摘要:
A light emitting device is provided with a semiconductor light emitting element and a wavelength conversion portion. The wavelength conversion portion includes an outer peripheral portion between an input surface and an output surface. The outer peripheral portion includes a first inclined part at a side of the input surface and a second inclined part at a side of the output surface. The first inclined part and the second inclined part define a projecting portion that is projected on the outer peripheral portion.
摘要:
A light emitting device is provided with a semiconductor light emitting element and a wavelength conversion portion. The wavelength conversion portion includes an outer peripheral portion between an input surface and an output surface. The outer peripheral portion includes a first inclined part at a side of the input surface and a second inclined part at a side of the output surface. The first inclined part and the second inclined part define a projecting portion that is projected on the outer peripheral portion.
摘要:
In a light emitting module 40, a semiconductor light emitting element 48 is configured by forming an electrode pattern to which a current for light emission is supplied on the light emitting surface 48a. A light wavelength conversion member 52 is formed to be transparent and to convert the wavelength of the light emitted by the semiconductor light emitting element 48 and to emit the light from the emitting surface 52a. In the light wavelength conversion member 52, a plurality of protruding portions 52b are provided on the emitting surface 52a at an arrangement interval smaller than the repeating pattern interval in the electrode pattern. Each of the plurality of protruding portions 52b is formed into a hemispherical shape. In addition, the plurality of protruding portions 52b are provided on the emitting surface 52a at an arrangement interval of 300 μm or less.
摘要:
A light emitting module includes: a plurality of semiconductor light emitting elements; a substrate by which the arranged plurality of semiconductor light emitting elements are supported; and a plate-shaped light wavelength conversion component that is provided so as to face the light emitting surfaces of the plurality of semiconductor light emitting elements and that converts the wavelength of the light emitted by the semiconductor light emitting element. A phosphor layer has a shielding portion formed in the boundary between respective areas facing the respective light emitting surfaces of the adjacent semiconductor light emitting elements.
摘要:
In a light emitting module board, an electrode receiving the supply of current for light emission is provided in the light emitting surface of a semiconductor light emitting device. A light wavelength conversion member is a plate-like member mounted on the light emitting surface, and emits light after converting the wavelength of the light emitted by the semiconductor light emitting device. A relay electrode is provided in the surface of the light wavelength conversion member. The relay electrode extends from a position in contact with the electrode to an exposed position in the external space in a state where the light wavelength conversion member is mounted on the light emitting surface. The relay electrode is provided so that the upper part of the relay electrode, which is the exposed position, extends to a position located opposite to the lower part of the relay electrode which is the contacted position.
摘要:
A light emitting module includes a board on which a plurality of light emitting devices are mounted, a first interconnecting section having first interconnections, one end of each of which being connected to one of an anode side and an cathode side of an associated one of the light emitting devices, a second interconnecting section having second interconnections, one end of each of which being connected to the other of the anode side and the cathode side of an associated one of the light emitting devices, and a power supply portion provided along one side of the board to receive an external power. The second interconnecting section has at least one, but less than the number of the second interconnections, collectively interconnecting portion to which another end of each of the second interconnections is connected.
摘要:
A light emitting module includes: a plurality of semiconductor light emitting elements; a substrate by which the arranged plurality of semiconductor light emitting elements are supported; and a plate-shaped light wavelength conversion component that is provided so as to face the light emitting surfaces of the plurality of semiconductor light emitting elements and that converts the wavelength of the light emitted by the semiconductor light emitting element. A phosphor layer has a shielding portion formed in the boundary between respective areas facing the respective light emitting surfaces of the adjacent semiconductor light emitting elements.
摘要:
A light emitting module includes a board on which a plurality of light emitting devices are mounted, a first interconnecting section having first interconnections, one end of each of which being connected to one of an anode side and an cathode side of an associated one of the light emitting devices, a second interconnecting section having second interconnections, one end of each of which being connected to the other of the anode side and the cathode side of an associated one of the light emitting devices, and a power supply portion provided along one side of the board to receive an external power. The second interconnecting section has at least one, but less than the number of the second interconnections, collectively interconnecting portion to which another end of each of the second interconnections is connected.
摘要:
In a light emission module (40), a light wavelength conversion ceramic (52) is formed in a sheet shape which converts the wavelength of the light emitted from a semiconductor light emission element (48) when emitting the light. The light wavelength conversion ceramic (52) has a tapered plane (52a) which is inclined to approach the semiconductor light emission element (48) toward the brim portion. The light wavelength conversion ceramic (52) is transparent and is arranged so that the light emission wavelength band after the conversion has an all ray permeability of 40% or above.
摘要:
In a light emission module (40), a light wavelength conversion ceramic (52) is formed in a sheet shape which converts the wavelength of the light emitted from a semiconductor light emission element (48) when emitting the light. The light wavelength conversion ceramic (52) has a tapered plane (52a) which is inclined to approach the semiconductor light emission element (48) toward the brim portion. The light wavelength conversion ceramic (52) is transparent and is arranged so that the light emission wavelength band after the conversion has an all ray permeability of 40% or above.