LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号:US20080128721A1

    公开(公告)日:2008-06-05

    申请号:US11873763

    申请日:2007-10-17

    IPC分类号: H01L33/00

    CPC分类号: H01L33/44 H01L33/38

    摘要: Herein disclosed a method of manufacturing a light emitting device, including the steps of: (A) sequentially forming a first compound semiconductor layer of a first conduction type, an active layer, and a second compound semiconductor layer of a second conduction type different from said first conduction type, over a substrate; and (B) exposing a part of said first compound semiconductor layer, forming a first electrode over said exposed part of said first compound semiconductor layer and forming a second electrode over said second compound semiconductor layer, wherein said method further includes, subsequent to said step (B), the step of: (C) covering at least said exposed part of said first compound semiconductor layer, an exposed part of said active layer, an exposed part of said second compound semiconductor layer, and a part of said second electrode with an SOG layer.

    摘要翻译: 本文公开了一种制造发光器件的方法,包括以下步骤:(A)顺序地形成第一导电类型的第一化合物半导体层,有源层和与所述第二导电类型不同的第二化合物半导体层 第一导电类型,在基板上; 和(B)暴露所述第一化合物半导体层的一部分,在所述第一化合物半导体层的所述暴露部分上形成第一电极,并在所述第二化合物半导体层上形成第二电极,其中所述方法还包括,在所述步骤 (B)中,步骤:(C)至少覆盖所述第一化合物半导体层的所述暴露部分,所述有源层的暴露部分,所述第二化合物半导体层的暴露部分和所述第二电极的一部分, SOG层。

    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 失效
    发光装置及其制造方法

    公开(公告)号:US20110068363A1

    公开(公告)日:2011-03-24

    申请号:US12957908

    申请日:2010-12-01

    IPC分类号: H01L33/52

    CPC分类号: H01L33/44 H01L33/38

    摘要: A method of manufacturing a light emitting device, including the steps of: (A) sequentially forming a first compound semiconductor layer of a first conduction type, an active layer, and a second compound semiconductor layer of a second conduction type different from said first conduction type, over a substrate; and (B) exposing a part of said first compound semiconductor layer, forming a first electrode over said exposed part of said first compound semiconductor layer and forming a second electrode over said second compound semiconductor layer, wherein said method further includes, subsequent to said step (B), the step of: (C) covering at least said exposed part of said first compound semiconductor layer, an exposed part of said active layer, an exposed part of said second compound semiconductor layer, and a part of said second electrode with an SOG layer.

    摘要翻译: 一种制造发光器件的方法,包括以下步骤:(A)顺序地形成第一导电类型的第一化合物半导体层,有源层和与所述第一导电不同的第二导电类型的第二化合物半导体层 类型,在基底上; 和(B)暴露所述第一化合物半导体层的一部分,在所述第一化合物半导体层的所述暴露部分上形成第一电极,并在所述第二化合物半导体层上形成第二电极,其中所述方法还包括,在所述步骤 (B)中,步骤:(C)至少覆盖所述第一化合物半导体层的所述暴露部分,所述有源层的暴露部分,所述第二化合物半导体层的暴露部分和所述第二电极的一部分, SOG层。

    Light-emitting device
    3.
    发明授权
    Light-emitting device 有权
    发光装置

    公开(公告)号:US08575643B2

    公开(公告)日:2013-11-05

    申请号:US11876909

    申请日:2007-10-23

    IPC分类号: H01L33/00

    摘要: A light-emitting device includes a first compound semiconductor layer, an active layer, and a second compound semiconductor layer; a second electrode formed on the second compound semiconductor layer; an insulating layer covering the second electrode; a first opening provided to pass through the insulating layer, the second electrode, the second compound semiconductor layer, and the active layer; a second opening provided to pass through the insulating layer; a first electrode formed on an exposed portion of the first compound semiconductor layer at the bottom of the first opening; a first electrode extension extending from the first electrode to the insulating layer through the first opening and a first pad portion including a portion of the first electrode extension on the insulating layer; and a second pad portion connected to an exposed portion of the second electrode at the bottom of the second opening.

    摘要翻译: 发光器件包括第一化合物半导体层,有源层和第二化合物半导体层; 形成在第二化合物半导体层上的第二电极; 覆盖所述第二电极的绝缘层; 设置成穿过绝缘层,第二电极,第二化合物半导体层和有源层的第一开口; 设置成穿过绝缘层的第二开口; 形成在第一开口底部的第一化合物半导体层的露出部分上的第一电极; 通过所述第一开口从所述第一电极延伸到所述绝缘层的第一电极延伸部和包括所述绝缘层上的所述第一电极延伸部的一部分的第一焊盘部分; 以及第二焊盘部分,其连接到第二开口的底部处的第二电极的暴露部分。

    Light emitting device and method of manufacturing the same
    4.
    发明授权
    Light emitting device and method of manufacturing the same 失效
    发光元件及其制造方法

    公开(公告)号:US08217407B2

    公开(公告)日:2012-07-10

    申请号:US12957908

    申请日:2010-12-01

    IPC分类号: H01L21/00

    CPC分类号: H01L33/44 H01L33/38

    摘要: A method of manufacturing a light emitting device, including the steps of: (A) sequentially forming a first compound semiconductor layer of a first conduction type, an active layer, and a second compound semiconductor layer of a second conduction type different from said first conduction type, over a substrate; and (B) exposing a part of said first compound semiconductor layer, forming a first electrode over said exposed part of said first compound semiconductor layer and forming a second electrode over said second compound semiconductor layer, wherein said method further includes, subsequent to said step (B), the step of: (C) covering at least said exposed part of said first compound semiconductor layer, an exposed part of said active layer, an exposed part of said second compound semiconductor layer, and a part of said second electrode with an SOG layer.

    摘要翻译: 一种制造发光器件的方法,包括以下步骤:(A)顺序地形成第一导电类型的第一化合物半导体层,有源层和与所述第一导电不同的第二导电类型的第二化合物半导体层 类型,在基底上; 和(B)暴露所述第一化合物半导体层的一部分,在所述第一化合物半导体层的所述暴露部分上形成第一电极,并在所述第二化合物半导体层上形成第二电极,其中所述方法还包括,在所述步骤 (B)中,步骤:(C)至少覆盖所述第一化合物半导体层的所述暴露部分,所述有源层的暴露部分,所述第二化合物半导体层的暴露部分和所述第二电极的一部分, SOG层。

    Light emitting device and method of manufacturing the same
    5.
    发明授权
    Light emitting device and method of manufacturing the same 有权
    发光元件及其制造方法

    公开(公告)号:US07858418B2

    公开(公告)日:2010-12-28

    申请号:US11873763

    申请日:2007-10-17

    IPC分类号: H01L21/00

    CPC分类号: H01L33/44 H01L33/38

    摘要: Herein disclosed a method of manufacturing a light emitting device, including the steps of: (A) sequentially forming a first compound semiconductor layer of a first conduction type, an active layer, and a second compound semiconductor layer of a second conduction type different from said first conduction type, over a substrate; and (B) exposing a part of said first compound semiconductor layer, forming a first electrode over said exposed part of said first compound semiconductor layer and forming a second electrode over said second compound semiconductor layer, wherein said method further includes, subsequent to said step (B), the step of: (C) covering at least said exposed part of said first compound semiconductor layer, an exposed part of said active layer, an exposed part of said second compound semiconductor layer, and a part of said second electrode with an SOG layer.

    摘要翻译: 本文公开了一种制造发光器件的方法,包括以下步骤:(A)顺序地形成第一导电类型的第一化合物半导体层,有源层和与所述第二导电类型不同的第二化合物半导体层 第一导电类型,在基板上; 和(B)暴露所述第一化合物半导体层的一部分,在所述第一化合物半导体层的所述暴露部分上形成第一电极,并在所述第二化合物半导体层上形成第二电极,其中所述方法还包括,在所述步骤 (B)中,步骤:(C)至少覆盖所述第一化合物半导体层的所述暴露部分,所述有源层的暴露部分,所述第二化合物半导体层的暴露部分和所述第二电极的一部分, SOG层。

    LIGHT-EMITTING DEVICE
    6.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号:US20080105885A1

    公开(公告)日:2008-05-08

    申请号:US11876909

    申请日:2007-10-23

    IPC分类号: H01L33/00

    摘要: A light-emitting device includes a first compound semiconductor layer, an active layer, and a second compound semiconductor layer; a second electrode formed on the second compound semiconductor layer; an insulating layer covering the second electrode; a first opening provided to pass through the insulating layer, the second electrode, the second compound semiconductor layer, and the active layer; a second opening provided to pass through the insulating layer; a first electrode formed on an exposed portion of the first compound semiconductor layer at the bottom of the first opening; a first electrode extension extending from the first electrode to the insulating layer through the first opening and a first pad portion including a portion of the first electrode extension on the insulating layer; and a second pad portion connected to an exposed portion of the second electrode at the bottom of the second opening.

    摘要翻译: 发光器件包括第一化合物半导体层,有源层和第二化合物半导体层; 形成在第二化合物半导体层上的第二电极; 覆盖所述第二电极的绝缘层; 设置成穿过绝缘层,第二电极,第二化合物半导体层和有源层的第一开口; 设置成穿过绝缘层的第二开口; 形成在第一开口底部的第一化合物半导体层的露出部分上的第一电极; 通过所述第一开口从所述第一电极延伸到所述绝缘层的第一电极延伸部和包括所述绝缘层上的所述第一电极延伸部的一部分的第一焊盘部分; 以及第二焊盘部分,其连接到第二开口的底部处的第二电极的暴露部分。

    Layout data verification method, mask pattern verification method and circuit operation verification method
    7.
    发明申请
    Layout data verification method, mask pattern verification method and circuit operation verification method 审中-公开
    布局数据验证方法,掩模图案验证方法和电路操作验证方法

    公开(公告)号:US20050204327A1

    公开(公告)日:2005-09-15

    申请号:US11076939

    申请日:2005-03-11

    CPC分类号: G03F1/70 G03F7/705

    摘要: In the verification method of the present invention, a defect that is to cause a problem in fabrication is extracted from a mask pattern. The mask pattern is one obtained by deforming a mask pattern of a photomask used in a photolithography process so as to provide a transferred image close to a desired design pattern. The verification method includes the steps of: determining the exposure dose in the photolithography process; simulating the photolithography process on a computer based on the determined exposure dose; checking whether or not the desired design pattern has been obtained; and locating a fault point and outputting the result.

    摘要翻译: 在本发明的验证方法中,从掩模图案中提取出导致制造中的问题的缺陷。 掩模图案是通过使用于光刻工艺中的光掩模的掩模图案变形而获得的,以便提供接近所需设计图案的转印图像。 验证方法包括以下步骤:确定光刻工艺中的曝光剂量; 基于所确定的曝光剂量在计算机上模拟光刻工艺; 检查是否获得了所需的设计图案; 并定位故障点并输出结果。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体发光器件及其制造方法

    公开(公告)号:US20110012146A1

    公开(公告)日:2011-01-20

    申请号:US12922930

    申请日:2009-03-13

    IPC分类号: H01L33/30 H01L33/00

    摘要: There is provided a light-emitting device including a second electrode which exhibits a stable behavior in a process for manufacturing a light-emitting device or during an operation of a light-emitting device. A light-emitting device includes a first compound semiconductor layer 11 with an n-type conductivity type, an active layer 12 formed on the first compound semiconductor layer 11 and composed of a compound semiconductor, a second compound semiconductor layer 13 with a p-type conductivity type formed on the active layer 12, a first electrode 15 electrically connected to the first compound semiconductor layer 11, and a second electrode 14 formed on the second compound semiconductor layer 13, wherein the second electrode 14 is composed of a titanium oxide, has an electron concentration of 4×1021/cm3 or more, and reflects light emitted from the active layer.

    摘要翻译: 提供一种发光装置,其包括在制造发光装置的过程中或在发光装置的操作期间表现出稳定的行为的第二电极。 发光装置包括具有n型导电型的第一化合物半导体层11,形成在第一化合物半导体层11上并由化合物半导体构成的有源层12,具有p型的第二化合物半导体层13 形成在有源层12上的导电类型,与第一化合物半导体层11电连接的第一电极15和形成在第二化合物半导体层13上的第二电极14,其中第二电极14由氧化钛构成,具有 电子浓度为4×1021 / cm3以上,并且反射从有源层发射的光。

    Crawler type vibratory compacting machine
    9.
    发明授权
    Crawler type vibratory compacting machine 失效
    履带式振动压实机

    公开(公告)号:US6132133A

    公开(公告)日:2000-10-17

    申请号:US202273

    申请日:1998-12-10

    IPC分类号: E01C19/28 E02D3/074

    摘要: A crawler type vibratory compacting machine of the invention compacts the ground from a surface layer to a deep layer with high efficiency. The crawler type vibratory compacting machine comprises: a triangular crawler unit which includes one wide track (35) or a plurality of juxtaposed tracks (35a, 35b, 35c) wound around wheels (32, 34) arranged along the length of and above a track frame (31); and a vibrator (40) which is housed in the crawler unit. The crawler unit has opposite lateral ends of its center coupled via a first lateral shaft (23) and pins, to an arm (20) which extends from a vehicle body (10) having an operators seat (11).

    摘要翻译: PCT No.PCT / JP97 / 02021 Sec。 371 1998年12月10日第 102(e)1998年12月10日日期PCT 1997年6月11日PCT公布。 第WO97 / 47823号公报 日本1997年12月18日本发明的履带式振动压实机将从地层到地层的高效率压实在地面上。 履带式振动压实机包括:三角形履带单元,其包括缠绕在沿轨道(32,34)的长度和长度上方布置的轮(32,34)的一个宽轨道(35)或多个并置轨道(35a,35b,35c) 框架(31); 以及容纳在履带单元中的振动器(40)。 履带单元具有经由第一横向轴(23)和销的相对的中心侧端部连接到从具有操作者座椅(11)的车身(10)延伸的臂(20)。