摘要:
Example embodiments disclose a semiconductor device having an on-die termination (ODT) structure that reduces current consumption, and a termination method performed in the semiconductor device. The semiconductor device includes a calibration circuit for generating calibration codes in response to a reference voltage and a voltage of a calibration terminal connected to an external resistor and an on-die termination device for controlling a termination resistance of a data input/output pad in response to the calibration codes and an on-die termination control signal. The termination resistance of the data input/output pad is greater than a resistance of the calibration terminal.
摘要:
Example embodiments disclose a semiconductor device having an on-die termination (ODT) structure that reduces current consumption, and a termination method performed in the semiconductor device. The semiconductor device includes a calibration circuit for generating calibration codes in response to a reference voltage and a voltage of a calibration terminal connected to an external resistor and an on-die termination device for controlling a termination resistance of a data input/output pad in response to the calibration codes and an on-die termination control signal. The termination resistance of the data input/output pad is greater than a resistance of the calibration terminal.
摘要:
A semiconductor device receives a command corresponding to a memory access operation and performs the memory access operation after an additive latency period. The additive latency period begins when the command is received. The semiconductor device comprises a phase controller for controlling a phase of a clock signal and outputting a phase-controlled clock signal, and a controller for generating and outputting a control signal for enabling the phase controller that is disabled, at a predetermined time in the additive latency period.
摘要:
A semi-dual reference voltage data receiving apparatus includes a first input buffer, a second input buffer, and a phase detector wherein the first input buffer includes a first input receiving unit, a first sense amplifier, and a first current offset controlling unit. The first sense amplifier senses and amplifies the voltage difference between the voltage of a first terminal of a first input transistor and the voltage of a first terminal of a second input transistor. The first current offset controlling unit controls the offset of the current that flows through the second terminal of the second input transistor.
摘要:
The DLL circuit includes a control circuit which controls bias currents of the unit delay circuits according to an externally input column address strobe writing latency (CWL) signal, and/or a DCC control circuit which adjusts steps of a DCC current of the DCC according to the externally input column address strobe writing latency (CWL) signal. The CWL signal may be input by a semiconductor memory device and may be indicative of a column address strobe writing latency of the semiconductor memory device. The semiconductor memory device may be a double data rate (DDR) synchronous DRAM (SDRAM) device.
摘要:
A semiconductor device includes an on-die termination (ODT) latency clock control circuit and an ODT circuit controlled by the ODT latency clock control circuit. The ODT latency clock control circuit includes an ODT enable signal generator receiving an ODT signal input through an ODT pad of the ODT circuit, and generating an ODT enable signal, and an ODT latency clock generator generating a plurality of ODT latency clocks in response to the ODT enable signal. The ODT enable signal includes an enabling period of a first logic level and a disabling period of a second and different logic level, and the ODT enable signal generator generates the ODT enable signal by increasing the width of the enabling period by a predetermined clock cycle and only generating the clocks during the increased enabling period.
摘要:
Provided is a semiconductor device for performing a calibration operation without an external ZQ calibration command and a calibration method thereof. The semiconductor device includes a calibration circuit for performing a pull-down calibration operation in response to a pull-down calibration enable signal and a command control unit for generating the pull-down calibration enable signal in response to a DLL reset signal. The calibration method includes adjusting an impedance of a first pull-up resistance structure in response to pull-up calibration codes having a default value. A pull-down calibration enable signal may be generated in response to a DLL reset signal. A voltage of the first node and a reference voltage are compared by a comparator. The comparator outputs pull-down calibration codes based on the comparison. An impedance of a pull-down resistance structure is adjusted, so a resistance of the pull-down resistance structure is equal to a resistance of the first pull-up resistance structure.
摘要:
The DLL circuit includes a control circuit which controls bias currents of the unit delay circuits according to an externally input column address strobe writing latency (CWL) signal, and/or a DCC control circuit which adjusts steps of a DCC current of the DCC according to the externally input column address strobe writing latency (CWL) signal. The CWL signal may be input by a semiconductor memory device and may be indicative of a column address strobe writing latency of the semiconductor memory device. The semiconductor memory device may be a double data rate (DDR) synchronous DRAM (SDRAM) device.
摘要:
A semiconductor memory device that includes a supply voltage pad, a ground voltage pad, and at least two data input/output pads arranged between the supply voltage pad and the ground voltage pad. The semiconductor memory device has a first pull-up driver that is connected to the second data input/output pad located at a first distance from the supply voltage pad, and a first pull-down driver that is connected to the first data input/output pad located at a second distance from the ground voltage pad.
摘要:
A semiconductor memory device that includes a supply voltage pad, a ground voltage pad, and at least two data input/output pads arranged between the supply voltage pad and the ground voltage pad. The semiconductor memory device has a first pull-up driver that is connected to the second data input/output pad located at a first distance from the supply voltage pad, and a first pull-down driver that is connected to the first data input/output pad located at a second distance from the ground voltage pad.