessor and connector electrically coupled thereto is also disclosed.
摘要翻译： 一种用于耦合两个电路化基板（例如，球栅阵列模块和印刷电路板）的电连接器，其中连接器包括固定（例如焊接）到印刷电路板并且具有定向在其中的一个基板的基座部件。 该连接器还包括一个2部分的保持构件，其包括一部分可移动地定位在基座中，第二部分用于直接接合保持的基板，使其向下移动（并且因此在与可移动的方向相反的方向上完全不同的方向） 一部分在基座内），从而提供基板之间的有效连接。 如果需要，可以使用中介层。 还公开了一种包括微处理器和电耦合到其上的连接器的信息处理系统。
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4.发明授权Flexible circuitized interposer with apertured member and method for making same 失效具有多孔构件的柔性电路插值器及其制造方法
公开(公告)号：US5759047A
公开(公告)日：1998-06-02
申请号：US653214
申请日：1996-05-24
CPC分类号： H01R13/2414 , H01L23/49811 , H01R12/62 , H01R12/714 , H01R13/648 , H05K1/118 , H05K3/326 , H01L2224/16225 , H05K1/036 , H05K2201/0133 , H05K2201/0373 , H05K2201/09063 , H05K2201/09081 , H05K2201/09109 , H05K2201/10378 , H05K2201/10734
摘要： A flexible circuitized interposer (50) and method of making same wherein the interposer includes at least one flexible circuitized substrate (53) having a dielectric (e.g., polyimide) layer (54) with a conductor (55) and plated elements (56), e.g., copper pad, including possibly with dendrites (57) thereon for enhanced connection, an apertured support member (58) aligning with the conductor, and a support member (60) having the apertured member thereon. When the interposer is engaged, the flexible circuitized substrate (53) is depressed within the aperture (59). Various alternatives, including a support (60") formed with compressible portions (69) that extend into respective apertures (59) in the support member (58), and an interim, compressible support (60""), are disclosed. The support member may also be metallic, e.g., for use as an electrical ground shield. Flexure is also enhanced by utilization of patterns of one or more apertures (64) in the flexible substrate relative to and substantially surrounding the positioned conductors (56). Electrical assemblies including a pair of circuitized substrates electrically interconnected by the defined interposers are also described.
摘要翻译： 一种柔性电路插入器（50）及其制造方法，其中插入器包括至少一个柔性电路化衬底（53），其具有导体（55）和电镀元件（56）的电介质（例如，聚酰亚胺）层（54） 例如铜垫，其中可能具有用于增强连接的枝晶（57），与导体对准的有孔支撑构件（58）和在其上具有有孔构件的支撑构件（60）。 当插入件接合时，柔性电路化基板（53）在孔（59）内被压下。 公开了包括延伸到支撑构件（58）中的相应孔（59）中的可压缩部分（69）形成的支撑件（60“）和一个临时的可压缩支撑件（60”）， 。 支撑构件也可以是金属的，例如用作电接地屏蔽。 通过利用柔性基板中的一个或多个孔（64）的图案相对于并且基本上围绕定位的导体（56）也增强了弯曲。 还描述了包括通过限定的插入体电互连的一对电路化基板的电气组件。
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5.发明授权Flexible circuitized interposer with apertured member and method for making same 失效具有多孔构件的柔性电路插值器及其制造方法
公开(公告)号：US5984691A
公开(公告)日：1999-11-16
申请号：US39082
申请日：1998-03-10
CPC分类号： H01R13/2414 , H01L23/49811 , H01R12/62 , H01R12/714 , H01R13/648 , H05K1/118 , H05K3/326 , H01L2224/16225 , H05K1/036 , H05K2201/0133 , H05K2201/0373 , H05K2201/09063 , H05K2201/09081 , H05K2201/09109 , H05K2201/10378 , H05K2201/10734
摘要： A flexible circuitized interposer (50) and method of making same wherein the interposer includes at least one flexible circuitized substrate (53) having a dielectric (e.g., polyimide) layer (54) with a conductor (55) and plated elements (56), e.g., copper pad, including possibly with dendrites (57) thereon for enhanced connection, an apertured support member (58) aligning with the conductor, and a support member (60) having the apertured member thereon. When the interposer is engaged, the flexible circuitized substrate (53) is depressed within the aperture (59). Various alternatives, including a support (60") formed with compression portions (69) that extend into respective apertures (59) in the support member (58), and an interim, compressible support (60""), are disclosed. Flexure is also enhanced by utilization of patterns of one or more apertures (64) in the flexible substrate relative to and substantially surrounding the positioned conductors (56). Electrical assemblies including a pair of circuitized substrates electrically interconnected by the defined interposers are also described.
摘要翻译： 一种柔性电路插入器（50）及其制造方法，其中插入器包括至少一个柔性电路化衬底（53），其具有导体（55）和电镀元件（56）的电介质（例如，聚酰亚胺）层（54） 例如铜垫，其中可能具有用于增强连接的枝晶（57），与导体对准的有孔支撑构件（58）和在其上具有有孔构件的支撑构件（60）。 当插入件接合时，柔性电路化基板（53）在孔（59）内被压下。 公开了各种替代方案，包括形成有延伸到支撑构件（58）中的相应孔（59）中的压缩部分（69）的支撑件（60“）和临时可压缩支撑件（60”） 。 通过利用柔性基板中的一个或多个孔（64）的图案相对于并且基本上围绕定位的导体（56）也增强了弯曲。 还描述了包括通过限定的插入体电互连的一对电路化基板的电气组件。
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公开(公告)号：US06974915B2
公开(公告)日：2005-12-13
申请号：US10979366
申请日：2004-11-01
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译： 描述印刷电路板（PWB）子组件的细节及其制造方法。 子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。 子组件可以作为原始组件的一部分。 子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。
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公开(公告)号：US06892451B2
公开(公告)日：2005-05-17
申请号：US10361659
申请日：2003-02-10
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译： 描述印刷电路板（PWB）子组件的细节及其制造方法。 子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。 子组件可以作为原始组件的一部分。 子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。
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公开(公告)号：US06545226B2
公开(公告)日：2003-04-08
申请号：US09871556
申请日：2001-05-31
IPC分类号： H05K111
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译： 描述印刷电路板（PWB）子组件的细节及其制造方法。 子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。 子组件可以作为原始组件的一部分。 子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。
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9.发明授权Printed circuit board to module mounting and interconnecting structure and method 失效印刷电路板到模块安装和互连结构和方法公开(公告)号：US06386890B1
公开(公告)日：2002-05-14
申请号：US09804529
申请日：2001-03-12
IPC分类号： G01R1200
CPC分类号： H05K3/325 , H01R12/7047
摘要： The present invention provides a method and structure for connecting a module to a printed circuit board, wherein a substantially rigid interposer having resilient conductors is disposed between a module and a printed circuit board. A clamping means urges the module and printed circuit board toward each other with compressive force upon an interposer positioned therebetween, preferably causing the module and printed circuit board to deform and thereby align their electrical contacts with the surfaces of the interposer. The interposer further comprises a plurality of apertures, each aperture further having a deformable resilient conductor means for connecting a module contact to a PCB contact. The conductor is deformable in shear, which may travel and, therefore, makeup the CTE dimensional mismatch between the module and the PCB. The conductors are detachable, electrically connecting the module and PCB contacts without the requirement of solder or other permanent means.
摘要翻译： 本发明提供一种用于将模块连接到印刷电路板的方法和结构，其中具有弹性导体的基本上刚性的插入件设置在模块和印刷电路板之间。 夹紧装置通过压缩力将模块和印刷电路板朝向彼此朝向插入器定位在其间的优选地引导模块和印刷电路板变形，从而使它们的电触点与插入器的表面对齐。 插入器还包括多个孔，每个孔还具有用于将模块接触件连接到PCB触点的可变形的弹性导体装置。 导体可以在剪切中变形，其可以移动，并因此补偿模块和PCB之间的CTE尺寸失配。 导体是可拆卸的，电连接模块和PCB触点，而不需要焊料或其他永久手段。
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10.发明授权Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements 失效一种用于使用设置有具有配电元件的框架结构的平面栅格阵列连接器来电连接两个基板的装置公开(公告)号：US08179693B2
公开(公告)日：2012-05-15
申请号：US11693824
申请日：2007-03-30
CPC分类号： H05K7/1069 , H01R12/52 , H01R12/7082 , H01R12/714 , Y10T29/49169
摘要： Apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched between non-conductive layers. The frame may, for example, be a printed wire board (PWB) having power planes that distribute power from a first substrate (e.g., a system PWB) and/or a power cable to a second substrate (e.g., an electronic module). The frame includes one or more apertures configured to receive an LGA interposer for electrically connecting the two substrates. Preferably, the frame includes four apertures arranged in quadrants that each receive an interposer, and at least one power plane extends between two quadrants and/or adjacent to a peripheral edge of one or more quadrants in the form of stacked and/or parallel bus bars each defining a power domain.
摘要翻译： 一种用于使用具有配电元件的框架结构的焊盘格栅阵列（LGA）连接器来电连接两个基板的装置。 在一个实施例中，框架结构包括具有夹在非导电层之间的一个或多个导电层的框架。 框架可以例如是具有从第一基板（例如，系统PWB）和/或电力电缆分配功率到第二基板（例如，电子模块）的电力平面的印刷线路板（PWB）。 该框架包括一个或多个孔，其构造成接收用于电连接两个基板的LGA插入器。 优选地，框架包括布置在象限中的四个孔，每个孔分别接收插入件，并且至少一个电源平面在两个象限之间延伸和/或邻近一个或多个象限的周边边缘，堆叠和/或并行母线的形式 每个定义一个电源域。
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