公开(公告)号：US07927087B2

公开(公告)日：2011-04-19

申请号：US11052566

申请日：2005-02-07

申请人： Xiang Chen ,  Shu Chuen Ho ,  Teng Hock Eric Kuah ,  Si Liang Lu ,  See Yap Ong

发明人： Xiang Chen ,  Shu Chuen Ho ,  Teng Hock Eric Kuah ,  Si Liang Lu ,  See Yap Ong

IPC分类号： B29C45/00

CPC分类号： B29C45/02 ,  B29C45/14655 ,  B29C45/27 ,  B29C45/586

摘要： An apparatus and process are provided for molding electronic devices in a mold, which apparatus comprises at least one runner in the mold connected to a mold supply pot for channeling a molding compound from the mold supply pot to the electronic devices. A plunger assembly is also provided that comprises a main body, and a supplementary body configured to be movable relative to the main body. The plunger assembly is locatable in the mold supply pot and is drivable in a direction towards the runner for forcing the molding compound into the runner. In order to avoid or reduce cull formation, a width of the runner at an opening connecting the runner to the mold supply pot is smaller than a width of the main body of the plunger assembly.

摘要翻译： 提供了用于在模具中模制电子装置的装置和方法，该装置包括在模具中的至少一个流道，其连接到模具供应罐，用于将模制化合物从模具供应罐引导到电子装置。 还提供了一种柱塞组件，其包括主体和构造成相对于主体可移动的辅助主体。 柱塞组件可定位在模具供应罐中，并且可以在朝着流道的方向上驱动，以迫使模塑料进入流道。 为了避免或减少ull形，在连接流道与模具供应罐的开口处的流道宽度小于柱塞组件主体的宽度。

公开(公告)号：US09346205B2

公开(公告)日：2016-05-24

申请号：US12578745

申请日：2009-10-14

申请人： Shu Chuen Ho ,  Teng Hock Eric Kuah ,  Ji Yuan Hao ,  Ee Ling Chiw ,  See Yap Ong

发明人： Shu Chuen Ho ,  Teng Hock Eric Kuah ,  Ji Yuan Hao ,  Ee Ling Chiw ,  See Yap Ong

IPC分类号： B29D11/00 ,  B29C45/26 ,  B29C33/68 ,  B29C45/14 ,  B29C45/02

CPC分类号： B29C45/2608 ,  B29C33/68 ,  B29C45/02 ,  B29C45/14008 ,  B29C45/14655 ,  B29C45/2602 ,  B29D11/00807 ,  H01L2924/0002 ,  H01L2924/00

摘要： A substrate having a plurality of protrusion members on its surface is molded by a molding system comprising first and second molds cooperating to apply a clamping force onto the substrate for molding, and a middle plate located between the first and second molds such that the substrate is clamped between the middle plate and the first mold during molding. A plurality of molding cavities is located on the second mold and through-holes formed in the middle plate correspond to positions of the molding cavities, such that each through-hole is sized and configured for inserting a protrusion member of the substrate to enable each protrusion member to be in communication with a molding cavity of the second mold. Molding compound is molded onto the protrusion members by the molding cavities during molding.

摘要翻译： 在其表面上具有多个突起构件的基板通过模制系统模制，该模制系统包括第一和第二模具，其协作以将夹紧力施加到用于模制的基板上，以及位于第一模具和第二模具之间的中间板， 在模制过程中夹在中间板和第一个模具之间。 多个模制腔位于第二模具上，并且形成在中间板中的通孔对应于模腔的位置，使得每个通孔的尺寸和构造适于插入基板的突出构件，以使每个凸起 构件与第二模具的模制空腔连通。 在模塑过程中，模塑料通过模腔模塑在突起构件上。

公开(公告)号：US06752896B2

公开(公告)日：2004-06-22

申请号：US09901142

申请日：2001-07-10

申请人： See Yap Ong ,  Keng Hock Chew ,  Shu Chuen Ho ,  Teng Hock Kuah

发明人： See Yap Ong ,  Keng Hock Chew ,  Shu Chuen Ho ,  Teng Hock Kuah

IPC分类号： B32B0000

CPC分类号： H01L21/67132 ,  B29C63/0013 ,  H01L21/67092 ,  Y10S29/001 ,  Y10S156/941 ,  Y10T29/49815 ,  Y10T29/49819 ,  Y10T29/49822 ,  Y10T29/53274 ,  Y10T29/53465 ,  Y10T29/53683 ,  Y10T156/1137 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1906

摘要： A method of detaching a film of material (2) from the surface (5) of a substrate (1). An outlet (11) of a fluid delivery device (10) is engaged with an aperture (7, 8) in the substrate (1) from the opposite side of the substrate (1) from the surface (5) to which the film (2) is attached. Fluid is passed out of the outlet (11) and through the aperture (7, 8) to generate a detaching force between the film of material (2) and the surface (5) adjacent to the aperture (7, 8).

摘要翻译： 从衬底（1）的表面（5）分离材料（2）的膜的方法。 流体输送装置（10）的出口（11）与衬底（1）的与衬底（1）的相反侧的孔（7,8）与表面（5）接合，膜 2）。 流体从出口（11）中通过并通过孔（7,8），以在材料膜（2）和邻近孔（7,8）的表面（5）之间产生分离力。

公开(公告)号：US06808661B2

公开(公告)日：2004-10-26

申请号：US10013079

申请日：2001-12-11

申请人： See Yap Ong ,  Kock Hien Wee ,  Shu Chuen Ho ,  Teng Hock Kuah ,  Jian Wu

发明人： See Yap Ong ,  Kock Hien Wee ,  Shu Chuen Ho ,  Teng Hock Kuah ,  Jian Wu

IPC分类号： B29C3108

CPC分类号： B29C45/14655 ,  B29C45/1701 ,  B29C45/18 ,  B29C70/72 ,  B29C2045/14868

摘要： A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the molds. To reduce the level of dust which enters the molding region, the path along which the leadframe items are conveyed to the molding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the molding region under a cover including a vacuum source, so that the dust is continually sucked away from them.

摘要翻译： 提出一种用于封装在塑料材料引线框架中的系统，其包括连接到引线框的IC。 塑料材料的粉尘从包封系统中除去，特别是从灰尘主要积聚的物品（如模具表面）中除去。 为了降低进入模制区域的灰尘的水平，引导框架物品被输送到模制区域的路径在引导框架物品未被运送到那里时被关闭。 此外，引线框架物品被输送到包括真空源的盖子下方的模制区域，使得灰尘被连续地从它们中吸出。

公开(公告)号：US07030504B2

公开(公告)日：2006-04-18

申请号：US10449938

申请日：2003-05-30

申请人： Shu Chuen Ho ,  Jie Liu ,  See Yap Ong

发明人： Shu Chuen Ho ,  Jie Liu ,  See Yap Ong

IPC分类号： H01L23/28

CPC分类号： H01L21/67126 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention provides a molding system for encapsulating a piece of substrate having a plurality of molding sections. The system comprises a molding device operative to separately encapsulate each molding section with a molding compound and indexing means operative to position said molding sections of the substrate relative to the molding device for encapsulation.

摘要翻译： 本发明提供了一种用于封装具有多个模制部分的基片的模制系统。 该系统包括模制装置，其可操作以用模制化合物单独地封装每个模制部分，并且分度装置可操作以相对于模制装置定位基板的模制部分以进行封装。

公开(公告)号：US06656320B2

公开(公告)日：2003-12-02

申请号：US09901141

申请日：2001-07-10

申请人： See Yap Ong ,  Tong Heng Cheah ,  Shu Chuen Ho ,  Teng Hock Kuah

发明人： See Yap Ong ,  Tong Heng Cheah ,  Shu Chuen Ho ,  Teng Hock Kuah

IPC分类号： B32B3500

CPC分类号： H01L21/6835 ,  Y10S156/941 ,  Y10T29/49819 ,  Y10T29/49822 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1989

摘要： A resin body is moulded around a die located on the front surface of a lead frame, and subsequently masking tape adhered to the rear surface of the lead frame is peeled away. While the tape is peeled away, the front surface of the lead frame is clamped by a surface which contains, or which can be deformed to contain, a recess for receiving the resin body. The peeling is performed by firstly separating an edge portion of the tape from the lead frame by a diagonal motion; and subsequently moving the edge portion across the lead frame so as to peel back the tape until its adhered surface faces away from the lead frame. A retrieval plate is urged against the adhered surface, so that the adhered surface becomes adhered to the retrieval plate. This process is repeated for successive lead frames, so that a stack of masking tape sections is formed on the retrieval plate.

摘要翻译： 将树脂体模制在位于引线框架的前表面上的模具周围，随后将附着在引线框架的后表面上的胶带剥离。 当胶带被剥离时，引线框架的前表面由包含用于接收树脂体的凹部的容纳或可变形的表面夹紧。 通过首先将引线框架的边缘部分与对角线运动分离来进行剥离; 并且随后将边缘部分移动穿过引线框架，以便剥离带，直到其粘合表面背离引线框架。 将取出板推靠在粘接面上，使粘接面附着在回卷板上。 对于连续的引线框架重复该过程，使得在拾取板上形成一叠遮蔽带部分。

公开(公告)号：US07695269B2

公开(公告)日：2010-04-13

申请号：US11753917

申请日：2007-05-25

申请人： See Yap Ong ,  Si Liang Lu ,  Zheng Yu Gao ,  Swee Huat Lee

发明人： See Yap Ong ,  Si Liang Lu ,  Zheng Yu Gao ,  Swee Huat Lee

IPC分类号： B29C45/38

CPC分类号： B29C45/38 ,  B29C45/02 ,  B29C45/14655

摘要： An apparatus and method for degating is provided for separating excess molding material from encapsulated electronic packages while the electronic packages are located in a molding system. At least one holding device is coupled to a mold of the molding system, which is located such that excess molding material is molded onto at least a portion of the holding device during molding. A locking feature on the portion of the holding device locks the excess molding material such that the holding device may hold the excess molding material molded onto it to forcibly separate the excess molding material from the encapsulated electronic packages after molding.

摘要翻译： 提供了用于脱胶的装置和方法，用于在电子封装位于模制系统中时将多余的模制材料与封装的电子封装分离。 至少一个保持装置联接到模制系统的模具，其被定位成使得在模制期间将多余的模制材料模制到保持装置的至少一部分上。 保持装置的部分上的锁定特征锁定多余的模制材料，使得保持装置可以保持模制在其上的多余的模制材料，以在模制之后强制地将多余的模制材料与封装的电子封装分开。

公开(公告)号：US08011917B2

公开(公告)日：2011-09-06

申请号：US11746291

申请日：2007-05-09

申请人： Ji Yuan Hao ,  See Yap Ong ,  Jian Xiong Su ,  Teng Hock Kuah ,  Ee Ling Chiw

发明人： Ji Yuan Hao ,  See Yap Ong ,  Jian Xiong Su ,  Teng Hock Kuah ,  Ee Ling Chiw

IPC分类号： H01L21/56 ,  A01J21/00

CPC分类号： B29C43/18 ,  B29C33/0022 ,  B29C33/10 ,  B29C33/68 ,  B29C43/361 ,  B29C2043/3623 ,  B29K2105/0002

摘要： A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities.

摘要翻译： 包括第一和第二半模的压缩模制系统被提供用于电子设备，其中在对应于电子设备上的模制位置的第一半模中形成多个空腔。 多个柱塞位于第一半模中，每个活塞可以相对于相应空腔的侧面驱动，用于在模制期间对位于空腔中的封装材料施加压实力。 马达可操作地连接到柱塞，用于相对于空腔驱动柱塞。

公开(公告)号：US09199396B2

公开(公告)日：2015-12-01

申请号：US12836645

申请日：2010-07-15

申请人： Teng Hock Kuah ,  See Yap Ong ,  Ji Yuan Hao ,  Kai Wu ,  Ee Ling Chiw

发明人： Teng Hock Kuah ,  See Yap Ong ,  Ji Yuan Hao ,  Kai Wu ,  Ee Ling Chiw

IPC分类号： B29C45/14 ,  B29C45/40 ,  B29L11/00

CPC分类号： B29C45/14639 ,  B29C45/14065 ,  B29C45/14778 ,  B29C45/40 ,  B29L2011/00

摘要： A method of molding a substrate containing a plurality of electronic devices by providing a carrier comprising a frame which includes an adhesive film. The substrate is mounted onto the adhesive film of the carrier such that the frame surrounds the substrate. The carrier is placed in a mold such that the frame is located at a clamping area of the mold and the substrate is located at a molding area of the mold where molding cavities are located. The frame is clamped at the clamping area while the electronic devices are located in the molding cavities for molding with an encapsulant.

摘要翻译： 一种通过提供包括包括粘合剂膜的框架的载体来模制包含多个电子装置的基板的方法。 将基板安装在载体的粘合膜上，使得框架围绕基板。 将载体放置在模具中，使得框架位于模具的夹紧区域，并且基板位于模制空腔所在的模具的模制区域。 框架被夹紧在夹紧区域，而电子设备位于模制空腔中以用密封剂成型。