METHOD FOR FABRICATING FLEXIBLE ELECTRONIC DEVICE AND ELECTRONIC DEVICE FABRICATED THEREBY
    3.
    发明申请
    METHOD FOR FABRICATING FLEXIBLE ELECTRONIC DEVICE AND ELECTRONIC DEVICE FABRICATED THEREBY 审中-公开
    制造柔性电子器件的方法及其制造的电子器件

    公开(公告)号:US20120115259A1

    公开(公告)日:2012-05-10

    申请号:US13292772

    申请日:2011-11-09

    CPC分类号: H01M10/052 H01M10/058

    摘要: Disclosed are a method for fabricating a flexible electronic device using laser lift-off and an electronic device fabricated thereby. More particularly, disclosed are a method for fabricating a flexible electronic device using laser lift-off allowing for fabrication of a flexible electronic device in an economical and stable way by separating a device such as a secondary battery fabricated on a sacrificial substrate using laser, and an electronic device fabricated thereby.

    摘要翻译: 公开了一种使用激光剥离制造柔性电子装置的方法和由此制造的电子装置。 更具体地,公开了一种使用激光剥离制造柔性电子器件的方法,其通过使用激光器分离诸如在牺牲基板上制造的二次电池的器件,以经济和稳定的方式制造柔性电子器件,以及 由此制造的电子设备。

    MANUFACTURING METHOD FOR FLEXIBLE DEVICE AND FLEXIBLE DEVICE MANUFACTURED BY THE SAME
    4.
    发明申请
    MANUFACTURING METHOD FOR FLEXIBLE DEVICE AND FLEXIBLE DEVICE MANUFACTURED BY THE SAME 审中-公开
    柔性装置的制造方法及其制造的柔性装置

    公开(公告)号:US20130082361A1

    公开(公告)日:2013-04-04

    申请号:US13396302

    申请日:2012-02-14

    IPC分类号: H01L29/02 H01L21/762

    摘要: Provided are a method of manufacturing a flexible device and a flexible device manufactured thereby.The method of manufacturing a flexible device according to the present disclosure includes: fabricating a device on an upper silicon layer of a silicon-on-insulator (SOI) substrate comprising a lower silicon layer, an insulation layer and the upper silicon layer stacked sequentially; adhering a second silicon substrate to the upper silicon layer; removing the lower silicon layer; transferring the upper silicon layer with the device fabricated to a flexible substrate using the second silicon substrate; and stacking a passivation layer on the flexible substrate, wherein the device is located at a position of a neutral mechanical plane of the entire device as the passivation layer is stacked.

    摘要翻译: 提供一种制造柔性装置的方法和由此制造的柔性装置。 根据本公开的制造柔性器件的方法包括:在绝缘体上硅(SOI)衬底的上硅层上制造器件,其包括依次堆叠的下硅层,绝缘层和上硅层; 将第二硅衬底粘附到所述上硅层; 去除下硅层; 使用所述第二硅衬底将所述上硅层与所制造的器件转移到柔性衬底; 以及在所述柔性基板上堆叠钝化层,其中当所述钝化层被堆叠时,所述器件位于整个器件的中性机械平面的位置。