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1.发明授权公开(公告)号：US07313292B2
公开(公告)日：2007-12-25
申请号：US10941940
申请日：2004-09-16
摘要： An optical component comprises an optical transmission element (e.g., an optical lens) whose circumferential wall partially joins a metal holder via a joining material (e.g., a low melting point glass), wherein stress is normally applied to the optical transmission element in a compression direction when joining the metal holder. The optical transmission element is inserted into a through hole of the metal holder, and the joining material is kept in a bank actualized by a tapered portion formed in proximity to one end of the through hole of the metal holder. This prevents tensile stress from being applied to the optical transmission element; thus, it is possible to avoid the occurrence of cracks and separations in the optical transmission element; and it is possible to avoid the occurrence of errors in optical characteristics, regardless of variations of the environmental temperature, so that, the optical component is improved in reliability.
摘要翻译： 光学部件包括光学传输元件（例如，光学透镜），其周壁通过接合材料（例如，低熔点玻璃）部分地连接金属保持器，其中应力通常以压缩方式施加到光传输元件 连接金属支架时的方向。 光传输元件插入到金属保持器的通孔中，并且接合材料保持在由金属保持器的通孔的一端附近形成的锥形部分实现的堤岸中。 这防止了拉伸应力施加到光传输元件上; 因此，可以避免在光传输元件中发生裂纹和分离; 并且不管环境温度的变化如何，可以避免出现光学特性的误差，从而提高了光学部件的可靠性。
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2.发明申请公开(公告)号：US20050099703A1
公开(公告)日：2005-05-12
申请号：US10941940
申请日：2004-09-16
摘要： An optical component comprises an optical transmission element (e.g., an optical lens) whose circumferential wall partially joins a metal holder via a joining material (e.g., a low melting point glass), wherein stress is normally applied to the optical transmission element in a compression direction when joining the metal holder. The optical transmission element is inserted into a through hole of the metal holder, and the joining material is kept in a bank actualized by a tapered portion formed in proximity to one end of the through hole of the metal holder. This prevents tensile stress from being applied to the optical transmission element; thus, it is possible to avoid the occurrence of cracks and separations in the optical transmission element; and it is possible to avoid the occurrence of errors in optical characteristics, regardless of variations of the environmental temperature, so that, the optical component is improved in reliability.
摘要翻译： 光学部件包括光学传输元件（例如，光学透镜），其周壁通过接合材料（例如，低熔点玻璃）部分地连接金属保持器，其中应力通常以压缩方式施加到光传输元件 连接金属支架时的方向。 光传输元件插入到金属保持器的通孔中，并且接合材料保持在由金属保持器的通孔的一端附近形成的锥形部分实现的堤岸中。 这防止了拉伸应力施加到光传输元件上; 因此，可以避免在光传输元件中出现裂纹和分离; 并且不管环境温度的变化如何，可以避免出现光学特性的误差，从而提高了光学部件的可靠性。
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公开(公告)号：US20050214979A1
公开(公告)日：2005-09-29
申请号：US11074747
申请日：2005-03-09
IPC分类号： H01L23/04 , B23K1/19 , H01L21/00 , H01L21/44 , H01L21/48 , H01L21/50 , H01L23/02 , H01L23/045 , H01L23/10 , H01S5/02 , H01S5/022 , H01S5/0683
CPC分类号： H01L21/50 , H01L23/045 , H01L23/10 , H01L33/483 , H01L2924/0002 , H01L2924/01079 , H01S5/02212 , H01S5/02272 , H01S5/02288 , H01S5/0683 , H01L2924/00
摘要： A semiconductor package has a substrate made of WCu, WAg, MoCu or MoAg. A plurality of leads are fixed to the substrate by hermetic sealing without an intervening nickel plating layer. A cover is bonded to the substrate with a seal ring which is directly bonded to the substrate by brazing without an intervening nickel plating layer. The leads are nickel plated and gold plated after hermetic sealing, and the seal ring is nickel plated and gold plated after brazing. Even though the substrate is made of a metal alloy, this arrangement provides the package with a high degree of airtightness.
摘要翻译： 半导体封装具有由WCu，WAg，MoCu或MoAg制成的衬底。 多个引线通过气密密封固定到基板上，而不需要插入镍镀层。 将覆盖物用密封环接合到基板上，该密封环通过钎焊直接接合到基板上，而没有中间的镀镍层。 导线在气密密封后进行镀镍和镀金，密封环镀镍，钎焊后镀金。 即使衬底由金属合金制成，这种布置使得封装具有高度的气密性。
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公开(公告)号：US07518205B2
公开(公告)日：2009-04-14
申请号：US11074747
申请日：2005-03-09
IPC分类号： H01L31/0232
CPC分类号： H01L21/50 , H01L23/045 , H01L23/10 , H01L33/483 , H01L2924/0002 , H01L2924/01079 , H01S5/02212 , H01S5/02272 , H01S5/02288 , H01S5/0683 , H01L2924/00
摘要： A semiconductor package has a substrate made of WCu, WAg, MoCu or MoAg. A plurality of leads are fixed to the substrate by hermetic sealing without an intervening nickel plating layer. A cover is bonded to the substrate with a seal ring which is directly bonded to the substrate by brazing without an intervening nickel plating layer. The leads are nickel plated and gold plated after hermetic sealing, and the seal ring is nickel plated and gold plated after brazing. Even though the substrate is made of a metal alloy, this arrangement provides the package with a high degree of air tightness.
摘要翻译： 半导体封装具有由WCu，WAg，MoCu或MoAg制成的衬底。 多个引线通过气密密封固定到基板上，而不需要插入镍镀层。 将覆盖物用密封环接合到基板上，该密封环通过钎焊直接接合到基板上，而没有中间的镀镍层。 导线在气密密封后进行镀镍和镀金，密封环镀镍，钎焊后镀金。 即使基板由金属合金制成，这种布置使得封装具有高度的气密性。
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5.发明授权Manufacture of probe unit having lead probes extending beyond edge of substrate 失效探头单元的制造，其具有超出衬底边缘的引线探针公开(公告)号：US07087501B2
公开(公告)日：2006-08-08
申请号：US11179659
申请日：2005-07-13
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/07342
摘要： A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.
摘要翻译： 在衬底的凹部中形成牺牲层，并且形成从衬底延伸到牺牲层的区域中的引线。 从衬底的底表面形成切口，切口通过衬底从底表面延伸到牺牲层的区域，然后去除牺牲层。 可以获得具有其前部延伸超出衬底边缘的引线的探针单元。 贯通导体可以形成在形成在基板中的通孔中。 引线可以形成在感光蚀刻玻璃基板上，之后选择性地蚀刻化学切割型玻璃。
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6.发明授权Manufacture of probe unit having lead probes extending beyond edge of substrate 失效探头单元的制造，其具有超出衬底边缘的引线探针公开(公告)号：US06946375B2
公开(公告)日：2005-09-20
申请号：US10099988
申请日：2002-03-19
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/07342
摘要： A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.
摘要翻译： 在衬底的凹部中形成牺牲层，并且形成从衬底延伸到牺牲层的区域中的引线。 从衬底的底表面形成切口，切口通过衬底从底表面延伸到牺牲层的区域，然后去除牺牲层。 可以获得具有其前部延伸超出衬底边缘的引线的探针单元。 贯通导体可以形成在形成在基板中的通孔中。 引线可以形成在感光蚀刻玻璃基板上，之后选择性地蚀刻化学切割型玻璃。
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公开(公告)号：US20050266690A1
公开(公告)日：2005-12-01
申请号：US11179659
申请日：2005-07-13
IPC分类号： G01R31/26 , G01R1/067 , G01R1/073 , G01R3/00 , H01L21/66 , H01L21/44 , H01L21/26 , H01L21/302 , H01L21/311 , H01L21/324 , H01L21/42 , H01L21/461 , H01L21/477
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/07342
摘要： A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.
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