Dopants for semiconducting materials
    1.
    发明授权
    Dopants for semiconducting materials 失效
    半导体材料掺杂剂

    公开(公告)号:US6156917A

    公开(公告)日:2000-12-05

    申请号:US889972

    申请日:1997-07-10

    IPC分类号: C07F7/10

    CPC分类号: C07F7/10

    摘要: A magnesium amide for use as a magnesium donor not having any Mg--C bonds. The compound is useful for doping GaN with Mg.sup.+2. The compound of the present invention is a high molecular weight dimer, preferably a diamide containing one or more silicon substituent groups. Alternatively, the compounds of the present invention may contain amino nitrogens weakly bonded to Mg. The compounds must have sufficient volatility to be useful in chemical vapor deposition.

    摘要翻译: 用作不具有任何Mg-C键的镁供体的镁酰胺。 该化合物可用于以Mg + 2掺杂GaN。 本发明的化合物是高分子量二聚体,优选含有一个或多个硅取代基的二酰胺。 或者,本发明的化合物可以含有与Mg弱结合的氨基氮。 化合物必须具有足够的挥发性,可用于化学气相沉积。

    Dopants for semiconducting materials
    2.
    发明授权
    Dopants for semiconducting materials 失效
    半导体材料掺杂剂

    公开(公告)号:US06265597B1

    公开(公告)日:2001-07-24

    申请号:US09496792

    申请日:2000-02-02

    IPC分类号: C07F710

    CPC分类号: C07F7/10

    摘要: A magnesium amide for use as a magnesium donor not having any Mg—C bonds. The compound is useful for doping GaN with Mg+2. The compound of the present invention is a high molecular weight dimer, preferably a diamide containing one or more silicon substituent groups. Alternatively, the compounds of the present invention may contain amino nitrogens weakly bonded to Mg. The compounds must have sufficient volatility to be useful in chemical vapor deposition.

    摘要翻译: 用作不具有任何Mg-C键的镁供体的镁酰胺。 该化合物可用于以Mg + 2掺杂GaN。 本发明的化合物是高分子量二聚体,优选含有一个或多个硅取代基的二酰胺。 或者,本发明的化合物可以含有与Mg弱结合的氨基氮。 化合物必须具有足够的挥发性,可用于化学气相沉积。

    Nanostructure coatings
    4.
    发明授权
    Nanostructure coatings 有权
    纳米结构涂层

    公开(公告)号:US06372364B1

    公开(公告)日:2002-04-16

    申请号:US09376625

    申请日:1999-08-18

    IPC分类号: B32B300

    摘要: A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-1000 nm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process. The resulting thin film provides a high level of adhesion to a final substrate, by embedding the nanostructures with the material of the final substrate (such as an epoxy resin). The surface of the thin film adjacent the temporary substrate substantially conforms to the substrate surface and has a relatively low peel strength. In this manner, the temporary substrate is easily removed from the thin film after attaching the opposite nanostructured side of the thin film to the final substrate with a resulting, higher peel strength.

    摘要翻译: 具有纳米结构表面的薄膜产品,包括薄膜和与纳米结构表面相对的临时基底的层压制品,包括薄膜和附着在纳米结构表面上的最终基底的层压制品以及制造薄膜产品的方法 。 薄膜在电子工业中特别适用于生产集成电路,印刷电路板和EMF屏蔽。 纳米结构表面包括大体上小于1微米的表面特征,而薄膜的致密部分在10-1000nm之间。 通过使用任何方法用涂覆材料(例如铜)涂覆临时基板(例如铝箔)来制造薄膜。 一种这样的方法是集中热沉积或燃烧,化学气相沉积工艺。 通过将纳米结构与最终基底(例如环氧树脂)的材料嵌入,所得到的薄膜提供了对最终基底的高水平粘附。 邻近临时衬底的薄膜的表面基本上符合衬底表面并且具有相对低的剥离强度。 以这种方式,在将薄膜的相对的纳米结构侧附着到最终基板上之后,可以容易地从薄膜移除临时基板,从而获得更高的剥离强度。

    Hydrophobic coatings and methods
    5.
    发明授权
    Hydrophobic coatings and methods 失效
    疏水性涂料及方法

    公开(公告)号:US07138186B2

    公开(公告)日:2006-11-21

    申请号:US10771514

    申请日:2004-02-05

    IPC分类号: B32B9/04

    摘要: Substrates have a hydrophobic surface coating comprised of the reaction products of methyltrichlorsilane (MTCS) and dimethyldichlorosilane (DMDCS). Most preferably the substrate is glass. An anchor layer is most preferably formed directly onto the glass substrate surface by means of the application of a humidified reaction product of silicon tetrachloride, followed by the vapor-deposition of MTCS as a cross-linking layer. The hydrophobic layer of MTCS and DMDCS may then be applied over the cross-linking layer of MTCS. A capping layer formed of trimethylchlorosilane (TMCS) may then be vapor deposited onto the hydrophobic layer.

    摘要翻译: 底物具有由甲基三氯硅烷(MTCS)和二甲基二氯硅烷(DMDCS)的反应产物组成的疏水表面涂层。 最优选地,基底是玻璃。 锚定层最优选通过施加四氯化硅的加湿反应产物直接形成在玻璃基板表面上,随后将MTCS作为交联层进行气相沉积。 然后可以在MTCS的交联层上施加MTCS和DMDCS的疏水层。 然后可以将由三甲基氯硅烷(TMCS)形成的覆盖层气相沉积到疏水层上。