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公开(公告)号：US06695623B2
公开(公告)日：2004-02-24
申请号：US09871554
申请日：2001-05-31
IPC分类号： H01R1200
CPC分类号： H01R12/52 , H05K3/321 , H05K3/325 , H05K3/3436 , Y10T29/49147 , Y10T29/49149
摘要： A method and structure for electrically and mechanically interconnecting an array of printed circuit board contacts to an array of module contacts with a plurality of deformable resilient electrical conductors with two ends. Each of the conductor ends are electrically connected to one of the contact arrays. A portion of the conductor may deform longitudinally and laterally responsive to movement of the printed circuit board relative to the module responsive to heating and cooling cycles and mechanical vibrations, while maintaining the electrical connection of the contact arrays. An interposer with apertures extending through the interposer carries the conductors in the apertures and is used to align the conductors with the contacts. A method for excluding a rigid adhesive means from a portion of the resilient conductor is also taught.
摘要翻译： 用于将印刷电路板触点阵列电气和机械地互连到具有两端的多个可变形的弹性电导体的模块触点阵列的方法和结构。 每个导体端电连接到一个接触阵列。 导体的一部分可以响应于加热和冷却循环和机械振动而响应于印刷电路板相对于模块的移动而纵向和横向地变形，同时保持接触阵列的电连接。 具有延伸穿过插入器的孔的插入器承载孔中的导体并且用于将导体与触点对准。 还教导了从弹性导体的一部分排除刚性粘合剂装置的方法。
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公开(公告)号：US06974915B2
公开(公告)日：2005-12-13
申请号：US10979366
申请日：2004-11-01
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译： 描述印刷电路板（PWB）子组件的细节及其制造方法。 子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。 子组件可以作为原始组件的一部分。 子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。
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公开(公告)号：US06892451B2
公开(公告)日：2005-05-17
申请号：US10361659
申请日：2003-02-10
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译： 描述印刷电路板（PWB）子组件的细节及其制造方法。 子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。 子组件可以作为原始组件的一部分。 子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。
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公开(公告)号：US06545226B2
公开(公告)日：2003-04-08
申请号：US09871556
申请日：2001-05-31
IPC分类号： H05K111
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译： 描述印刷电路板（PWB）子组件的细节及其制造方法。 子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。 子组件可以作为原始组件的一部分。 子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。
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5.发明授权Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements 失效一种用于使用设置有具有配电元件的框架结构的平面栅格阵列连接器来电连接两个基板的装置公开(公告)号：US08179693B2
公开(公告)日：2012-05-15
申请号：US11693824
申请日：2007-03-30
CPC分类号： H05K7/1069 , H01R12/52 , H01R12/7082 , H01R12/714 , Y10T29/49169
摘要： Apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched between non-conductive layers. The frame may, for example, be a printed wire board (PWB) having power planes that distribute power from a first substrate (e.g., a system PWB) and/or a power cable to a second substrate (e.g., an electronic module). The frame includes one or more apertures configured to receive an LGA interposer for electrically connecting the two substrates. Preferably, the frame includes four apertures arranged in quadrants that each receive an interposer, and at least one power plane extends between two quadrants and/or adjacent to a peripheral edge of one or more quadrants in the form of stacked and/or parallel bus bars each defining a power domain.
摘要翻译： 一种用于使用具有配电元件的框架结构的焊盘格栅阵列（LGA）连接器来电连接两个基板的装置。 在一个实施例中，框架结构包括具有夹在非导电层之间的一个或多个导电层的框架。 框架可以例如是具有从第一基板（例如，系统PWB）和/或电力电缆分配功率到第二基板（例如，电子模块）的电力平面的印刷线路板（PWB）。 该框架包括一个或多个孔，其构造成接收用于电连接两个基板的LGA插入器。 优选地，框架包括布置在象限中的四个孔，每个孔分别接收插入件，并且至少一个电源平面在两个象限之间延伸和/或邻近一个或多个象限的周边边缘，堆叠和/或并行母线的形式 每个定义一个电源域。
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6.发明授权公开(公告)号：US07765693B2
公开(公告)日：2010-08-03
申请号：US12183288
申请日：2008-07-31
申请人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
发明人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
CPC分类号： H01R13/2407 , H01R12/52 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208
摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).
摘要翻译： 一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。 插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。 弹性线束设置在每个孔中。 非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。 每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。 一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。 在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。
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公开(公告)号：US20090111292A1
公开(公告)日：2009-04-30
申请号：US11931220
申请日：2007-10-31
IPC分类号： H01R12/06
CPC分类号： H05K1/111 , H01R12/724 , H01R13/6471 , H01R13/648 , H05K1/0219 , H05K2201/09409 , H05K2201/10189 , Y02P70/611
摘要： A pad array for a surface mount technology board includes a front row ground pad as a single pad, followed by a signal pad. The ground pads internal to the array may be arranged as pairs of pads interconnected to each other, with sandwiching signal pads on the internal portion of the array. To minimize stress on connector wafers of large scale connectors, external rows of ground pads may be enlarged by a predetermined amount in a Y-direction to minimize potential formation of stress risers, while ensuring that electrical spacing requirements to adjacent signal leads may be preserved for optimal signal integrity.
摘要翻译： 用于表面贴装技术板的焊盘阵列包括作为单个焊盘的前排接地焊盘，其后是信号焊盘。 阵列内部的接地焊盘可以布置为彼此互连的焊盘对，并且在阵列的内部部分上夹有信号焊盘。 为了最大限度地减小大尺寸连接器的连接器晶片上的应力，外部排的接地焊盘可以在Y方向上扩大预定量，以最小化应力梯级的潜在形成，同时确保可以保持对相邻信号引线的电气间隔要求， 最佳信号完整性。
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8.发明申请PIN GRID ARRAY ZERO INSERTION FORCE CONNECTORS CONFIGURABLE FOR SUPPORTING LARGE PIN COUNTS 有权PIN网格阵列插入力连接器可配置为支持大量PIN码公开(公告)号：US20080026627A1
公开(公告)日：2008-01-31
申请号：US11496153
申请日：2006-07-31
申请人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
发明人： Gareth Geoffrey Hougham , William Louis Brodsky , Thomas M. Cipolla , Paul William Coteus , Ronald Malfatt
IPC分类号： H01R4/50
CPC分类号： H01R13/193 , H05K7/1007
摘要： A PGA socket including a plurality of sub-socket components, which when used in combination forms a larger effective socket, includes multiple apertures configured to receive corresponding pins of an IC. The PGA socket further includes multiple contact members, each of the contact members corresponding to a respective one of the apertures. The contact members are configured to movably engage corresponding pins of the IC upon respective movement of the apertures so as to provide electrical and mechanical contact thereto. Each of the sub-socket components is configured to mechanically engage at least one of the other sub-socket components such that the contact members in each of the sub-socket components are capable of electrically connecting to corresponding pins of the IC substantially simultaneously.
摘要翻译： 包括多个子插座部件的PGA插座，当组合使用时形成较大的有效插座，包括配置成接收IC的相应引脚的多个孔。 PGA插座还包括多个接触构件，每个接触构件对应于相应的一个孔。 接触构件被构造成在孔的相应移动时可移动地接合IC的相应销，以便提供与其的电和机械接触。 每个子插座部件被构造成机械地接合其他子插座部件中的至少一个，使得每个子插座部件中的接触部件能够基本上同时电连接到IC的相应引脚。
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9.发明授权Electrical connector assembly for connecting first and second circuitized substrates 失效用于连接第一和第二电路化基板的电连接器组件
公开(公告)号：US5938454A
公开(公告)日：1999-08-17
申请号：US866102
申请日：1997-05-30
CPC分类号： H05K7/1061 , H01R12/714
摘要： An electrical connector for coupling two circuitized substrates (e.g., a ball grid array module and a printed circuit board) wherein the connector includes a base member fixedly secured (e.g., soldered) to the printed circuit board and having one substrate oriented therein. The connector further includes a 2-part retention member including one part movably oriented in the base and a second part for directly engaging the retained substrate to cause it to move downwardly (and thus in a completely different direction than the direction of rotation of the movable one part within the base) to thereby provide effective connection between substrates. An interposer may be used if desired. An information handling system including a microprocessor and connector electrically coupled thereto is also disclosed.
摘要翻译： 一种用于耦合两个电路化基板（例如，球栅阵列模块和印刷电路板）的电连接器，其中连接器包括固定（例如焊接）到印刷电路板并且具有定向在其中的一个基板的基座部件。 该连接器还包括一个2部分的保持构件，其包括一部分可移动地定位在基座中，第二部分用于直接接合保持的基板，使其向下移动（并且因此在与可移动的方向相反的方向上完全不同的方向） 一部分在基座内），从而提供基板之间的有效连接。 如果需要，可以使用中介层。 还公开了一种包括微处理器和电耦合到其上的连接器的信息处理系统。
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公开(公告)号：US5847324A
公开(公告)日：1998-12-08
申请号：US626732
申请日：1996-04-01
申请人： Donald Seton Farquhar , William Louis Brodsky , Natalie Barbara Feilchenfeld , Lisa Jeanine Jimarez , James Robert Wilcox
发明人： Donald Seton Farquhar , William Louis Brodsky , Natalie Barbara Feilchenfeld , Lisa Jeanine Jimarez , James Robert Wilcox
CPC分类号： H05K3/4652 , H01B7/0838 , H01B7/0861 , H05K1/0393 , H05K2201/015 , H05K2201/0154 , H05K3/28 , H05K3/4626 , H05K3/4635 , H05K3/4655 , Y10T29/49124
摘要： A composite cable has a reinforcing layer with conductors disposed on opposed planar surfaces. Dielectric film layers electrically separate the conductors on the planar reinforcing layer from respective layers of additional conductors. The flexible cable is manufactured by laminating a layer of dielectric film and a layer of electrically conductive material onto both sides of a double clad core which provides a strain relief reinforcement for the cable.
摘要翻译： 复合电缆具有加强层，导体设置在相对的平面上。 介电膜层将平面加强层上的导体与附加导体的相应层电分离。 柔性电缆通过将电介质膜和一层导电材料层叠在双包层芯的两侧上来制造，该双层芯提供用于电缆的应变消除加强件。
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