公开(公告)号：US08643150B1

公开(公告)日：2014-02-04

申请号：US13396804

申请日：2012-02-15

申请人： Yong L. Xu ,  Viren Khandekar ,  Yi-Sheng A. Sun ,  Arkadii Samoilov

发明人： Yong L. Xu ,  Viren Khandekar ,  Yi-Sheng A. Sun ,  Arkadii Samoilov

IPC分类号： H01L23/58

CPC分类号： H01L24/11 ,  H01L23/3192 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/94 ,  H01L2224/02313 ,  H01L2224/0239 ,  H01L2224/034 ,  H01L2224/0361 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05172 ,  H01L2224/05548 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/05563 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05672 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/1401 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14179 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0105 ,  H01L2224/05552

摘要： Wafer-level package (semiconductor) devices are described that have a pillar structure that extends at least partially into a solder bump to mitigate thermal stresses to the solder bump. In implementations, the wafer-level package device may comprise an integrated circuit chip having a surface and a solder bump disposed over the surface. The wafer-level package device may also include a pillar structure disposed over the surface that extends at least partially into the solder bump.

摘要翻译： 描述了晶片级封装（半导体）器件，其具有至少部分地延伸到焊料凸块中以减轻对焊料凸块的热应力的柱结构。 在实现中，晶片级封装器件可以包括具有设置在表面上的表面和焊料凸块的集成电路芯片。 晶片级封装器件还可以包括设置在表面上的至少部分地延伸到焊料凸块中的柱结构。