Wafer aligner with WEE (water edge exposure) function
    3.
    发明申请
    Wafer aligner with WEE (water edge exposure) function 审中-公开
    晶圆对准器与WEE(水边缘曝光)功能

    公开(公告)号:US20050248754A1

    公开(公告)日:2005-11-10

    申请号:US10839625

    申请日:2004-05-05

    IPC分类号: G01B11/00 G03F9/00

    CPC分类号: G03F9/7088 G03F9/7011

    摘要: An improved photo resist coating and developing system comprising a track unit and a scanner unit is disclosed. The track unit has a coating unit for coating photo resist on a wafer. The scanner unit includes an enhanced wafer pre-alignment module, an expose stage, and a develop module. The enhanced wafer pre-alignment module is capable of performing wafer edge exposure (WEE) which conventionally required a separate WEE module as part of the track unit. By incorporating the WEE function into the wafer pre-alignment module of the scanner unit, the WEE module of the track unit is no longer required and duplication of wafer alignment and centering performed by the WEE module is eliminated.

    摘要翻译: 公开了一种包括轨道单元和扫描器单元的改进的光致抗蚀剂涂覆和显影系统。 轨道单元具有用于在晶片上涂覆光致抗蚀剂的涂层单元。 扫描器单元包括增强的晶片预对准模块,曝光台和显影模块。 增强的晶片预校准模块能够执行通常需要单独的WEE模块作为轨道单元的一部分的晶片边缘曝光(WEE)。 通过将WEE功能结合到扫描器单元的晶片预对准模块中,轨道单元的WEE模块不再需要,并且消除了由WEE模块执行的晶片对准和定心的复制。

    Phase shift photomask performance assurance method
    4.
    发明授权
    Phase shift photomask performance assurance method 有权
    相移光掩模性能保证方法

    公开(公告)号:US08048589B2

    公开(公告)日:2011-11-01

    申请号:US11192667

    申请日:2005-07-30

    IPC分类号: G03F1/00

    CPC分类号: G03F1/84 G03F1/32

    摘要: A method for inspecting a phase shift photomask employs a phase shift photomask having an active pattern region. An optical property of the phase shift photomask is measured within the active pattern region, rather than, for example, a non-active pattern border region. By making the measurement within the active pattern region, performance of the phase shift mask may be properly assured. The method is particularly useful for inspecting attenuated phase shift photomasks to assure absence of side-lobes when photoexposing blanket photoresist layers.

    摘要翻译: 用于检查相移光掩模的方法采用具有活性图案区域的相移光掩模。 在有源图案区域内测量相移光掩模的光学特性,而不是例如非活动图案边界区域。 通过在有源图案区域内进行测量,可以适当地确保相移掩模的性能。 该方法对于检查衰减的相移光掩模特别有用,以确保在曝光橡皮布光致抗蚀剂层时不存在侧裂片。

    Phase shift photomask performance assurance method
    5.
    发明申请
    Phase shift photomask performance assurance method 有权
    相移光掩模性能保证方法

    公开(公告)号:US20070026320A1

    公开(公告)日:2007-02-01

    申请号:US11192667

    申请日:2005-07-30

    IPC分类号: G03C5/00 G06K9/00 G03F1/00

    CPC分类号: G03F1/84 G03F1/32

    摘要: A method for inspecting a phase shift photomask employs a phase shift photomask having an active pattern region. An optical property of the phase shift photomask is measured within the active pattern region, rather than, for example, a non-active pattern border region. By making the measurement within the active pattern region, performance of the phase shift mask may be properly assured. The method is particularly useful for inspecting attenuated phase shift photomasks to assure absence of side-lobes when photoexposing blanket photoresist layers.

    摘要翻译: 用于检查相移光掩模的方法采用具有活性图案区域的相移光掩模。 在有源图案区域内测量相移光掩模的光学特性,而不是例如非活动图案边界区域。 通过在有源图案区域内进行测量,可以适当地确保相移掩模的性能。 该方法对于检查衰减的相移光掩模特别有用,以确保在曝光橡皮布光致抗蚀剂层时不存在侧裂片。

    Method to predict and identify defocus wafers
    6.
    发明授权
    Method to predict and identify defocus wafers 有权
    预测和识别散焦晶圆的方法

    公开(公告)号:US07301604B2

    公开(公告)日:2007-11-27

    申请号:US10786495

    申请日:2004-02-25

    IPC分类号: G01B11/00 G03B27/52

    摘要: A method and system for identifying a defocus wafer by mapping a topography of each wafer in a first wafer batch using a level sensor apparatus (100); calculating a focus spot deviation (402) from the data, the focus spot deviation (402) corresponding to a height by which a focus spot of a photo exposure module would be defocused by the topography; converting the focus spot deviation (402) to a corresponding wafer stage set point to which the photo exposure module is set, to focus the focus spot on each wafer in the wafer batch; and identifying a defocus wafer in the wafer batch, as a wafer having a topography that would defocus the focus spot, even when the photo exposure module is set to the wafer stage set point.

    摘要翻译: 一种用于通过使用液位传感器装置(100)在第一晶片批次中映射每个晶片的形貌来识别散焦晶片的方法和系统; 从所述数据计算焦点偏差(402),所述焦点偏差(402)对应于所述照相曝光模块的焦点将由所述形貌散焦的高度; 将聚焦点偏差(402)转换为设置有曝光模块的对应的晶片台设定点,以将聚焦点聚焦在晶片批次中的每个晶片上; 并且即使当将曝光模块设置到晶片台设定点时,将晶片批中的散焦晶片识别为具有将焦点聚焦的形貌的晶片。

    METHOD OF WAFER HEIGHT MAPPING
    7.
    发明申请
    METHOD OF WAFER HEIGHT MAPPING 失效
    WAFER HEIGHT MAPPING方法

    公开(公告)号:US20050259272A1

    公开(公告)日:2005-11-24

    申请号:US10849455

    申请日:2004-05-19

    摘要: An improved method of wafer height mapping using a wafer level sensor eliminates or substantially minimizes the “spacing” in the wafer height mapping data usually caused by having an exposure field on a wafer whose width is less than the width of the measurement spot array of the wafer level sensor and also not being a multiple of the width of a single measurement spot. According to the improved method, the measurement spot array is first translated towards one edge of the exposure field and scanned. Then the measurement spot array is translated towards the other edge of the exposure field and scanned second time to map the area that was missed during the first mapping scan.

    摘要翻译: 使用晶片级传感器的晶片高度映射的改进方法消除或基本上最小化晶片高度映射数据中的“间隔”,通常是由于在晶片上具有宽度小于其的测量点阵列的宽度的曝光场 晶圆级传感器,也不是单个测量点的宽度的倍数。 根据改进的方法,测量点阵列首先被转换成曝光场的一个边缘并进行扫描。 然后,测量点阵列朝向曝光区域的另一边缘平移,第二次扫描以映射第一次映射扫描期间遗漏的区域。

    Method to predict and identify defocus wafers
    8.
    发明申请
    Method to predict and identify defocus wafers 有权
    预测和识别散焦晶圆的方法

    公开(公告)号:US20050185170A1

    公开(公告)日:2005-08-25

    申请号:US10786495

    申请日:2004-02-25

    摘要: A method and system for identifying a defocus wafer by mapping a topography of each wafer in a first wafer batch using a level sensor apparatus (100); calculating a focus spot deviation (402) from the data, the focus spot deviation (402) corresponding to a height by which a focus spot of a photo exposure module would be defocused by the topography; converting the focus spot deviation (402) to a corresponding wafer stage set point to which the photo exposure module is set, to focus the focus spot on each wafer in the wafer batch; and identifying a defocus wafer in the wafer batch, as a wafer having a topography that would defocus the focus spot, even when the photo exposure module is set to the wafer stage set point.

    摘要翻译: 一种用于通过使用液位传感器装置(100)在第一晶片批次中映射每个晶片的形貌来识别散焦晶片的方法和系统; 从所述数据计算焦点偏差(402),所述焦点偏差(402)对应于所述照相曝光模块的焦点将由所述形貌散焦的高度; 将聚焦点偏差(402)转换为设置有曝光模块的对应的晶片台设定点,以将聚焦点聚焦在晶片批次中的每个晶片上; 并且即使当将曝光模块设置到晶片台设定点时,将晶片批中的散焦晶片识别为具有将焦点聚焦的形貌的晶片。

    Method of wafer height mapping
    9.
    发明授权
    Method of wafer height mapping 失效
    晶圆高度测绘方法

    公开(公告)号:US06975407B1

    公开(公告)日:2005-12-13

    申请号:US10849455

    申请日:2004-05-19

    摘要: An improved method of wafer height mapping using a wafer level sensor eliminates or substantially minimizes the “spacing” in the wafer height mapping data usually caused by having an exposure field on a wafer whose width is less than the width of the measurement spot array of the wafer level sensor and also not being a multiple of the width of a single measurement spot. According to the improved method, the measurement spot array is first translated towards one edge of the exposure field and scanned. Then the measurement spot array is translated towards the other edge of the exposure field and scanned second time to map the area that was missed during the first mapping scan.

    摘要翻译: 使用晶片级传感器的晶片高度映射的改进方法消除或基本上最小化晶片高度映射数据中的“间隔”,通常是由于在晶片上具有宽度小于其的测量点阵列的宽度的曝光场 晶圆级传感器,也不是单个测量点的宽度的倍数。 根据改进的方法,测量点阵列首先被转换成曝光场的一个边缘并进行扫描。 然后,测量点阵列朝向曝光区域的另一边缘平移,第二次扫描以映射第一次映射扫描期间遗漏的区域。

    Method and apparatus for reducing spin-induced wafer charging
    10.
    发明申请
    Method and apparatus for reducing spin-induced wafer charging 审中-公开
    减少自旋晶片充电的方法和装置

    公开(公告)号:US20060000109A1

    公开(公告)日:2006-01-05

    申请号:US10884714

    申请日:2004-07-03

    IPC分类号: C23G1/02 F26B5/08 F26B17/24

    摘要: A novel method and apparatus for reducing or eliminating electrostatic charging of wafers during a spin-dry step of wafer cleaning is disclosed. The method includes rinsing a wafer, typically by dispensing a cleaning liquid such as deionized water on the wafer while spinning the wafer; and spin-drying the wafer by sequentially rotating the wafer in opposite directions. The apparatus includes a wafer support platform that is capable of sequentially rotating a wafer in opposite directions to spin-dry the wafer.

    摘要翻译: 公开了一种在晶片清洗的旋转干燥步骤中减少或消除晶片的静电充电的新型方法和装置。 该方法包括冲洗晶片,通常通过在旋转晶片的同时在晶片上分配诸如去离子水的清洁液体; 并通过沿相反方向顺序旋转晶片来旋转晶片。 该装置包括能够沿相反方向顺序旋转晶片以旋转晶片的晶片支撑平台。