公开(公告)号：US08440546B2

公开(公告)日：2013-05-14

申请号：US13113504

申请日：2011-05-23

Applicant: Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

Inventor： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC: H01L21/322

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：US20120171825A1

公开(公告)日：2012-07-05

申请号：US13412959

申请日：2012-03-06

Applicant: Fujio Masuoka ,  Keon Jae LEE

Inventor： Fujio Masuoka ,  Keon Jae LEE

IPC: H01L21/8238

CPC classification number: H01L29/7827 ,  H01L21/823807 ,  H01L21/823828 ,  H01L21/823885 ,  H01L27/0922 ,  H01L29/045 ,  H01L29/0657 ,  H01L29/42356 ,  H01L29/66666 ,  H01L29/78642

Abstract: In contrast to a conventional planar CMOS technique in design and fabrication for a field-effect transistor (FET), the present invention provides an SGT CMOS device formed on a conventional substrate using various crystal planes in association with a channel type and a pillar shape of an FET, without a need for a complicated device fabrication process. Further, differently from a design technique of changing a surface orientation in each planar FET, the present invention is designed to change a surface orientation in each SGT to achieve improvement in carrier mobility. Thus, a plurality of SGTs having various crystal planes can be formed on a common substrate to achieve a plurality of different carrier mobilities so as to obtain desired performance.

Abstract translation: 与用于场效应晶体管（FET）的设计和制造中的常规平面CMOS技术相反，本发明提供了一种SGT CMOS器件，其形成在常规基板上，该传统基板使用与通道类型和柱形 FET，而不需要复杂的器件制造工艺。 此外，与改变每个平面FET中的表面取向的设计技术不同，本发明被设计为改变每个SGT中的表面取向以实现载流子迁移率的改善。 因此，可以在公共基板上形成具有各种晶面的多个SGT，以实现多种不同的载流子迁移率，从而获得期望的性能。

公开(公告)号：US08039847B2

公开(公告)日：2011-10-18

申请号：US12844492

申请日：2010-07-27

Applicant: Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

Inventor： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

IPC: H01L29/72 ,  H01L21/31 ,  B65C11/02 ,  C23F1/00

CPC classification number: H01L29/72 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02628 ,  H01L21/30 ,  H01L21/3083 ,  H01L21/31612 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/1606 ,  H01L29/66265 ,  H01L29/66462 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

Abstract translation: 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：US20140191236A1

公开(公告)日：2014-07-10

申请号：US14155010

申请日：2014-01-14

Applicant: Ralph G. NUZZO ,  John A. ROGERS ,  Etienne MENARD ,  Keon Jae LEE ,  Dahl-Young KHANG ,  Yugang SUN ,  Matthew MEITL ,  Zhengtao ZHU

Inventor： Ralph G. NUZZO ,  John A. ROGERS ,  Etienne MENARD ,  Keon Jae LEE ,  Dahl-Young KHANG ,  Yugang SUN ,  Matthew MEITL ,  Zhengtao ZHU

IPC: H01L29/06 ,  H01L29/04

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Abstract translation: 本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。 本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。 本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

公开(公告)号：US20090294803A1

公开(公告)日：2009-12-03

申请号：US11145574

申请日：2005-06-02

Applicant: Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

Inventor： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC: H01L29/772 ,  H01L27/12 ,  H01L21/782 ,  H01L21/30 ,  H01L29/06 ,  H01L29/861

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Abstract translation: 本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。 本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。 本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

公开(公告)号：US20130001502A1

公开(公告)日：2013-01-03

申请号：US13401449

申请日：2012-02-21

Applicant: Yeon Sik JUNG ,  Keon Jae Lee ,  Jae Won Jeong ,  Jae Suk Choi ,  Geon Tae Hwang ,  Beom Ho Mun ,  Byoung Kuk You ,  Seung Jun Kim

Inventor： Yeon Sik JUNG ,  Keon Jae Lee ,  Jae Won Jeong ,  Jae Suk Choi ,  Geon Tae Hwang ,  Beom Ho Mun ,  Byoung Kuk You ,  Seung Jun Kim

IPC: H01L45/00 ,  H01L21/02

CPC classification number: H01L45/06 ,  H01L27/2409 ,  H01L27/2436 ,  H01L27/2463 ,  H01L45/08 ,  H01L45/1233 ,  H01L45/126 ,  H01L45/144 ,  H01L45/146 ,  H01L45/1675

Abstract: Provided are a phase-change memory device using insulating nanoparticles, a flexible phase-change memory device and a method for manufacturing the same. The phase-change memory device includes an electrode, and a phase-change layer in which a phase change occurs depending on heat generated from the electrode, wherein insulating nanoparticles formed from a self-assembled block copolymer are provided between the electrode and the phase-change layer undergoing crystallization and amorphization.

Abstract translation: 提供了使用绝缘纳米颗粒的相变存储器件，柔性相变存储器件及其制造方法。 相变存储器件包括电极和相变层，其中根据从电极产生的热量发生相变，其中由自组装的嵌段共聚物形成的绝缘纳米颗粒设置在电极和相 - 改变层正在进行结晶和非晶化。

公开(公告)号：US20120133247A1

公开(公告)日：2012-05-31

申请号：US13307870

申请日：2011-11-30

Applicant: Keon Jae Lee ,  Kwi-Il Park ,  Do Kyung Kim ,  Sang Ouk Kim ,  Geon-Tae Hwang

Inventor： Keon Jae Lee ,  Kwi-Il Park ,  Do Kyung Kim ,  Sang Ouk Kim ,  Geon-Tae Hwang

IPC: H02N2/18 ,  H01L41/22 ,  H01L41/18 ,  B82Y99/00

CPC classification number: H01L41/37 ,  B82Y30/00 ,  H01L41/113 ,  H01L41/183

Abstract: There are provided a flexible nanocomposite generator and a method of manufacturing the same. A flexible nanocomposite generator according to the present invention includes a piezoelectric layer formed of a flexible matrix containing piezoelectric nanoparticles and carbon nanostructures; and electrode layers disposed on the upper and lower surfaces of both sides of the piezoelectric layer, in which according to a method for manufacturing a flexible nanocomposite generator according to the present invention and a flexible nanogenerator, it is possible to manufacture a flexible nanogenerator with a large area and a small thickness. Therefore, the nanogenerator may be used as a portion of a fiber or cloth. Accordingly, the nanogenerator according to the present invention generates power in accordance with bending of attached cloth, such that it is possible to continuously generate power in accordance with movement of a human body.

Abstract translation: 提供了一种柔性纳米复合发生器及其制造方法。 根据本发明的柔性纳米复合发生器包括由含有压电纳米颗粒和碳纳米结构的柔性基体形成的压电层; 以及设置在压电体层的两侧的上表面和下表面上的电极层，其中根据本发明的柔性纳米复合材料发生器的制造方法和柔性纳米发生器，可以制造具有 面积大，厚度小。 因此，纳米发生器可以用作纤维或布的一部分。 因此，根据本发明的纳米发生器根据附着的布的弯曲产生动力，使得可以根据人体的运动连续发电。

公开(公告)号：US20120115259A1

公开(公告)日：2012-05-10

申请号：US13292772

申请日：2011-11-09

Applicant: Keon Jae LEE ,  Min Koo ,  Geon Tae Hwang

Inventor： Keon Jae LEE ,  Min Koo ,  Geon Tae Hwang

IPC: H01L21/302 ,  B05D3/06 ,  B05D5/12 ,  H01L21/268 ,  H01L21/30

CPC classification number: H01M10/052 ,  H01M10/058

Abstract: Disclosed are a method for fabricating a flexible electronic device using laser lift-off and an electronic device fabricated thereby. More particularly, disclosed are a method for fabricating a flexible electronic device using laser lift-off allowing for fabrication of a flexible electronic device in an economical and stable way by separating a device such as a secondary battery fabricated on a sacrificial substrate using laser, and an electronic device fabricated thereby.

Abstract translation: 公开了一种使用激光剥离制造柔性电子装置的方法和由此制造的电子装置。 更具体地，公开了一种使用激光剥离制造柔性电子器件的方法，其通过使用激光器分离诸如在牺牲基板上制造的二次电池的器件，以经济和稳定的方式制造柔性电子器件，以及 由此制造的电子设备。

公开(公告)号：US20110174377A1

公开(公告)日：2011-07-21

申请号：US13010108

申请日：2011-01-20

Applicant: Keon Jae Lee ,  Sang Yong Lee

Inventor： Keon Jae Lee ,  Sang Yong Lee

IPC: H01L31/0264 ,  H01L21/30 ,  H01L29/20

Abstract: Provided are a method of manufacturing a flexible device and the flexible device, a solar cell, and a light emitting device. The method of manufacturing a flexible device includes providing a device layer on a sacrificial substrate, contacting a flexible substrate on one side surface of the device layer, and removing the sacrificial substrate. A large area device may be transferred onto the flexible substrate with superior alignment to realize and manufacture the flexible device. In addition, since mass production is possible, the economic feasibility may be superior. Also, when a large area solar cell having a thin thickness is manufactured, since a limitation such as twisting of a thin film of a solar cell may be effectively solved, the economic feasibility and stability may be superior.

Abstract translation: 提供了制造柔性装置和柔性装置，太阳能电池和发光装置的方法。 柔性器件的制造方法包括在牺牲基片上提供器件层，与器件层的一个侧表面上的柔性衬底接触，以及去除牺牲衬底。 可以将大面积的装置转移到具有较高对准的柔性基板上，以实现和制造柔性装置。 另外，由于批量生产是可行的，经济可行性也可能更高。 此外，当制造厚度薄的大面积太阳能电池时，由于可以有效地解决太阳能电池薄膜的扭转等限制，所以经济可行性和稳定性可以优异。

公开(公告)号：US07943491B2

公开(公告)日：2011-05-17

申请号：US11423192

申请日：2006-06-09

Applicant: Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

Inventor： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC: H01L29/72

CPC classification number: H01L29/0665 ,  B82Y10/00 ,  B82Y20/00 ,  H01L29/0673 ,  H01L29/1606 ,  H01L29/78603 ,  H01L31/035281 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/072 ,  H01L31/109 ,  H01L31/18 ,  H01L31/1804 ,  H01L31/1892 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

Abstract: The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of ‘soft adhesion’ to guide the transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. Methods of the present invention are useful for transferring features from a donor substrate to the transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of an elastomeric transfer device to the receiving surface of a receiving substrate. The present methods and systems provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor element, in a concerted manner that maintains the relative spatial orientations of transferred features.

Abstract translation: 本发明提供用于传送，组装和集成特征的阵列的方法，系统和系统组件，其具有所选择的纳米尺寸和/或微尺寸的物理尺寸，形状和空间取向。 本发明的方法利用“软粘附”的原理来引导诸如可印刷半导体元件或电子器件的其它部件的特征的转移，组装和/或集成。 本发明的方法可用于将特征从供体基底转移到弹性体转移装置的转移表面，并且可选地从弹性体转移装置的转移表面转移到接收基底的接收表面。 本方法和系统以一致的方式提供特征和特征阵列的高效，注册传输，例如可印刷半导体元件，其保持所传送特征的相对空间取向。