摘要:
A method and system is disclosed for reducing and monitoring precipitated defects on mask reticles. A predetermined gas is provided into an environment surrounding the reticle assembly for reducing a formation of the precipitated defects around the mask reticle caused by photolithography under a light source having a small wavelength.
摘要:
In a container for transporting a reticle during a semiconductor manufacturing process, the reticle including a base made of isolating material and a metallic layer deposited onto a surface of the base, disclosed is a method for isolating and removing environmental contaminants which includes filling the container with inert gas, thereby purging the environmental contaminants, as well as inlet and outlet features to allow for the purging of clean inert gas and impurities.
摘要:
An improved photo resist coating and developing system comprising a track unit and a scanner unit is disclosed. The track unit has a coating unit for coating photo resist on a wafer. The scanner unit includes an enhanced wafer pre-alignment module, an expose stage, and a develop module. The enhanced wafer pre-alignment module is capable of performing wafer edge exposure (WEE) which conventionally required a separate WEE module as part of the track unit. By incorporating the WEE function into the wafer pre-alignment module of the scanner unit, the WEE module of the track unit is no longer required and duplication of wafer alignment and centering performed by the WEE module is eliminated.
摘要:
A method for inspecting a phase shift photomask employs a phase shift photomask having an active pattern region. An optical property of the phase shift photomask is measured within the active pattern region, rather than, for example, a non-active pattern border region. By making the measurement within the active pattern region, performance of the phase shift mask may be properly assured. The method is particularly useful for inspecting attenuated phase shift photomasks to assure absence of side-lobes when photoexposing blanket photoresist layers.
摘要:
A method for inspecting a phase shift photomask employs a phase shift photomask having an active pattern region. An optical property of the phase shift photomask is measured within the active pattern region, rather than, for example, a non-active pattern border region. By making the measurement within the active pattern region, performance of the phase shift mask may be properly assured. The method is particularly useful for inspecting attenuated phase shift photomasks to assure absence of side-lobes when photoexposing blanket photoresist layers.
摘要:
A method and system for identifying a defocus wafer by mapping a topography of each wafer in a first wafer batch using a level sensor apparatus (100); calculating a focus spot deviation (402) from the data, the focus spot deviation (402) corresponding to a height by which a focus spot of a photo exposure module would be defocused by the topography; converting the focus spot deviation (402) to a corresponding wafer stage set point to which the photo exposure module is set, to focus the focus spot on each wafer in the wafer batch; and identifying a defocus wafer in the wafer batch, as a wafer having a topography that would defocus the focus spot, even when the photo exposure module is set to the wafer stage set point.
摘要:
An improved method of wafer height mapping using a wafer level sensor eliminates or substantially minimizes the “spacing” in the wafer height mapping data usually caused by having an exposure field on a wafer whose width is less than the width of the measurement spot array of the wafer level sensor and also not being a multiple of the width of a single measurement spot. According to the improved method, the measurement spot array is first translated towards one edge of the exposure field and scanned. Then the measurement spot array is translated towards the other edge of the exposure field and scanned second time to map the area that was missed during the first mapping scan.
摘要:
An improved method of wafer height mapping using a wafer level sensor eliminates or substantially minimizes the “spacing” in the wafer height mapping data usually caused by having an exposure field on a wafer whose width is less than the width of the measurement spot array of the wafer level sensor and also not being a multiple of the width of a single measurement spot. According to the improved method, the measurement spot array is first translated towards one edge of the exposure field and scanned. Then the measurement spot array is translated towards the other edge of the exposure field and scanned second time to map the area that was missed during the first mapping scan.
摘要:
A method and system for identifying a defocus wafer by mapping a topography of each wafer in a first wafer batch using a level sensor apparatus (100); calculating a focus spot deviation (402) from the data, the focus spot deviation (402) corresponding to a height by which a focus spot of a photo exposure module would be defocused by the topography; converting the focus spot deviation (402) to a corresponding wafer stage set point to which the photo exposure module is set, to focus the focus spot on each wafer in the wafer batch; and identifying a defocus wafer in the wafer batch, as a wafer having a topography that would defocus the focus spot, even when the photo exposure module is set to the wafer stage set point.
摘要:
A method including providing a present wafer to be processed by a photolithography tool, selecting a processed wafer having a past chip design from a plurality of processed wafers, the processed wafer being previously processed by the photolithography tool, selecting a plurality of critical dimension (CD) data points extracted from a plurality of fields on the processed wafer, modeling the plurality of CD data points with a function relating CD to position on the processed wafer, creating a field layout on the present wafer for a new chip design, creating an initial exposure dose map for the new chip design using the function and the field layout, and controlling the exposure of the photolithography tool according to the initial exposure dose map to form the new chip design on the present wafer.