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1.发明授权Apparatus for measuring feature widths on masks for the semiconductor industry 有权用于半导体工业的掩模测量特征宽度的装置公开(公告)号：US07375792B2
公开(公告)日：2008-05-20
申请号：US10711424
申请日：2004-09-17
IPC分类号： G03B27/42
CPC分类号： G01B11/14 , G01B11/028 , G02B21/33
摘要： An apparatus for measuring feature widths on masks 1 for the semiconductor industry is disclosed. The apparatus encompasses a carrier plate 16 that is retained in vibrationally decoupled fashion in a base frame 14; a scanning stage 18, arranged on the carrier plate 16, that carries a mask 1 to be measured, the mask 1 defining a surface 4; and an objective 2 arranged opposite the mask 1. A liquid 25 is provided between the objective 2 and the surface 4 of the mask 1.
摘要翻译： 公开了一种用于测量半导体工业的掩模1上的特征宽度的装置。 该装置包括在基架14中以振动解耦方式保持的承载板16; 布置在承载板16上的扫描台18，其承载待测量的掩模1，掩模1限定表面4; 以及与掩模1相对布置的物镜2。 液体25设置在物镜2和掩模1的表面4之间。
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2.发明申请APPARATUS FOR MEASURING FEATURE WIDTHS ON MASKS FOR THE SEMICONDUCTOR INDUSTRY 有权用于测量半导体工业屏蔽特征宽度的装置公开(公告)号：US20050084770A1
公开(公告)日：2005-04-21
申请号：US10711424
申请日：2004-09-17
CPC分类号： G01B11/14 , G01B11/028 , G02B21/33
摘要： An apparatus for measuring feature widths on masks 1 for the semiconductor industry is disclosed. The apparatus encompasses a carrier plate 16 that is retained in vibrationally decoupled fashion in a base frame 14; a scanning stage 18, arranged on the carrier plate 16, that carries a mask 1 to be measured, the mask 1 defining a surface 4; and an objective 2 arranged opposite the mask 1. A liquid 25 is provided between the objective 2 and the surface 4 of the mask 1.
摘要翻译： 公开了一种用于测量半导体工业的掩模1上的特征宽度的装置。 该装置包括在基架14中以振动解耦方式保持的承载板16; 布置在承载板16上的扫描台18，其承载待测量的掩模1，掩模1限定表面4; 以及与掩模1相对布置的物镜2。 液体25设置在物镜2和掩模1的表面4之间。
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公开(公告)号：US20080259327A1
公开(公告)日：2008-10-23
申请号：US11569172
申请日：2005-07-05
IPC分类号： G01N21/956 , G02B21/26
CPC分类号： G03F7/70341 , G02B21/33
摘要： A device 1 is disclosed for inspecting, measuring defined structures, simulating structures and structural defects, repair of and to structures, and post-inspecting defined object sites on a microscopic component 2 with an immersion objective 8a. The device 1 comprises a stage that is movable in the x-coordinate direction and in the y-coordinate direction and a holder 42 for the microscopic component 2, whereby the holder 42 is placed on the stage 4 with the microscopic component 2 in it. The holder 42 has a reservoir 51a with immersion or cleaning fluid, respectively. The stage 4 is movable such that the immersion objective 8a is located directly above the reservoir 51a and may dip into the fluid with its front-most lens.
摘要翻译： 公开了一种用于通过浸没物镜8a检查，测量限定结构，模拟结构和结构缺陷，修复和结构以及在微观组件2上对定义的物体位置进行后检查的装置1。 装置1包括在x坐标方向和y坐标方向上可移动的台架和用于微型部件2的保持器42，由此保持器42放置在台架4上，其中具有微观部件2。 保持器42具有分别具有浸没或清洁流体的储存器51a。 舞台4是可移动的，使得浸没物体8a位于储存器51a的正上方，并且可以用其最前面的透镜浸入流体中。
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4.发明申请DEVICE FOR INSPECTING A MICROSCOPIC COMPONENT BY MEANS OF AN IMMERSION OBJECTIVE 审中-公开用于通过注入目标检查微观组件的装置公开(公告)号：US20070206279A1
公开(公告)日：2007-09-06
申请号：US11569180
申请日：2005-07-05
IPC分类号： G02B21/26
CPC分类号： G02B21/0016
摘要： A device (1) is disclosed for inspecting, measuring defined structures, simulating structures and structural defects, repair of and to structures, and post-inspecting defined object sites on a microscopic component (2) with an immersion objective (8a). The device (1) comprises a stage that is movable in the x-coordinate direction and in the y-coordinate direction and a holder (42) for the microscopic component (2), whereby the holder (42) is placed on the stage (4) with the microscopic component (2) in it. The holder (42) has a reservoir (51a) with immersion or cleaning fluid, respectively. The stage (4) is movable such that the immersion objective (8a) is located directly above the reservoir (51a) and may dip into the fluid with its front-most lens.
摘要翻译： 公开了一种用于检测，测量定义的结构，模拟结构和结构缺陷，对结构进行修复和对具有浸没物镜（8a））的微观部件（2）上的定义的物体位置进行后检查的设备（1）。 装置（1）包括能够在x坐标方向和y坐标方向上移动的台架和用于微型部件（2）的支架（42），由此将支架（42）放置在台架 4）与其中的微观组分（2）。 保持器（42）具有分别具有浸没或清洁流体的储存器（51a）。 工作台（4）是可移动的，使得浸没物镜（8a）位于储存器（51a）的正上方，并且可以用其最前面的透镜浸入流体中。
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公开(公告)号：US07460962B2
公开(公告)日：2008-12-02
申请号：US10490327
申请日：2004-03-19
摘要： The invention relates to a method for optical measurement of an OPC structure (306), having a pre-determined structure (302) on a photo-mask, in order to determine a measurement of the structure in at least one direction, whereby, firstly, a region (300) is determined on the photo-mask, which comprises the OPC structure (306) to be measured. The intensity of the determined region (300) is then scanned in a first direction and the region in which the intensity passes a threshold is determined for each scan. The maximum separation between an edge (308) of the structure (302) and an edge (312) of the corresponding OPC structure (306) is determined, based on the difference of the determined regions.
摘要翻译： 本发明涉及一种在光掩模上具有预定结构（302）的OPC结构（306）的光学测量方法，以便确定至少一个方向上的结构测量，由此首先 在包含要测量的OPC结构（306）的光掩模上确定区域（300）。 然后确定区域（300）的强度在第一方向被扫描，并且对于每个扫描确定强度通过阈值的区域。 基于所确定的区域的差异，确定结构（302）的边缘（308）与对应的OPC结构（306）的边缘（312）之间的最大间隔。
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公开(公告)号：US20090316981A1
公开(公告)日：2009-12-24
申请号：US12456184
申请日：2009-06-12
IPC分类号： G06K9/00
CPC分类号： G01N21/9505 , G01N21/3563 , G01N2021/3568
摘要： In order to improve the detectability of defects in structures incorporated beneath the surface of a wafer, it is suggested to acquire an IR subimage of the illuminated wafer with an IR image acquisition device and a VIS subimage with a VIS image acquisition device. The acquisition is performed simultaneously and is controlled such that the same area of the wafer is imaged sharply by both image acquisition devices. An image processor is used to determine whether a detected defect is attributable to a defect on the surface or to a defect of the structures located beneath the surface.
摘要翻译： 为了提高结合在晶片表面下方的结构中的缺陷的可检测性，建议用具有VIS图像采集装置的IR图像采集装置和VIS子图像获取照射晶片的IR子图像。 采集同时执行，并被控制，使得由两个图像采集装置使晶片的相同区域被锐利地成像。 使用图像处理器来确定检测到的缺陷是否归因于表面上的缺陷或位于表面下方的结构的缺陷。
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7.发明申请Arrangement and method for improving the measurement accuracy in the nm range for optical systems 审中-公开用于提高光学系统的nm范围内的测量精度的布置和方法公开(公告)号：US20090066970A1
公开(公告)日：2009-03-12
申请号：US12154051
申请日：2008-05-20
IPC分类号： G01B11/02
CPC分类号： G01B11/02
摘要： A method and a device for improving the measurement accuracy in the nm range for optical systems are disclosed. The object is provided with a plurality of structures oriented in the X and Y-coordinate direction. The light beam coming from at least one light source defines an optical illumination path.
摘要翻译： 公开了一种用于提高光学系统的nm范围内的测量精度的方法和装置。 该物体具有在X和Y坐标方向上定向的多个结构。 来自至少一个光源的光束限定光学照明路径。
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公开(公告)号：US20080071479A1
公开(公告)日：2008-03-20
申请号：US10490327
申请日：2004-03-19
摘要： The invention relates to a method for optical measurement of an OPC structure (306), having a pre-determined structure (302) on a photo-mask, in order to determine a measurement of the structure in at least one direction, whereby, firstly, a region (300) is determined on the photo-mask, which comprises the OPC structure (306) to be measured. The intensity of the determined region (300) is then scanned in a first direction and the region in which the intensity passes a threshold is determined for each scan. The maximum separation between an edge (308) of the structure (302) and an edge (312) of the corresponding OPC structure (306) is determined, based on the difference of the determined regions.
摘要翻译： 本发明涉及一种在光掩模上具有预定结构（302）的OPC结构（306）的光学测量方法，以便确定至少一个方向上的结构测量，由此首先 在包含要测量的OPC结构（306）的光掩模上确定区域（300）。 然后确定区域（300）的强度在第一方向被扫描，并且对于每个扫描确定强度通过阈值的区域。 基于所确定的区域的差异，确定结构（302）的边缘（308）与对应的OPC结构（306）的边缘（312）之间的最大间隔。
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