公开(公告)号：US09306138B2

公开(公告)日：2016-04-05

申请号：US14742538

申请日：2015-06-17

Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Chih-Wei Chao ,  Yen-Chih Chiang

IPC: H01L33/60 ,  H01L33/38 ,  H01L33/46 ,  H01L33/20 ,  H01L33/50 ,  H01L33/48 ,  H01L33/64 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/20 ,  H01L33/34 ,  H01L33/385 ,  H01L33/46 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L33/642

Abstract: A packaging structure of a vertical LED chip includes at least a support system, a glue cup that connects to periphery of the support system, a LED chip with light absorption substrate over the support system and packaging glue distributed in periphery of the LED chip, wherein the packaging structure also comprises a baffle that surrounds the outer side wall of the light absorption substrate. Adding of a baffle structure in the support system of the packaging structure can effectively prevent light from being absorbed by the light absorption substrate and reflect such light out of the packaging structure, thus increasing probability of light emitting and improving light intensity of the vertical LED chip.

Abstract translation: 垂直LED芯片的封装结构至少包括支撑系统，连接到支撑系统的周边的胶杯，在支撑系统上具有吸光基板的LED芯片和分布在LED芯片周边的封装胶，其中 封装结构还包括围绕光吸收衬底的外侧壁的挡板。 在包装结构的支撑系统中添加挡板结构可以有效地防止光被光吸收基板吸收并将这种光反射出包装结构，从而增加发光的可能性并提高垂直LED芯片的光强度 。