Magnetic storage element utilizing improved pinned layer stack
    2.
    发明授权
    Magnetic storage element utilizing improved pinned layer stack 有权
    使用改进的钉扎层堆叠的磁存储元件

    公开(公告)号:US08564080B2

    公开(公告)日:2013-10-22

    申请号:US12837535

    申请日:2010-07-16

    IPC分类号: H01L29/82 G11C11/02

    CPC分类号: H01L43/08

    摘要: A magnetic tunnel junction (MTJ) storage element may comprise a pinned layer stack and a first functional layer. The pinned layer stack is formed of a plurality of layers comprising a bottom pinned layer, a coupling layer, and a top pinned layer. The first functional layer is disposed in the bottom pinned layer or the top pinned layer.

    摘要翻译: 磁性隧道结(MTJ)存储元件可以包括钉扎层堆叠和第一功能层。 钉扎层堆叠由包括底部钉扎层,耦合层和顶部钉扎层的多个层形成。 第一功能层设置在底部钉扎层或顶部钉扎层中。

    STRAIN INDUCED REDUCTION OF SWITCHING CURRENT IN SPIN-TRANSFER TORQUE SWITCHING DEVICES
    3.
    发明申请
    STRAIN INDUCED REDUCTION OF SWITCHING CURRENT IN SPIN-TRANSFER TORQUE SWITCHING DEVICES 有权
    转子扭矩开关装置中开关电流的应变诱导减小

    公开(公告)号:US20130062714A1

    公开(公告)日:2013-03-14

    申请号:US13358694

    申请日:2012-01-26

    IPC分类号: H01L29/82 H01L21/02

    摘要: Partial perpendicular magnetic anisotropy (PPMA) type magnetic random access memory cells are constructed using processes and structural configurations that induce a directed static strain/stress on an MTJ to increase the perpendicular magnetic anisotropy. Consequently, reduced switching current of the MTJ results. The directed static strain/stress on the MTJ is induced in a controlled direction and/or with a controlled magnitude during fabrication. The MTJ is permanently subject to a predetermined directed stress and permanently includes the directed static strain/strain that provides reduced switching current.

    摘要翻译: 使用在MTJ上引起定向静态应变/应力以增加垂直磁各向异性的工艺和结构构造来构造部分垂直磁各向异性(PPMA)型磁性随机存取存储器单元。 因此,MTJ的开关电流降低。 在制造过程中,受控方向和/或受控幅度诱发MTJ上的定向静态应变/应力。 MTJ永久地受到预定的定向应力,并且永久地包括提供减小的开关电流的定向静态应变/应变。

    Strain induced reduction of switching current in spin-transfer torque switching devices
    4.
    发明授权
    Strain induced reduction of switching current in spin-transfer torque switching devices 有权
    应变引起自旋传递转矩开关器件中开关电流的减小

    公开(公告)号:US08704320B2

    公开(公告)日:2014-04-22

    申请号:US13358694

    申请日:2012-01-26

    IPC分类号: H01L29/82 H01L43/00

    摘要: Partial perpendicular magnetic anisotropy (PPMA) type magnetic random access memory cells are constructed using processes and structural configurations that induce a directed static strain/stress on an MTJ to increase the perpendicular magnetic anisotropy. Consequently, reduced switching current of the MTJ results. The directed static strain/stress on the MTJ is induced in a controlled direction and/or with a controlled magnitude during fabrication. The MTJ is permanently subject to a predetermined directed stress and permanently includes the directed static strain/strain that provides reduced switching current.

    摘要翻译: 使用在MTJ上引起定向静态应变/应力以增加垂直磁各向异性的工艺和结构构造来构造部分垂直磁各向异性(PPMA)型磁性随机存取存储器单元。 因此,MTJ的开关电流降低。 在制造过程中,受控方向和/或受控幅度诱发MTJ上的定向静态应变/应力。 MTJ永久地受到预定的定向应力,并且永久地包括提供减小的开关电流的定向静态应变/应变。

    Magnetic Storage Element Utilizing Improved Pinned Layer Stack
    5.
    发明申请
    Magnetic Storage Element Utilizing Improved Pinned Layer Stack 有权
    磁存储元件利用改进的固定层堆栈

    公开(公告)号:US20120012952A1

    公开(公告)日:2012-01-19

    申请号:US12837535

    申请日:2010-07-16

    IPC分类号: H01L29/82 H01L21/02

    CPC分类号: H01L43/08

    摘要: A magnetic tunnel junction (MTJ) storage element may comprise a pinned layer stack and a first functional layer. The pinned layer stack is formed of a plurality of layers comprising a bottom pinned layer, a coupling layer, and a top pinned layer. The first functional layer is disposed in the bottom pinned layer or the top pinned layer.

    摘要翻译: 磁性隧道结(MTJ)存储元件可以包括钉扎层堆叠和第一功能层。 钉扎层堆叠由包括底部钉扎层,耦合层和顶部钉扎层的多个层形成。 第一功能层设置在底部钉扎层或顶部钉扎层中。

    Magnetic Tunnel Junction (MTJ) on Planarized Electrode
    6.
    发明申请
    Magnetic Tunnel Junction (MTJ) on Planarized Electrode 有权
    平面电极上的磁隧道结(MTJ)

    公开(公告)号:US20110175181A1

    公开(公告)日:2011-07-21

    申请号:US12777529

    申请日:2010-05-11

    IPC分类号: H01L29/82 H01L21/28

    CPC分类号: H01L43/12 H01L43/08

    摘要: A magnetic tunnel junction (MTJ) with direct contact is manufactured having lower resistances, improved yield, and simpler fabrication. The lower resistances improve both read and write processes in the MTJ. The MTJ layers are deposited on a bottom electrode aligned with the bottom metal. An etch stop layer may be deposited adjacent to the bottom metal to prevent overetch of an insulator surrounding the bottom metal. The bottom electrode is planarized before deposition of the MTJ layers to provide a substantially flat surface. Additionally, an underlayer may be deposited on the bottom electrode before the MTJ layers to promote desired characteristics of the MTJ.

    摘要翻译: 具有直接接触的磁性隧道结(MTJ)被制造成具有较低的电阻,提高的产量和更简单的制造。 较低的电阻提高了MTJ中的读取和写入过程。 MTJ层沉积在与底部金属对准的底部电极上。 蚀刻停止层可以沉积在底部金属附近,以防止围绕底部金属的绝缘体的过蚀刻。 在沉积MTJ层之前将底部电极平坦化以提供基本平坦的表面。 另外,可以在MTJ层之前的底部电极上沉​​积底层以促进MTJ的期望特性。

    Magnetic tunnel junction (MTJ) on planarized electrode
    7.
    发明授权
    Magnetic tunnel junction (MTJ) on planarized electrode 有权
    平面化电极上的磁隧道结(MTJ)

    公开(公告)号:US08681536B2

    公开(公告)日:2014-03-25

    申请号:US12777529

    申请日:2010-05-11

    IPC分类号: G11C11/22

    CPC分类号: H01L43/12 H01L43/08

    摘要: A magnetic tunnel junction (MTJ) with direct contact is manufactured having lower resistances, improved yield, and simpler fabrication. The lower resistances improve both read and write processes in the MTJ. The MTJ layers are deposited on a bottom electrode aligned with the bottom metal. An etch stop layer may be deposited adjacent to the bottom metal to prevent overetch of an insulator surrounding the bottom metal. The bottom electrode is planarized before deposition of the MTJ layers to provide a substantially flat surface. Additionally, an underlayer may be deposited on the bottom electrode before the MTJ layers to promote desired characteristics of the MTJ.

    摘要翻译: 具有直接接触的磁性隧道结(MTJ)被制造成具有较低的电阻,提高的产量和更简单的制造。 较低的电阻提高了MTJ中的读取和写入过程。 MTJ层沉积在与底部金属对准的底部电极上。 蚀刻停止层可以沉积在底部金属附近,以防止围绕底部金属的绝缘体的过蚀刻。 在沉积MTJ层之前将底部电极平坦化以提供基本平坦的表面。 另外,可以在MTJ层之前的底部电极上沉​​积底层以促进MTJ的期望特性。