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公开(公告)号：US20070045233A1
公开(公告)日：2007-03-01
申请号：US11544694
申请日：2006-10-10
CPC分类号： C09K13/06 , C09G1/02 , C23F3/00 , C23F3/04 , C23F3/06 , H01L21/31053 , H01L21/3212
摘要： A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.
摘要翻译： 抛光液组合物可用作在半导体衬底上形成嵌入金属互连的手段。 在包括绝缘层和金属互连层的待抛光表面中，抛光液组合物能够保持金属层的抛光速度，抑制蚀刻速度，并且防止金属层的凹陷。
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公开(公告)号：US20060240672A1
公开(公告)日：2006-10-26
申请号：US11434074
申请日：2006-05-16
IPC分类号： H01L21/461 , B44C1/22 , H01L21/302 , C03C15/00
CPC分类号： C09K13/06 , C09G1/02 , C23F3/00 , C23F3/04 , C23F3/06 , H01L21/31053 , H01L21/3212
摘要： A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.
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公开(公告)号：US07118685B1
公开(公告)日：2006-10-10
申请号：US10030424
申请日：2000-07-07
申请人： Yasuhiro Yoneda , Ryoichi Hashimoto
发明人： Yasuhiro Yoneda , Ryoichi Hashimoto
IPC分类号： C09K13/00 , C09K13/04 , C09K13/06 , H01L21/302
CPC分类号： C09K13/06 , C09G1/02 , C23F3/00 , C23F3/04 , C23F3/06 , H01L21/31053 , H01L21/3212
摘要： A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.
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公开(公告)号：US20060117666A1
公开(公告)日：2006-06-08
申请号：US11328149
申请日：2006-01-10
CPC分类号： C09G1/02 , C09K3/1463 , H01L21/31053
摘要： A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.
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公开(公告)号：US07604751B2
公开(公告)日：2009-10-20
申请号：US11434074
申请日：2006-05-16
IPC分类号： H01L21/302
CPC分类号： C09K13/06 , C09G1/02 , C23F3/00 , C23F3/04 , C23F3/06 , H01L21/31053 , H01L21/3212
摘要： A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.
摘要翻译： 抛光液组合物可用作在半导体衬底上形成嵌入金属互连的手段。 在包括绝缘层和金属互连层的待抛光表面中，抛光液组合物能够保持金属层的抛光速度，抑制蚀刻速度，并且防止金属层的凹陷。
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公开(公告)号：US07247082B2
公开(公告)日：2007-07-24
申请号：US11328149
申请日：2006-01-10
IPC分类号： C09K13/06
CPC分类号： C09G1/02 , C09K3/1463 , H01L21/31053
摘要： A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.
摘要翻译： 1.一种抛光组合物，其特征在于，包括：绝缘膜的抛光速度与阻挡膜的研磨速度的比例的提高剂，其中所述阻挡膜的研磨速度选择性地降低，所述抛光组合物包含一种或多种选自以下的化合物：单胺或 二胺化合物; 在其分子中具有三个或更多个氨基的多胺; 含醚基的胺; 和具有氮原子的杂环化合物。 抛光组合物可以用于将已经嵌入以隔离的绝缘膜去除形成在硅衬底上的沟槽并沉淀在沟槽外部，从而平面化硅衬底的表面。
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公开(公告)号：US07059941B2
公开(公告)日：2006-06-13
申请号：US10701606
申请日：2003-11-06
IPC分类号： C09K13/06
CPC分类号： C09G1/02 , C09K3/1463 , H01L21/31053
摘要： A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.
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公开(公告)号：US06607687B1
公开(公告)日：2003-08-19
申请号：US09674149
申请日：2000-10-27
申请人： Makoto Okubo , Kazuhiko Kiuchi , Ryoichi Hashimoto , Takayuki Nomura , Masahiro Mori , Kenichi Miyamoto
发明人： Makoto Okubo , Kazuhiko Kiuchi , Ryoichi Hashimoto , Takayuki Nomura , Masahiro Mori , Kenichi Miyamoto
IPC分类号： B29C3360
CPC分类号： B29C67/246 , B29C33/60 , B29C33/64
摘要： Process for producing a molded article comprising pouring or injecting a liquid molding material into a mold in the presence of a surface-treating agent comprising a contact angle-reducing substance under the condition that the contact angle between the liquid molding material and the inner surface of the mold is not more than 30°, and curing the liquid molding material; surface-treating agent comprising a contact angle-reducing substance which reduces the contact angle between the liquid molding material and a flat plate made of the same material as the mold to not more than 30°; method for reducing surface voids during molding, comprising using the above surface-treating agent; and use of the above surface-treating agent for reducing surface voids. The molded article has a shape accurately corresponding to the shape of an inner surface of a mold.
摘要翻译： 一种成型体的制造方法，其特征在于，在含有接触角减少物质的表面处理剂的存在下，在液态成型材料与内表面的接触角为 模具不超过30°，并固化液体成型材料; 表面处理剂包括将液态成型材料与由模具相同的材料制成的平板之间的接触角降低到30度以下的接触角减小物质; 包括使用上述表面处理剂的在模制期间减少表面空隙的方法; 并使用上述表面处理剂来减少表面空隙。 模制品具有与模具的内表面的形状精确对应的形状。
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公开(公告)号：US20130261214A1
公开(公告)日：2013-10-03
申请号：US13992158
申请日：2011-12-12
申请人： Munehisa Okutsu , Ryoichi Hashimoto
发明人： Munehisa Okutsu , Ryoichi Hashimoto
IPC分类号： C08K5/521
CPC分类号： C08K5/521 , B29C51/002 , B29C51/10 , B29C55/12 , B29K2067/046 , B29K2995/006 , C08J5/18 , C08J2367/04 , C08L67/04
摘要： A polylactic acid resin composition containing a polylactic acid resin; and a compound represented by the formula (I), the compound being contained in an amount of from 0.1 to 30 parts by weight, based on 100 parts by weight of the polylactic acid resin; a sheet obtained with the composition, a stretched film or thermoformed article obtained by secondary forming of the sheet; and a wrapping material made of the stretched film or thermoformed article. The polylactic acid resin composition of the present invention can be suitably used in various industrial applications, such as daily sundries, household electric appliance parts, and automobile parts.
摘要翻译： 含有聚乳酸树脂的聚乳酸树脂组合物; 和由式（I）表示的化合物，相对于100重量份的聚乳酸树脂，该化合物的含量为0.1〜30重量份。 用该组合物获得的片材，通过二次成型片材获得的拉伸膜或热成型制品; 以及由拉伸膜或热成型制品制成的包装材料。 本发明的聚乳酸树脂组合物可以适用于日用杂货，家用电器零件，汽车部件等各种工业用途。
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10.发明授权Process for the production of glass-like carbon substrates for use as recording media and a setter for use in the process 失效用于生产用作记录介质的玻璃状碳基板和用于该方法的固定器的方法
公开(公告)号：US5613848A
公开(公告)日：1997-03-25
申请号：US454628
申请日：1995-05-31
摘要： A supporting shaft 11 that can be inserted through a center hole 5a in each of cured resin disks 5 and which has a bottom plate in a disk form at an end, as well as a plurality of spacer disks 12 each having a center hole through which the supporting shaft 11 can be inserted are used in the process of manufacturing GC (glass-like carbon) by baking to carbonize the cured resin disks 5. The cured resin disks 5 are stacked alternately with the spacer disks 12 on the supporting shaft 11 in an erect position that is inserted through the center holes in each of the cured resin and spacer disks. The stack is then baked in a baking furnace. By so doing, the cured resin disks can be set up easily and the baking furnace can be operated to its full capacity.
摘要翻译： 一个支撑轴11，其可以穿过固化树脂盘5中的中心孔5a插入，并且其端部具有圆盘形状的底板，以及多个间隔盘12，每个间隔盘12具有中心孔， 可以将支撑轴11插入到通过烘烤来制造GC（玻璃状碳）的过程中，以使固化的树脂盘5碳化。将固化的树脂盘5与支撑轴11上的间隔盘12交替堆叠 通过每个固化树脂和间隔盘中的中心孔插入的直立位置。 然后将该堆叠在烘烤炉中烘烤。 通过这样做，可以容易地设置固化的树脂盘，并且烘烤炉可以充分运行。
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