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    PREDICTIVE MODELING OF CONTACT AND VIA MODULES FOR ADVANCED ON-CHIP INTERCONNECT TECHNOLOGY
    1.
    发明申请
    PREDICTIVE MODELING OF CONTACT AND VIA MODULES FOR ADVANCED ON-CHIP INTERCONNECT TECHNOLOGY 失效
    联系方式的预测建模与先进的片上互连技术模块

    公开(公告)号：US20100057411A1

    公开(公告)日：2010-03-04

    申请号：US12493110

    申请日：2009-06-26

    申请人： Xia Li ,  Wei Zhao ,  David Bang ,  Yu Cao ,  Seung H. Kang ,  Matthew Nowak

    发明人： Xia Li ,  Wei Zhao ,  David Bang ,  Yu Cao ,  Seung H. Kang ,  Matthew Nowak

    IPC分类号： G06F17/50 ,  G06F17/10

    CPC分类号： G06F17/5036

    摘要： A computer program product estimates performance of a back end of line (BEOL) structure of a semiconductor integrated circuit (IC). Code executes on a computer to dynamically predict an electrical resistance of the BEOL structure based on input data specific to multiple layers of the BEOL structure. The BEOL structure can be a contact or a via. The layers of the contact/via include an inner filling material and an outer liner. The code accounts for a width scatter effect of the inner filling material, as well as a slope profile of the contact/via.

    摘要翻译： 计算机程序产品估计半导体集成电路（IC）的后端（BEOL）结构的性能。 代码在计算机上执行，以基于特定于BEOL结构的多个层的输入数据来动态地预测BEOL结构的电阻。 BEOL结构可以是一个触点或通孔。 接触/通孔的层包括内部填充材料和外部衬垫。 该代码考虑了内部填充材料的宽度散射效应，以及接触/通孔的斜率分布。

    Predictive modeling of contact and via modules for advanced on-chip interconnect technology
    2.
    发明授权
    Predictive modeling of contact and via modules for advanced on-chip interconnect technology 失效
    用于高级片上互连技术的接触和通孔模块的预测建模

    公开(公告)号：US08483997B2

    公开(公告)日：2013-07-09

    申请号：US12493110

    申请日：2009-06-26

    申请人： Xia Li ,  Wei Zhao ,  David Bang ,  Yu Cao ,  Seung H. Kang ,  Matthew Nowak

    发明人： Xia Li ,  Wei Zhao ,  David Bang ,  Yu Cao ,  Seung H. Kang ,  Matthew Nowak

    IPC分类号： G06F7/60

    CPC分类号： G06F17/5036

    摘要： A computer program product estimates performance of a back end of line (BEOL) structure of a semiconductor integrated circuit (IC). Code executes on a computer to dynamically predict an electrical resistance of the BEOL structure based on input data specific to multiple layers of the BEOL structure. The BEOL structure can be a contact or a via. The layers of the contact/via include an inner filling material and an outer liner. The code accounts for a width scatter effect of the inner filling material, as well as a slope profile of the contact/via.

    摘要翻译： 计算机程序产品估计半导体集成电路（IC）的后端（BEOL）结构的性能。 代码在计算机上执行，以基于特定于BEOL结构的多个层的输入数据来动态地预测BEOL结构的电阻。 BEOL结构可以是一个触点或通孔。 接触/通孔的层包括内部填充材料和外部衬垫。 该代码考虑了内部填充材料的宽度散射效应，以及接触/通孔的斜率分布。

    Predictive Modeling of Interconnect Modules for Advanced On-Chip Interconnect Technology
    3.
    发明申请
    Predictive Modeling of Interconnect Modules for Advanced On-Chip Interconnect Technology 失效
    用于高级片上互连技术的互连模块的预测建模

    公开(公告)号：US20090327983A1

    公开(公告)日：2009-12-31

    申请号：US12474297

    申请日：2009-05-29

    申请人： Xia Li ,  Wei Zhao ,  Yu Cao ,  Shiqun Gu ,  Seung H. Kang ,  Matthew Nowak

    发明人： Xia Li ,  Wei Zhao ,  Yu Cao ,  Shiqun Gu ,  Seung H. Kang ,  Matthew Nowak

    IPC分类号： G06F17/50

    CPC分类号： G06F17/5036

    摘要： A computer program product estimates performance of an interconnect structure of a semiconductor integrated circuit (IC). The program product includes code executing on a computer to calculate at least one electrical characteristic of the interconnect structure based on input data accounting for multiple layers of the interconnect structure. The electrical characteristics can be capacitance, resistance, and/or inductance. The capacitance may be based upon multiple components, including a fringe capacitance component, a terminal capacitance component, and a coupling capacitance component.

    摘要翻译： 计算机程序产品估计半导体集成电路（IC）的互连结构的性能。 程序产品包括在计算机上执行的代码，用于基于考虑到互连结构的多层的输入数据来计算互连结构的至少一个电特性。 电气特性可以是电容，电阻和/或电感。 电容可以基于多个分量，包括边缘电容分量，端子电容分量和耦合电容分量。

    Predictive modeling of interconnect modules for advanced on-chip interconnect technology
    4.
    发明授权
    Predictive modeling of interconnect modules for advanced on-chip interconnect technology 失效
    用于先进片上互连技术的互连模块的预测建模

    公开(公告)号：US08429577B2

    公开(公告)日：2013-04-23

    申请号：US12474297

    申请日：2009-05-29

    申请人： Xia Li ,  Wei Zhao ,  Yu Cao ,  Shiqun Gu ,  Seung H. Kang ,  Matthew Nowak

    发明人： Xia Li ,  Wei Zhao ,  Yu Cao ,  Shiqun Gu ,  Seung H. Kang ,  Matthew Nowak

    IPC分类号： G06F9/455 ,  G06F17/50

    CPC分类号： G06F17/5036

    摘要： A computer program product estimates performance of an interconnect structure of a semiconductor integrated circuit (IC). The program product includes code executing on a computer to calculate at least one electrical characteristic of the interconnect structure based on input data accounting for multiple layers of the interconnect structure. The electrical characteristics can be capacitance, resistance, and/or inductance. The capacitance may be based upon multiple components, including a fringe capacitance component, a terminal capacitance component, and a coupling capacitance component.

    摘要翻译： 计算机程序产品估计半导体集成电路（IC）的互连结构的性能。 程序产品包括在计算机上执行的代码，用于基于考虑到互连结构的多层的输入数据来计算互连结构的至少一个电特性。 电气特性可以是电容，电阻和/或电感。 电容可以基于多个分量，包括边缘电容分量，端子电容分量和耦合电容分量。

    Systems and methods for signaling for semi-static configuration in grant-free uplink transmissions
    8.
    发明授权
    Systems and methods for signaling for semi-static configuration in grant-free uplink transmissions 有权

    公开(公告)号：US11516826B2

    公开(公告)日：2022-11-29

    申请号：US16544274

    申请日：2019-08-19

    申请人： Yu Cao ,  Liqing Zhang ,  Jianglei Ma

    发明人： Yu Cao ,  Liqing Zhang ,  Jianglei Ma

    IPC分类号： H04W72/12 ,  H04L1/18 ,  H04W28/04 ,  H04W72/14 ,  H04W74/00 ,  H04L5/00 ,  H04W72/04 ,  H04L1/00

    摘要： Methods and systems are provided for signaling for semi-static configuration in grant free uplink transmissions. Radio resource control (RRC) signaling is used to provide information from a base station to a user equipment (UE) that configure the grant free transmission resource to be used by the UE. In some implementations, the RRC signaling may be used in conjunction with system information that is transmitted to all UEs and/or Downlink Control Information (DCI) that the UE needs to access subsequent to the RRC signaling. In some implementations, the DCI includes an activation or deactivation indicator that the UE monitors to determine when the UE is allowed to transmit to the BS or should stop transmitting. Implementations allow for grant free transmission resources to be configured on an individual user based and a group basis.

    Methods and apparatus for sidelink communications and resource allocation
    9.
    发明授权
    Methods and apparatus for sidelink communications and resource allocation 有权

    公开(公告)号：US11044748B2

    公开(公告)日：2021-06-22

    申请号：US16392827

    申请日：2019-04-24

    申请人： Yu Cao ,  Amine Maaref ,  Jianglei Ma

    发明人： Yu Cao ,  Amine Maaref ,  Jianglei Ma

    IPC分类号： H04W72/14 ,  H04W4/40 ,  H04W72/12

    摘要： A user equipment (UE) receives a message that indicates a sidelink (SL) communication resource configuration to be used by the UE for communicating SL control information and SL data between the UE and another UE. The UE transmits SL control information according to the SL communication resource configuration, and transmits SL data according to the SL communication resource configuration. The SL control information and the SL data are transmitted by the UE without the UE receiving, in a downlink control information (DCI), a grant of communication resources.