公开(公告)号：US08822970B2

公开(公告)日：2014-09-02

申请号：US13401449

申请日：2012-02-21

申请人： Yeon Sik Jung ,  Keon Jae Lee ,  Jae Won Jeong ,  Jae Suk Choi ,  Geon Tae Hwang ,  Beom Ho Mun ,  Byoung Kuk You ,  Seung Jun Kim

发明人： Yeon Sik Jung ,  Keon Jae Lee ,  Jae Won Jeong ,  Jae Suk Choi ,  Geon Tae Hwang ,  Beom Ho Mun ,  Byoung Kuk You ,  Seung Jun Kim

IPC分类号： H01L47/00

CPC分类号： H01L45/06 ,  H01L27/2409 ,  H01L27/2436 ,  H01L27/2463 ,  H01L45/08 ,  H01L45/1233 ,  H01L45/126 ,  H01L45/144 ,  H01L45/146 ,  H01L45/1675

摘要： Provided are a phase-change memory device using insulating nanoparticles, a flexible phase-change memory device and a method for manufacturing the same. The phase-change memory device includes an electrode, and a phase-change layer in which a phase change occurs depending on heat generated from the electrode, wherein insulating nanoparticles formed from a self-assembled block copolymer are provided between the electrode and the phase-change layer undergoing crystallization and amorphization.

摘要翻译： 提供了使用绝缘纳米颗粒的相变存储器件，柔性相变存储器件及其制造方法。 相变存储器件包括电极和相变层，其中根据从电极产生的热量发生相变，其中由自组装的嵌段共聚物形成的绝缘纳米颗粒设置在电极和相 - 改变层正在进行结晶和非晶化。

公开(公告)号：US20130001502A1

公开(公告)日：2013-01-03

申请号：US13401449

申请日：2012-02-21

申请人： Yeon Sik JUNG ,  Keon Jae Lee ,  Jae Won Jeong ,  Jae Suk Choi ,  Geon Tae Hwang ,  Beom Ho Mun ,  Byoung Kuk You ,  Seung Jun Kim

发明人： Yeon Sik JUNG ,  Keon Jae Lee ,  Jae Won Jeong ,  Jae Suk Choi ,  Geon Tae Hwang ,  Beom Ho Mun ,  Byoung Kuk You ,  Seung Jun Kim

IPC分类号： H01L45/00 ,  H01L21/02

CPC分类号： H01L45/06 ,  H01L27/2409 ,  H01L27/2436 ,  H01L27/2463 ,  H01L45/08 ,  H01L45/1233 ,  H01L45/126 ,  H01L45/144 ,  H01L45/146 ,  H01L45/1675

摘要： Provided are a phase-change memory device using insulating nanoparticles, a flexible phase-change memory device and a method for manufacturing the same. The phase-change memory device includes an electrode, and a phase-change layer in which a phase change occurs depending on heat generated from the electrode, wherein insulating nanoparticles formed from a self-assembled block copolymer are provided between the electrode and the phase-change layer undergoing crystallization and amorphization.

摘要翻译： 提供了使用绝缘纳米颗粒的相变存储器件，柔性相变存储器件及其制造方法。 相变存储器件包括电极和相变层，其中根据从电极产生的热量发生相变，其中由自组装的嵌段共聚物形成的绝缘纳米颗粒设置在电极和相 - 改变层正在进行结晶和非晶化。

公开(公告)号：US20120133247A1

公开(公告)日：2012-05-31

申请号：US13307870

申请日：2011-11-30

申请人： Keon Jae Lee ,  Kwi-Il Park ,  Do Kyung Kim ,  Sang Ouk Kim ,  Geon-Tae Hwang

发明人： Keon Jae Lee ,  Kwi-Il Park ,  Do Kyung Kim ,  Sang Ouk Kim ,  Geon-Tae Hwang

IPC分类号： H02N2/18 ,  H01L41/22 ,  H01L41/18 ,  B82Y99/00

CPC分类号： H01L41/37 ,  B82Y30/00 ,  H01L41/113 ,  H01L41/183

摘要： There are provided a flexible nanocomposite generator and a method of manufacturing the same. A flexible nanocomposite generator according to the present invention includes a piezoelectric layer formed of a flexible matrix containing piezoelectric nanoparticles and carbon nanostructures; and electrode layers disposed on the upper and lower surfaces of both sides of the piezoelectric layer, in which according to a method for manufacturing a flexible nanocomposite generator according to the present invention and a flexible nanogenerator, it is possible to manufacture a flexible nanogenerator with a large area and a small thickness. Therefore, the nanogenerator may be used as a portion of a fiber or cloth. Accordingly, the nanogenerator according to the present invention generates power in accordance with bending of attached cloth, such that it is possible to continuously generate power in accordance with movement of a human body.

摘要翻译： 提供了一种柔性纳米复合发生器及其制造方法。 根据本发明的柔性纳米复合发生器包括由含有压电纳米颗粒和碳纳米结构的柔性基体形成的压电层; 以及设置在压电体层的两侧的上表面和下表面上的电极层，其中根据本发明的柔性纳米复合材料发生器的制造方法和柔性纳米发生器，可以制造具有 面积大，厚度小。 因此，纳米发生器可以用作纤维或布的一部分。 因此，根据本发明的纳米发生器根据附着的布的弯曲产生动力，使得可以根据人体的运动连续发电。

公开(公告)号：US08803406B2

公开(公告)日：2014-08-12

申请号：US13307870

申请日：2011-11-30

申请人： Keon Jae Lee ,  Kwi-Il Park ,  Do Kyung Kim ,  Sang Ouk Kim ,  Geon-Tae Hwang

发明人： Keon Jae Lee ,  Kwi-Il Park ,  Do Kyung Kim ,  Sang Ouk Kim ,  Geon-Tae Hwang

IPC分类号： H01L41/113 ,  H01L41/18

CPC分类号： H01L41/37 ,  B82Y30/00 ,  H01L41/113 ,  H01L41/183

摘要： There are provided a flexible nanocomposite generator and a method of manufacturing the same. A flexible nanocomposite generator according to the present invention includes a piezoelectric layer formed of a flexible matrix containing piezoelectric nanoparticles and carbon nanostructures; and electrode layers disposed on the upper and lower surfaces of both sides of the piezoelectric layer, in which according to a method for manufacturing a flexible nanocomposite generator according to the present invention and a flexible nanogenerator, it is possible to manufacture a flexible nanogenerator with a large area and a small thickness. Therefore, the nanogenerator may be used as a portion of a fiber or cloth. Accordingly, the nanogenerator according to the present invention generates power in accordance with bending of attached cloth, such that it is possible to continuously generate power in accordance with movement of a human body.

摘要翻译： 提供了一种柔性纳米复合发生器及其制造方法。 根据本发明的柔性纳米复合发生器包括由含有压电纳米颗粒和碳纳米结构的柔性基体形成的压电层; 以及设置在压电体层的两侧的上表面和下表面上的电极层，其中根据本发明的柔性纳米复合材料发生器的制造方法和柔性纳米发生器，可以制造具有 面积大，厚度小。 因此，纳米发生器可以用作纤维或布的一部分。 因此，根据本发明的纳米发生器根据附着的布的弯曲产生动力，使得可以根据人体的运动连续发电。

公开(公告)号：US08557619B2

公开(公告)日：2013-10-15

申请号：US12852463

申请日：2010-08-07

申请人： Keon Jae Lee ,  Sang Yong Lee ,  Seung Jun Kim

发明人： Keon Jae Lee ,  Sang Yong Lee ,  Seung Jun Kim

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  H01L27/153 ,  H01L33/0079

摘要： A method of manufacturing LED display is provided. The method provides a sacrificial substrate on which RGB LED device layers are formed, respectively. The method etches and patterns the LED device layer to manufacture RGB LED devices, respectively. The method removes the sacrificial substrate in a lower side of the LED device. The method contacts a stamping processor to the RGB LED devices to separate the RGB LED devices from the sacrificial substrate. The method transfers the LED device, which is attached to the stamping processor, to a receiving substrate.

摘要翻译： 提供了一种制造LED显示器的方法。 该方法分别提供形成RGB LED器件层的牺牲基板。 该方法分别对LED器件层进行蚀刻和图案分别制造RGB LED器件。 该方法移除LED器件下侧的牺牲衬底。 该方法将冲压处理器与RGB LED器件接触，以将RGB LED器件与牺牲衬底分离。 该方法将附接到冲压处理器的LED装置传送到接收基板。

公开(公告)号：US20110057211A1

公开(公告)日：2011-03-10

申请号：US12852463

申请日：2010-08-07

申请人： Keon Jae Lee ,  Sang Yong Lee ,  Seung Jun Kim

发明人： Keon Jae Lee ,  Sang Yong Lee ,  Seung Jun Kim

IPC分类号： H01L33/08 ,  H01L33/00

CPC分类号： H01L21/00 ,  H01L27/153 ,  H01L33/0079

摘要： A method of manufacturing LED display is provided. The method provides a sacrificial substrate on which RGB LED device layers are formed, respectively. The method etches and patterns the LED device layer to manufacture RGB LED devices, respectively. The method removes the sacrificial substrate in a lower side of the LED device. The method contacts a stamping processor to the RGB LED devices to separate the RGB LED devices from the sacrificial substrate. The method transfers the LED device, which is attached to the stamping processor, to a receiving substrate.

摘要翻译： 提供了一种制造LED显示器的方法。 该方法分别提供形成RGB LED器件层的牺牲基板。 该方法分别对LED器件层进行蚀刻和图案分别制造RGB LED器件。 该方法移除LED器件下侧的牺牲衬底。 该方法将冲压处理器与RGB LED器件接触，以将RGB LED器件与牺牲衬底分离。 该方法将附接到冲压处理器的LED装置传送到接收基板。

公开(公告)号：US08440546B2

公开(公告)日：2013-05-14

申请号：US13113504

申请日：2011-05-23

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC分类号： H01L21/322

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：US08039847B2

公开(公告)日：2011-10-18

申请号：US12844492

申请日：2010-07-27

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

IPC分类号： H01L29/72 ,  H01L21/31 ,  B65C11/02 ,  C23F1/00

CPC分类号： H01L29/72 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02628 ,  H01L21/30 ,  H01L21/3083 ,  H01L21/31612 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/1606 ,  H01L29/66265 ,  H01L29/66462 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

摘要翻译： 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：US20090294803A1

公开(公告)日：2009-12-03

申请号：US11145574

申请日：2005-06-02

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC分类号： H01L29/772 ,  H01L27/12 ,  H01L21/782 ,  H01L21/30 ,  H01L29/06 ,  H01L29/861

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

摘要翻译： 本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。 本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。 本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

公开(公告)号：US20110174377A1

公开(公告)日：2011-07-21

申请号：US13010108

申请日：2011-01-20

申请人： Keon Jae Lee ,  Sang Yong Lee

发明人： Keon Jae Lee ,  Sang Yong Lee

IPC分类号： H01L31/0264 ,  H01L21/30 ,  H01L29/20

摘要： Provided are a method of manufacturing a flexible device and the flexible device, a solar cell, and a light emitting device. The method of manufacturing a flexible device includes providing a device layer on a sacrificial substrate, contacting a flexible substrate on one side surface of the device layer, and removing the sacrificial substrate. A large area device may be transferred onto the flexible substrate with superior alignment to realize and manufacture the flexible device. In addition, since mass production is possible, the economic feasibility may be superior. Also, when a large area solar cell having a thin thickness is manufactured, since a limitation such as twisting of a thin film of a solar cell may be effectively solved, the economic feasibility and stability may be superior.

摘要翻译： 提供了制造柔性装置和柔性装置，太阳能电池和发光装置的方法。 柔性器件的制造方法包括在牺牲基片上提供器件层，与器件层的一个侧表面上的柔性衬底接触，以及去除牺牲衬底。 可以将大面积的装置转移到具有较高对准的柔性基板上，以实现和制造柔性装置。 另外，由于批量生产是可行的，经济可行性也可能更高。 此外，当制造厚度薄的大面积太阳能电池时，由于可以有效地解决太阳能电池薄膜的扭转等限制，所以经济可行性和稳定性可以优异。