公开(公告)号：US08704265B2

公开(公告)日：2014-04-22

申请号：US12675582

申请日：2008-08-27

申请人： Bu Wan Seo ,  Sung Woo Kim ,  Hoon Hur ,  Yong Suk Kim

发明人： Bu Wan Seo ,  Sung Woo Kim ,  Hoon Hur ,  Yong Suk Kim

IPC分类号： H01L33/00 ,  H01L29/40 ,  H01L29/207 ,  H01L23/48

CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L2224/48137 ,  H01L2224/48227 ,  H05B33/0821 ,  H05B33/0857 ,  Y02B20/341 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.

摘要翻译： 在一个实施例中，发光器件封装包括封装主体，附接到封装体的电极以及电连接到电极的至少两个发光器件。 每个发光装置发射与其他发光装置不同颜色的光。 在至少两个发光器件上形成保护层，并且形成在保护层上方的荧光体层。 其他实施例包括其他结构，例如每个发光器件上的各个荧光体层。 并且，包括封装的光装置可以包括驱动封装的发光器件的单个驱动器。

公开(公告)号：US20100295068A1

公开(公告)日：2010-11-25

申请号：US12675582

申请日：2008-08-27

申请人： Bu Wan Seo ,  Sung Woo Kim ,  Hoon Hur ,  Yong Suk Kim

发明人： Bu Wan Seo ,  Sung Woo Kim ,  Hoon Hur ,  Yong Suk Kim

IPC分类号： H01L33/52 ,  H01L33/48

CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L2224/48137 ,  H01L2224/48227 ,  H05B33/0821 ,  H05B33/0857 ,  Y02B20/341 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.

摘要翻译： 在一个实施例中，发光器件封装包括封装主体，附接到封装体的电极以及电连接到电极的至少两个发光器件。 每个发光装置发射与其他发光装置不同颜色的光。 在至少两个发光器件上形成保护层，并且形成在保护层上方的荧光体层。 其他实施例包括其他结构，例如每个发光器件上的各个荧光体层。 并且，包括封装的光装置可以包括驱动封装的发光器件的单个驱动器。

公开(公告)号：US20080149373A1

公开(公告)日：2008-06-26

申请号：US12000460

申请日：2007-12-12

申请人： Yong Suk Kim ,  Bu Wan Seo ,  Hoon Hur

发明人： Yong Suk Kim ,  Bu Wan Seo ,  Hoon Hur

IPC分类号： H05K1/03 ,  B60Q1/00 ,  F21V29/00 ,  H05K3/30

CPC分类号： H05K1/021 ,  H01L33/483 ,  H01L33/64 ,  H01L2224/48091 ,  H05K1/056 ,  H05K1/182 ,  H05K3/0047 ,  H05K3/3421 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2203/0207 ,  Y10T29/4913 ,  H01L2924/00014

摘要： A printed circuit broad capable of improving reliability, a light emitting apparatus having the same and a manufacturing method thereof are disclosed. The printed circuit board mounted with a light emitting device package includes a first metal layer, an insulating layer disposed on the first metal layer, a second metal layer disposed on the insulating layer, and a mounting groove for mounting the light emitting device package, which has a depth reaching at least an upper surface of the first metal layer.

摘要翻译： 公开了一种能够提高可靠性的印刷电路，具有该印刷电路的发光装置及其制造方法。 安装有发光器件封装的印刷电路板包括第一金属层，设置在第一金属层上的绝缘层，设置在绝缘层上的第二金属层和用于安装发光器件封装的安装槽，其中 具有到达第一金属层的至少上表面的深度。

公开(公告)号：US20090045432A1

公开(公告)日：2009-02-19

申请号：US12222595

申请日：2008-08-12

申请人： Yong Suk Kim ,  Bu Wan Seo ,  Hoon Hur

发明人： Yong Suk Kim ,  Bu Wan Seo ,  Hoon Hur

IPC分类号： H01L23/00

CPC分类号： H05K1/0206 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/107 ,  H05K3/4038 ,  H05K3/42 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/043 ,  H05K2203/0733 ,  H01L2924/00014

摘要： A circuit board for a light emitting device and a light emitting unit using the same, which are capable of achieving an enhancement in light emission efficiency and an enhancement in reliability, are disclosed. The disclosed circuit board includes a substrate having a first surface and a second surface, at least one pair of conductive lines formed on the first surface of the substrate, and electrically connected to a light emitting device package, and a heat transfer member formed in a region where the light emitting device package is coupled to the circuit board, such that the heat transfer member connects the first and second surfaces of the substrate.

摘要翻译： 公开了一种能够实现发光效率提高和可靠性提高的发光元件用电路板及使用该电路的发光单元。 所公开的电路板包括具有第一表面和第二表面的基板，形成在基板的第一表面上并电连接到发光器件封装的至少一对导电线，以及形成在 区域，其中发光器件封装耦合到电路板，使得传热构件连接衬底的第一和第二表面。

公开(公告)号：US07496270B2

公开(公告)日：2009-02-24

申请号：US11707112

申请日：2007-02-16

申请人： Yong Suk Kim ,  Hoon Hur

发明人： Yong Suk Kim ,  Hoon Hur

IPC分类号： G02B6/00

CPC分类号： B29C45/14655 ,  B29C45/14836 ,  B29C45/2704 ,  B29C2045/14327 ,  B29L2031/3475 ,  B29L2031/747 ,  H01L33/52

摘要： A light emitting unit, an apparatus and method for manufacturing the same, an apparatus for molding a lens thereof, and a light emitting device package thereof, which are capable of achieving an enhancement in light extraction efficiency and an improvement in mass productivity, are disclosed. The light emitting unit manufacturing apparatus includes a mold including a first mold and a second mold coupled to each other under a condition in which at least one light emitting unit is interposed between the first and second molds, a groove formed in one of the first and second molds at a position facing the light emitting unit, the groove having a lens shape, and a passage extending from an outer surface of the mold to the groove.

摘要翻译： 公开了一种能够实现光提取效率提高和批量生产率提高的发光单元，其制造方法及其制造方法，其透镜成型装置及其发光装置封装 。 发光单元制造装置包括：模具，其包括第一模具和第二模具，所述模具在第一模具和第二模具之间插入有至少一个发光单元的条件下彼此耦合;沟槽，其形成在第一模具和第二模具之一中; 在面向发光单元的位置处的第二模具，所述凹槽具有透镜形状，以及从模具的外表面延伸到凹槽的通道。

公开(公告)号：US20070286550A1

公开(公告)日：2007-12-13

申请号：US11707112

申请日：2007-02-16

申请人： Yong Suk Kim ,  Hoon Hur

发明人： Yong Suk Kim ,  Hoon Hur

IPC分类号： H01L21/00 ,  G02B6/32

CPC分类号： B29C45/14655 ,  B29C45/14836 ,  B29C45/2704 ,  B29C2045/14327 ,  B29L2031/3475 ,  B29L2031/747 ,  H01L33/52

摘要： A light emitting unit, an apparatus and method for manufacturing the same, an apparatus for molding a lens thereof, and a light emitting device package thereof, which are capable of achieving an enhancement in light extraction efficiency and an improvement in mass productivity, are disclosed. The light emitting unit manufacturing apparatus includes a mold including a first mold and a second mold coupled to each other under a condition in which at least one light emitting unit is interposed between the first and second molds, a groove formed in one of the first and second molds at a position facing the light emitting unit, the groove having a lens shape, and a passage extending from an outer surface of the mold to the groove.

摘要翻译： 公开了一种能够实现光提取效率提高和批量生产率提高的发光单元，其制造方法及其制造方法，其透镜成型装置及其发光装置封装 。 发光单元制造装置包括：模具，其包括第一模具和第二模具，所述模具在第一模具和第二模具之间插入有至少一个发光单元的条件下彼此耦合;沟槽，其形成在第一模具和第二模具之一中; 在面向发光单元的位置处的第二模具，所述凹槽具有透镜形状，以及从模具的外表面延伸到凹槽的通道。

公开(公告)号：US20090065797A1

公开(公告)日：2009-03-12

申请号：US12230447

申请日：2008-08-28

申请人： Yong Suk Kim ,  Hoon Hur

发明人： Yong Suk Kim ,  Hoon Hur

IPC分类号： H01L21/00 ,  G02F1/1335

CPC分类号： H05K1/142 ,  H05K1/0206 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2201/209 ,  H05K2203/167

摘要： A light emitting unit capable of widely adjusting brightness or size, and a liquid crystal display device using the same are disclosed. The light emitting unit includes a circuit board including circuit lines having a plurality of connecting members, and a plurality of unit module connected to the connecting members of the circuit board. The unit module is coupled with at least one light emitting device.

摘要翻译： 公开了能够广泛调节亮度或尺寸的发光单元以及使用其的液晶显示装置。 发光单元包括电路板，其包括具有多个连接构件的电路线，以及连接到电路板的连接构件的多个单元模块。 单元模块与至少一个发光装置耦合。

公开(公告)号：US07869674B2

公开(公告)日：2011-01-11

申请号：US12359842

申请日：2009-01-26

申请人： Yong Suk Kim ,  Hoon Hur

发明人： Yong Suk Kim ,  Hoon Hur

IPC分类号： G02B6/32

CPC分类号： B29C45/14655 ,  B29C45/14836 ,  B29C45/2704 ,  B29C2045/14327 ,  B29L2031/3475 ,  B29L2031/747 ,  H01L33/52

摘要： A light emitting unit, an apparatus and method for manufacturing the same, an apparatus for molding a lens thereof, and a light emitting device package thereof, which are capable of achieving an enhancement in light extraction efficiency and an improvement in mass productivity, are disclosed. The light emitting unit manufacturing apparatus includes a mold including a first mold and a second mold coupled to each other under a condition in which at least one light emitting unit is interposed between the first and second molds, a groove formed in one of the first and second molds at a position facing the light emitting unit, the groove having a lens shape, and a passage extending from an outer surface of the mold to the groove.

摘要翻译： 公开了一种能够实现光提取效率提高和批量生产率提高的发光单元，其制造方法及其制造方法，其透镜成型装置及其发光装置封装 。 发光单元制造装置包括：模具，其包括第一模具和第二模具，所述模具在第一模具和第二模具之间插入有至少一个发光单元的条件下彼此耦合;沟槽，其形成在第一模具和第二模具之一中; 在面向发光单元的位置处的第二模具，所述凹槽具有透镜形状，以及从模具的外表面延伸到凹槽的通道。

公开(公告)号：US09236172B2

公开(公告)日：2016-01-12

申请号：US13420540

申请日：2012-03-14

申请人： Sang Moon Lee ,  Yong Suk Kim ,  Jeong Bok Kwak ,  Young Seuck Yoo ,  Sung Kwon Wi

发明人： Sang Moon Lee ,  Yong Suk Kim ,  Jeong Bok Kwak ,  Young Seuck Yoo ,  Sung Kwon Wi

IPC分类号： H01F5/00 ,  H01F27/28

CPC分类号： H01F5/003

摘要： A conductor pattern of a coil part formed in a spiral shape on a magnetic substrate, which includes: a primary conductor pattern; and a secondary conductor pattern formed on the primary conductor pattern. The primary conductor pattern is formed to have a longitudinal section including a first horizontal portion and a first vertical portion electrically connected to an end portion of one surface of the first horizontal portion. The secondary conductor pattern is formed to have a longitudinal section including a second horizontal portion corresponding to the first horizontal portion and a second vertical portion electrically connected to an end portion of one surface of the second horizontal portion.

摘要翻译： 在磁性基板上形成为螺旋状的线圈部的导体图案，其包括：主导体图案; 以及形成在主导体图案上的次级导体图案。 主导体图案形成为具有电连接到第一水平部分的一个表面的端部的第一水平部分和第一垂直部分的纵向部分。 次级导体图案形成为具有包括对应于第一水平部分的第二水平部分的纵向部分和与第二水平部分的一个表面的端部电连接的第二垂直部分。

公开(公告)号：US08568014B2

公开(公告)日：2013-10-29

申请号：US13003056

申请日：2008-11-18

申请人： Yong Suk Kim

发明人： Yong Suk Kim

IPC分类号： G09F13/10

CPC分类号： G02F1/133608 ,  G02F2201/54

摘要： A back-light unit is disclosed. An object of the present invention is to provide a back-light unit that is able to improve structural stability and mass-production efficiency. The back-light unit includes a circuit substrate comprising a plurality of light sources arranged thereon, an optical sheet positioned on the circuit substrate, a plurality of supporting parts arranged between the circuit substrate and the optical sheet to support the optical sheet, which are installed to the circuit substrate by using surface-mount technology (SMT).

摘要翻译： 公开了背光单元。 本发明的目的是提供能够提高结构稳定性和批量生产效率的背光单元。 背光单元包括：电路基板，包括布置在其上的多个光源;位于电路基板上的光学片;布置在电路基板和光学片之间的多个支撑部件，用于支撑光学片， 通过使用表面贴装技术（SMT）到电路基板。