公开(公告)号：US20170092619A1

公开(公告)日：2017-03-30

申请号：US14867349

申请日：2015-09-28

Applicant: Xilinx, Inc.

Inventor： Gamal Refai-Ahmed ,  Tien-Yu Lee ,  Ferdinand F. Fernandez ,  Suresh Ramalingam ,  Ivor G. Barber ,  Inderjit Singh ,  Nael Zohni

IPC: H01L25/065 ,  H01L23/06 ,  H01L23/373 ,  H01L25/00 ,  H01L23/00 ,  H01L23/10 ,  H01L23/367

CPC classification number: H01L23/373 ,  H01L21/4882 ,  H01L23/04 ,  H01L23/16 ,  H01L23/367 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/473 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/35121

Abstract: A method and apparatus are provided which improve heat transfer between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes a first IC die, a package substrate, a lid and a stiffener. The first IC die is coupled to the package substrate. The stiffener is coupled to the package substrate and circumscribes the first IC die. The lid has a first surface and a second surface. The second surface faces away from the first surface and towards the first IC die. The second surface of the lid is conductively coupled to the IC die, while the lid is mechanically decoupled from the stiffener.

公开(公告)号：US10043730B2

公开(公告)日：2018-08-07

申请号：US14867349

申请日：2015-09-28

Applicant: Xilinx, Inc.

Inventor： Gamal Refai-Ahmed ,  Tien-Yu Lee ,  Ferdinand F. Fernandez ,  Suresh Ramalingam ,  Ivor G. Barber ,  Inderjit Singh ,  Nael Zohni

IPC: H01L23/10 ,  H01L23/367 ,  H01L25/065 ,  H01L23/373 ,  H01L25/00 ,  H01L23/16 ,  H01L25/18 ,  H01L23/04 ,  H01L23/473 ,  H01L21/48 ,  H01L23/00 ,  H01L23/40

Abstract: A method and apparatus are provided which improve heat transfer between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes a first IC die, a package substrate, a lid and a stiffener. The first IC die is coupled to the package substrate. The stiffener is coupled to the package substrate and circumscribes the first IC die. The lid has a first surface and a second surface. The second surface faces away from the first surface and towards the first IC die. The second surface of the lid is conductively coupled to the IC die, while the lid is mechanically decoupled from the stiffener.