公开(公告)号：US5633042A

公开(公告)日：1997-05-27

申请号：US654168

申请日：1996-05-28

申请人： Yoshihiko Nakamura ,  Masahiro Matsumura ,  Yasuo Fukuhara ,  Yukio Hatta ,  Masaharu Yamamoto ,  Makizi Miyao ,  Kiyohiro Nagao ,  Takayuki Fukuda ,  Hiroshi Toshima ,  Shigekazu Takanohashi ,  Akihiro Atsumi

发明人： Yoshihiko Nakamura ,  Masahiro Matsumura ,  Yasuo Fukuhara ,  Yukio Hatta ,  Masaharu Yamamoto ,  Makizi Miyao ,  Kiyohiro Nagao ,  Takayuki Fukuda ,  Hiroshi Toshima ,  Shigekazu Takanohashi ,  Akihiro Atsumi

IPC分类号： B29B15/12 ,  B29C35/08 ,  B29C70/50 ,  C08J3/22 ,  C08J5/24 ,  B05D3/02

CPC分类号： C08J3/226 ,  B29B15/122 ,  B29C70/50 ,  C08J5/24 ,  B29C35/08 ,  C08J2363/00 ,  C08J2463/00

摘要： In a process for manufacturing a prepreg for use as an electrically insulating material, a main epoxy resin composition and a subsidiary resin composition containing a hardener which have been separately filtered and metered are quickly mixed into a mixture resin composition, a reinforcing member is coated with a uniformly thin film of the mixture resin composition by a die coater under specific temperature, average residence time and low shear conditions, the coated reinforcing member is heated in non-contact manner by an infrared ray heater to have the member impregnated with the resin composition of the film, the member is further heated in non-contact manner by a floating dryer to have the resin composition semi-hardened, and the member is unified through compaction rolls, whereby the prepreg in the form of a sheet-shaped fiber reinforced composite material is continuously manufactured.

摘要翻译： 在制造用作电绝缘材料的预浸料的方法中，将主要环氧树脂组合物和含有已分别过滤和计量的固化剂的辅助树脂组合物快速混合到混合树脂组合物中，加强构件涂覆 通过模具涂布机在特定温度，平均停留时间和低剪切条件下的混合树脂组合物的均匀薄膜，通过红外线加热器以非接触的方式加热涂覆的加强部件，以使该部件浸渍有树脂组合物 通过浮动干燥器以非接触方式进一步加热构件，使树脂组合物半硬化，并且通过压实辊将构件一体化，由此形成片状纤维增强复合材料形式的预浸料 材料连续制造。

公开(公告)号：US20100044087A1

公开(公告)日：2010-02-25

申请号：US12523775

申请日：2007-01-25

申请人： Yasuo Fukuhara ,  Tomoaki Watanabe ,  Mao Yamaguchi ,  Yuki Kitai ,  Hiroaki Fujiwara

发明人： Yasuo Fukuhara ,  Tomoaki Watanabe ,  Mao Yamaguchi ,  Yuki Kitai ,  Hiroaki Fujiwara

IPC分类号： H05K1/03 ,  B32B5/16 ,  B32B9/00 ,  B05D5/12 ,  B32B38/00

CPC分类号： H05K3/4661 ,  B32B3/266 ,  B32B3/30 ,  B32B5/24 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  H05K1/0373 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2804 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31515 ,  Y10T428/31522

摘要： The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin(A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 μm or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.

摘要翻译： 本发明涉及一种通过用环氧树脂（A），固化剂（B），促进剂（C），苯氧基树脂（D）和无机填料（A））的环氧树脂组合物浸渍基材而获得的预浸料 （E）和半硬化浸渍材料，其中无机填料（E）的平均粒径为3μm以下。 当通过使用通过电镀处理形成电路的方法在由这种预浸料组成的绝缘体基板的表面上形成具有窄线距离的电路时，在电路轮廓周边的绝缘体基板表面上残留的电镀量 可以减少 结果，导致印刷电路板的制造期间的电路间绝缘电阻的稳定性和产率的提高。

公开(公告)号：US08409704B2

公开(公告)日：2013-04-02

申请号：US12523775

申请日：2007-01-25

申请人： Yasuo Fukuhara ,  Tomoaki Watanabe ,  Mao Yamaguchi ,  Yuki Kitai ,  Hiroaki Fujiwara

发明人： Yasuo Fukuhara ,  Tomoaki Watanabe ,  Mao Yamaguchi ,  Yuki Kitai ,  Hiroaki Fujiwara

IPC分类号： B32B7/12

CPC分类号： H05K3/4661 ,  B32B3/266 ,  B32B3/30 ,  B32B5/24 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  H05K1/0373 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2804 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31515 ,  Y10T428/31522

摘要： The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin (A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 μm or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.

摘要翻译： 本发明涉及一种通过用环氧树脂（A），固化剂（B），促进剂（C），苯氧基树脂（D）和无机填料（A））的环氧树脂组合物浸渍基材而获得的预浸料 （E）和半硬化浸渍材料，其中无机填料（E）的平均粒径为3μm以下。 当通过使用通过电镀处理形成电路的方法在由这种预浸料组成的绝缘体基板的表面上形成具有窄线距离的电路时，在电路轮廓周边的绝缘体基板表面上残留的电镀量 可以减少 结果，导致印刷电路板的制造期间的电路间绝缘电阻的稳定性和产率的提高。