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1.发明申请APPARATUS FOR MEASURING FEATURE WIDTHS ON MASKS FOR THE SEMICONDUCTOR INDUSTRY 有权用于测量半导体工业屏蔽特征宽度的装置公开(公告)号：US20050084770A1
公开(公告)日：2005-04-21
申请号：US10711424
申请日：2004-09-17
CPC分类号： G01B11/14 , G01B11/028 , G02B21/33
摘要： An apparatus for measuring feature widths on masks 1 for the semiconductor industry is disclosed. The apparatus encompasses a carrier plate 16 that is retained in vibrationally decoupled fashion in a base frame 14; a scanning stage 18, arranged on the carrier plate 16, that carries a mask 1 to be measured, the mask 1 defining a surface 4; and an objective 2 arranged opposite the mask 1. A liquid 25 is provided between the objective 2 and the surface 4 of the mask 1.
摘要翻译： 公开了一种用于测量半导体工业的掩模1上的特征宽度的装置。 该装置包括在基架14中以振动解耦方式保持的承载板16; 布置在承载板16上的扫描台18，其承载待测量的掩模1，掩模1限定表面4; 以及与掩模1相对布置的物镜2。 液体25设置在物镜2和掩模1的表面4之间。
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2.发明授权Apparatus for measuring feature widths on masks for the semiconductor industry 有权用于半导体工业的掩模测量特征宽度的装置公开(公告)号：US07375792B2
公开(公告)日：2008-05-20
申请号：US10711424
申请日：2004-09-17
IPC分类号： G03B27/42
CPC分类号： G01B11/14 , G01B11/028 , G02B21/33
摘要： An apparatus for measuring feature widths on masks 1 for the semiconductor industry is disclosed. The apparatus encompasses a carrier plate 16 that is retained in vibrationally decoupled fashion in a base frame 14; a scanning stage 18, arranged on the carrier plate 16, that carries a mask 1 to be measured, the mask 1 defining a surface 4; and an objective 2 arranged opposite the mask 1. A liquid 25 is provided between the objective 2 and the surface 4 of the mask 1.
摘要翻译： 公开了一种用于测量半导体工业的掩模1上的特征宽度的装置。 该装置包括在基架14中以振动解耦方式保持的承载板16; 布置在承载板16上的扫描台18，其承载待测量的掩模1，掩模1限定表面4; 以及与掩模1相对布置的物镜2。 液体25设置在物镜2和掩模1的表面4之间。
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公开(公告)号：US20050219521A1
公开(公告)日：2005-10-06
申请号：US11076620
申请日：2005-03-10
申请人： Wolfgang Vollrath , Thomas Krieg
发明人： Wolfgang Vollrath , Thomas Krieg
CPC分类号： G01N21/9501
摘要： Examination devices and methods operating with incident light have hitherto been used for the examination of wafers. To allow these devices also to be used with the transmitted-light method, it is proposed to configure the substrate holder (16) so that an illumination device (38, 40, 42) is integrated into the substrate holder (16) in such a way that transmitted-light illumination of the wafer (18) is possible.
摘要翻译： 迄今为止，使用入射光操作的检查装置和方法用于检查晶片。 为了使这些装置也能够与透射光方法一起使用，建议将衬底保持器（16）配置成使得照明装置（38,40,42）以这样的方式集成到衬底保持器（16）中 使得晶片（18）的透射光照射是可能的。
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公开(公告)号：US20080144025A1
公开(公告)日：2008-06-19
申请号：US11999611
申请日：2007-12-06
IPC分类号： G01J3/00
CPC分类号： G01N21/9501 , G01N21/8806
摘要： An apparatus for inspecting a wafer, comprising at least one illuminator each arranged in an illumination beam path, wherein the at least one illuminator radiates an illumination spot onto a surface of the wafer and being a continuous light source; a detector arranged in a detection beam path has a predetermined spectral sensitivity and records data from the at least one illumination spot from the surface of the wafer; an imager generating a relative movement between the surface of the wafer and the detector, whereby in a meandering movement the illumination spot is passed across the entire surface of the wafer in the scanning direction; and the at least one illumination spot being detected in a plurality of different spectral ranges.
摘要翻译： 一种用于检查晶片的装置，包括每个布置在照明光束路径中的至少一个照明器，其中所述至少一个照明器将照明点辐射到所述晶片的表面上并且是连续的光源; 布置在检测光束路径中的检测器具有预定的光谱灵敏度并记录来自晶片表面的至少一个照明点的数据; 成像器在晶片的表面和检测器之间产生相对运动，由此在曲折运动中，照射点在扫描方向上穿过晶片的整个表面; 并且所述至少一个照明点在多个不同的光谱范围内被检测。
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公开(公告)号：US07268867B2
公开(公告)日：2007-09-11
申请号：US11076620
申请日：2005-03-10
申请人： Wolfgang Vollrath , Thomas Krieg
发明人： Wolfgang Vollrath , Thomas Krieg
CPC分类号： G01N21/9501
摘要： Examination devices and methods operating with incident light have hitherto been used for the examination of wafers. To allow these devices also to be used with the transmitted-light method, it is proposed to configure the substrate holder (16) so that an illumination device (38, 40, 42) is integrated into the substrate holder (16) in such a way that transmitted-light illumination of the wafer (18) is possible.
摘要翻译： 迄今为止，使用入射光操作的检查装置和方法用于检查晶片。 为了使这些装置也能够与透射光方法一起使用，建议将衬底保持器（16）配置成使得照明装置（38,40,42）以这样的方式集成到衬底保持器（16）中 使得晶片（18）的透射光照射是可能的。
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公开(公告)号：US20100295938A1
公开(公告)日：2010-11-25
申请号：US12716612
申请日：2010-03-03
申请人： Kurt Hahn , Roland Hedrich , Gerhard Hoppen , Lambert Danner , Albert Kreh , Wolfgang Vollrath , Alexander Büttner , Christof Krampe-Zadler , Henning Backhauss , Hermann Bittner
发明人： Kurt Hahn , Roland Hedrich , Gerhard Hoppen , Lambert Danner , Albert Kreh , Wolfgang Vollrath , Alexander Büttner , Christof Krampe-Zadler , Henning Backhauss , Hermann Bittner
IPC分类号： H04N7/18
CPC分类号： G01N21/9501 , G01N2021/8825
摘要： An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.
摘要翻译： 公开了一种用于光学检查晶片的设备（1），其包括：组装单元（10），其承载用于明场照明的至少一个照明路径（3）的光学元件（30,31,32,33），以及 用于暗场照明的至少一个照明路径（5,6,7,8）的光学元件（50,51,52,60,61,62,70,71,72,80,81,82）。 组装单元（10）还承载至少一个检测路径（91,92）的多个光学元件（91,92,93,94,95,96,97,98,99,100）。 用于明场照明（30）的至少一个照明路径（3）的成像光学元件（32），用于暗场照明的至少一个照明路径的成像光学元件（51,61,71,81） ，并且所述至少一个检测路径（9）的成像光学元件（91,95,96）被设计成使得所有照明路径（3,5,6,7,8）和所有检测路径（91， 92）是远心的。
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7.发明申请DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER 审中-公开用于检查WAF边缘区域缺陷的装置和方法公开(公告)号：US20090279080A1
公开(公告)日：2009-11-12
申请号：US12494858
申请日：2009-06-30
申请人： Lambert Danner , Michael Heiden , Wolfgang Vollrath , Alexander Buttner , Christof Krampe-Zadler
发明人： Lambert Danner , Michael Heiden , Wolfgang Vollrath , Alexander Buttner , Christof Krampe-Zadler
IPC分类号： G01N21/88
CPC分类号： G01N21/9503 , G01N2021/8825
摘要： A method, a device and the application for the inspection of defects on the edge region of a wafer (6) is disclosed. At least one illumination device (41) illuminates the edge region (6a) of the wafer (6). At least one optical unit (40) is provided, said optical unit (40) being positionable subject to the position of the defect (88) relative to a top surface (30) of the edge of the wafer (6a) or a bottom surface (31) of the edge of the wafer (6a) or a face (32) of the edge of the wafer (6a) for capturing an image of said defect.
摘要翻译： 公开了一种用于检查晶片（6）的边缘区域上的缺陷的方法，装置和应用。 至少一个照明装置（41）照亮晶片（6）的边缘区域（6a）。 提供至少一个光学单元（40），所述光学单元（40）可相对于所述晶片（6a）的边缘的顶表面（30）定位以抵抗所述缺陷（88）的位置或底表面 （6a）的边缘的边缘（31）或晶片（6a）的边缘的面（32），用于捕获所述缺陷的图像。
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公开(公告)号：US08451440B2
公开(公告)日：2013-05-28
申请号：US12716612
申请日：2010-03-03
申请人： Kurt Hahn , Roland Hedrich , Gerhard Hoppen , Lambert Danner , Albert Kreh , Wolfgang Vollrath , Alexander Büttner , Christof Krampe-Zadler , Henning Backhauss , Hermann Bittner
发明人： Kurt Hahn , Roland Hedrich , Gerhard Hoppen , Lambert Danner , Albert Kreh , Wolfgang Vollrath , Alexander Büttner , Christof Krampe-Zadler , Henning Backhauss , Hermann Bittner
CPC分类号： G01N21/9501 , G01N2021/8825
摘要： An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.
摘要翻译： 公开了一种用于光学检查晶片的设备（1），其包括：组装单元（10），其承载用于明场照明的至少一个照明路径（3）的光学元件（30,31,32,33），以及 用于暗场照明的至少一个照明路径（5,6,7,8）的光学元件（50,51,52,60,61,62,70,71,72,80,81,82）。 组装单元（10）还承载至少一个检测路径（91,92）的多个光学元件（91,92,93,94,95,96,97,98,99,100）。 用于明场照明（30）的至少一个照明路径（3）的成像光学元件（32），用于暗场照明的至少一个照明路径的成像光学元件（51,61,71,81） ，并且所述至少一个检测路径（9）的成像光学元件（91,95,96）被设计成使得所有照明路径（3,5,6,7,8）和所有检测路径（91， 92）是远心的。
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9.发明授权Device and method for evaluating defects in the edge area of a wafer and use of the device in inspection system for wafers 有权用于评估晶片边缘区域中的缺陷并在晶片检查系统中使用该装置的装置和方法公开(公告)号：US08089622B2
公开(公告)日：2012-01-03
申请号：US12039047
申请日：2008-02-28
CPC分类号： G01N21/9503
摘要： A device for evaluating defects in the edge area of a wafer (6) is disclosed. The evaluation may also be performed automatically. In particular, the device includes three cameras (25, 26, 27), each provided with an objective (30), wherein a first camera (25) is arranged such that the first camera (25) is opposite to an edge area on the upper surface (6a) of the wafer (6), wherein a second camera (26) is arranged such that the second camera (26) is opposite to a front surface (6b) of the wafer (6), and wherein a third camera (27) is arranged such that the third camera (27) is opposite to an edge area on the lower surface (6c) of the wafer (6).
摘要翻译： 公开了一种用于评估晶片（6）的边缘区域中的缺陷的装置。 评价也可以自动进行。 特别地，该装置包括三个相机（25,26,27），每个相机设置有物镜（30），其中第一相机（25）布置成使得第一相机（25）与第一相机 晶片（6）的上表面（6a），其中第二相机（26）布置成使得第二相机（26）与晶片（6）的前表面（6b）相对，并且其中第三相机 （27）被布置成使得第三相机（27）与晶片（6）的下表面（6c）上的边缘区域相对。
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公开(公告)号：US20090034832A1
公开(公告)日：2009-02-05
申请号：US12220532
申请日：2008-07-25
IPC分类号： G06K9/00
CPC分类号： G01N21/9501
摘要： A device and a method for scanning the whole surface of a wafer are disclosed. The wafer is deposited on a table movable in the X-coordinate direction and in the Y-coordinate direction. A camera and at least one illumination source are arranged opposite the wafer. The camera is a line camera with a detector row, wherein the length of the detector row is less than the diameter of the wafer.
摘要翻译： 公开了一种用于扫描晶片的整个表面的装置和方法。 晶片沉积在可沿X坐标方向和Y坐标方向移动的工作台上。 照相机和至少一个照明源布置在晶片对面。 相机是具有检测器行的线相机，其中检测器行的长度小于晶片的直径。
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