摘要:
Described is an apparatus which comprises: a plurality of transistors coupled to an input power supply and to a load; a first comparator with a first node coupled to the load, and a second node coupled to a first reference; a second comparator with a first node coupled to the load, and a second node coupled to a second reference, the second reference being different from the first reference; and a logic unit to receive output of the first comparator and output of the second comparator, the logic unit to turn on or off transistors of the plurality of transistors according to outputs of the first and second comparators.
摘要:
A method for fabricating a super-junction semiconductor power device with reduced Miller capacitance includes the following steps. An N-type substrate is provided and a P-type epitaxial layer is formed on the N-type substrate. At least a trench is formed in the P-type epitaxial layer followed by forming a buffer layer on interior surface in the trench. An N-type dopant layer is filled into the trench and then the N-type dopant layer is etched to form a recessed structure at an upper portion of the trench. A gate oxide layer is formed, and simultaneously, dopants in the N-type dopant layer diffuse into the P-type epitaxial layer, forming an N-type diffusion layer. Finally, a gate conductor is filled into the recessed structure and an N-type source doped region is formed around the gate conductor in the P-type epitaxial layer.
摘要:
A casing including a carrying frame and at least one detachable carrying component is provided. The carrying frame includes two sidewalls and a base. The sidewalls face each other, and each sidewall has a first sliding connection portion. The sidewalls are respectively connected to the base, and the sidewalls and the base form an accommodating space. The detachable carrying component has two second sliding connection portions, and the second sliding connection portions are suitable for being slidingly connected to the first sliding connection portions respectively. The detachable carrying component is suitable for being slidingly disposed in the accommodating space along a gravitational direction. The method of assembling the casing is simpler.
摘要:
A wind-guiding cover is applicable to an electronic apparatus having a dissipating fan, a first heat-generating device and a second heat-generating device sequentially disposed along a straight line. The electronic apparatus further includes an upper lid. The wind-guiding cover includes a cover board for covering the first heat-generating device, and a plurality of side boards disposed on two sides of the cover board. The cover board is formed with a wind-guiding opening corresponding in position to the first heat-generating device. The side boards and the cover board form a first passageway. The wind-guiding opening and the upper lid form a second passageway. Therefore, airflow generated from the dissipating fan will be guided through the first passageway to dissipate heat generated from the first heat-generating device, and further through the second passageway to dissipate heat generated from the second heat-generating device.
摘要:
The present invention discloses a static electricity conductive mechanism including a plurality of conductive bumps and conductive members, for conducting static electricity generated by a connector device to a base thereof, the connector device having a connector body disposed on a circuit board, and the base being ground to earth. The conductive bumps of the static electricity conductive mechanism are each disposed on the base. The conductive members are disposed between the connector body and the conductive bumps. The conductive members conduct to the conductive bumps the static electricity generated by the connector body, thus conducting to earth the static electricity generated by the connector body. The prior art involves disposing a resilient element between a connector's body and base and thereby results in poor contact and poor conduction of static electricity between the body and the base. The drawback is solved by the present invention.
摘要:
A semiconductor device includes: a substrate including a first epitaxial layer that has a first electrical type, and a second epitaxial layer; a transistor that includes a source region and an insulating spacer; an inner surrounding structure including an annular trench and an insulating spacer; an outer surrounding structure that has a second electrical type opposite to the first electrical type, and that is disposed adjacent to an upper surface of the second epitaxial layer to surround and contact the inner surrounding structure; and a conductive structure connecting to the source region, and the inner and outer surrounding structures.
摘要:
A method for fabricating a power transistor includes: (a) forming a trench in a substrate with a first electrical type; (b) diffusing second electrical type carriers into the substrate from the trench such that the substrate is formed into a first part and a second part that is diffused with the second electrical type carriers and that adjoins the trench, the first and second parts being crystal lattice continuous to each other; (c) forming a filling portion in the trench, the filling portion adjoining the second part; (d) performing a carrier-implanting process in the second part and the filling portion; and (e) forming over the substrate a gate structure that has a dielectric layer and a conductive layer.
摘要:
A method for fabricating a super-junction semiconductor power device with reduced Miller capacitance includes the following steps. An N-type substrate is provided and a P-type epitaxial layer is formed on the N-type substrate. At least a trench is formed in the P-type epitaxial layer followed by forming a buffer layer on interior surface in the trench. An N-type dopant layer is filled into the trench and then the N-type dopant layer is etched to form a recessed structure at an upper portion of the trench. A gate oxide layer is formed, and simultaneously, dopants in the N-type dopant layer diffuse into the P-type epitaxial layer, forming an N-type diffusion layer. Finally, a gate conductor is filled into the recessed structure and an N-type source doped region is formed around the gate conductor in the P-type epitaxial layer.
摘要:
A plasma damage protection circuit includes a word line driver circuit with plasma damage protection features. If, during manufacture, plasma-based processes cause charge to build up on the word lines, the charge passes from the word lines through at least the word line drivers to the semiconductor substrate. Another plasma-based protection circuit includes a device coupled to multiple word line drivers. If, during manufacture, plasma-based processes cause charge to build up on the word lines, the charge passes from the word lines through at least the device to the semiconductor substrate. Thus, these plasma-based protection circuits save space while protecting the integrated circuit from plasma process-based damage.
摘要:
An output stage has an input supply node to receive an input power supply and an output node to provide an output supply to a load. An amplifier is used to control current strength of the output stage according to the output supply and a reference voltage. A hysteresis unit is used to monitor the output supply and operable to control the current strength of the output stage according to a voltage level of the output supply. In one embodiment, a plurality of charge pumps are used to adjust current strength of the output stage. A logic unit is used to monitor the output supply and operable to control the plurality of charge pumps according to a voltage level of the output supply and one or more reference voltages.