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1.发明申请Photocurable composition for the formation of pressure-sensitive adhesive layer and dicing tape produced using the same 审中-公开用于形成压敏粘合剂层的光固化性组合物和使用其制造的切割带公开(公告)号：US20090075008A1
公开(公告)日：2009-03-19
申请号：US12230427
申请日：2008-08-28
申请人： Yong Ha Hwang , Chang Bum Chung , Gyu Seok Song , Baek Soung Park , Seung Jip Choi , Kyoung Jin Ha
发明人： Yong Ha Hwang , Chang Bum Chung , Gyu Seok Song , Baek Soung Park , Seung Jip Choi , Kyoung Jin Ha
CPC分类号： C09J133/14 , Y10T428/1471
摘要： A photocurable composition for a pressure-sensitive adhesive layer includes a pressure-sensitive adhesive binder, a reactive acrylate having a silicone backbone, a thermal curing agent, and a photoinitiator. The pressure-sensitive adhesive binder includes a copolymer of acrylic monomers, and a low molecular weight acrylate bonded to the copolymer, the low molecular weight acrylate having at least one pendent carbon-carbon double bond.
摘要翻译： 用于粘合剂层的可光固化组合物包括压敏粘合剂粘合剂，具有硅氧烷骨架的反应性丙烯酸酯，热固化剂和光引发剂。 压敏粘合剂粘合剂包括丙烯酸单体和与共聚物结合的低分子量丙烯酸酯的共聚物，低分子量丙烯酸酯具有至少一个侧链碳 - 碳双键。
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2.发明申请Adhesive film composition, associated dicing die bonding film, and die package 有权粘合膜组成，相关切割模片接合薄膜和模具包装公开(公告)号：US20080145668A1
公开(公告)日：2008-06-19
申请号：US12000070
申请日：2007-12-07
申请人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
发明人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
CPC分类号： H01L21/6836 , C08K3/013 , C08K5/34922 , C08K5/50 , C08K5/5435 , C08K5/548 , C08K5/55 , C08L61/04 , C08L63/00 , C09D167/02 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8388 , H01L2224/83885 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01067 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31786 , C08L2666/14 , H01L2924/00 , H01L2924/01083
摘要： An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
摘要翻译： 粘合膜组合物包括聚酯类热塑性树脂，包含羟基，羧基或环氧基中的至少一种的弹性体树脂，环氧树脂，酚固化剂，潜在催化固化中的一种或多种 试剂或固化催化剂，硅烷偶联剂和填料。
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3.发明授权Adhesive film composition, associated dicing die bonding film, and die package 有权粘合膜组成，相关切割模片接合薄膜和模具包装公开(公告)号：US07863758B2
公开(公告)日：2011-01-04
申请号：US12000070
申请日：2007-12-07
申请人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
发明人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
IPC分类号： H01L23/488 , B32B27/36 , B32B27/38 , C08L63/00 , C08L67/02
CPC分类号： H01L21/6836 , C08K3/013 , C08K5/34922 , C08K5/50 , C08K5/5435 , C08K5/548 , C08K5/55 , C08L61/04 , C08L63/00 , C09D167/02 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8388 , H01L2224/83885 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01067 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31786 , C08L2666/14 , H01L2924/00 , H01L2924/01083
摘要： An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
摘要翻译： 粘合膜组合物包括聚酯类热塑性树脂，包含羟基，羧基或环氧基中的至少一种的弹性体树脂，环氧树脂，酚固化剂，潜在催化固化中的一种或多种 试剂或固化催化剂，硅烷偶联剂和填料。
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公开(公告)号：US08419978B2
公开(公告)日：2013-04-16
申请号：US13016292
申请日：2011-01-28
申请人： Hyoun Young Kim , Chang Bum Chung , Jeong Ku Kang , Jung Sik Choi
发明人： Hyoun Young Kim , Chang Bum Chung , Jeong Ku Kang , Jung Sik Choi
摘要： An anisotropic conductive film (ACF) composition includes a binder having a thermoplastic resin and a styrene-acrylonitrile (SAN) copolymer resin, a curing composition, and conductive particles.
摘要翻译： 各向异性导电膜（ACF）组合物包括具有热塑性树脂和苯乙烯 - 丙烯腈（SAN）共聚物树脂的粘合剂，固化组合物和导电颗粒。
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公开(公告)号：US20110133130A1
公开(公告)日：2011-06-09
申请号：US13016292
申请日：2011-01-28
申请人： HYOUN YOUNG KIM , Chang Bum Chung , Jeong Ku Kang , Jung Sik Choi
发明人： HYOUN YOUNG KIM , Chang Bum Chung , Jeong Ku Kang , Jung Sik Choi
IPC分类号： H01B1/12
摘要： An anisotropic conductive film (ACF) composition includes a binder having a thermoplastic resin and a styrene-acrylonitrile (SAN) copolymer resin, a curing composition, and conductive particles.
摘要翻译： 各向异性导电膜（ACF）组合物包括具有热塑性树脂和苯乙烯 - 丙烯腈（SAN）共聚物树脂的粘合剂，固化组合物和导电颗粒。
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公开(公告)号：US07879259B2
公开(公告)日：2011-02-01
申请号：US11907812
申请日：2007-10-17
申请人： Hyoun Young Kim , Chang Bum Chung , Jeong Ku Kang , Jung Sik Choi
发明人： Hyoun Young Kim , Chang Bum Chung , Jeong Ku Kang , Jung Sik Choi
摘要： An anisotropic conductive film (ACF) composition includes a binder having a thermoplastic resin and a styrene-acrylonitrile (SAN) copolymer resin, a curing composition, and conductive particles.
摘要翻译： 各向异性导电膜（ACF）组合物包括具有热塑性树脂和苯乙烯 - 丙烯腈（SAN）共聚物树脂的粘合剂，固化组合物和导电颗粒。
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