摘要:
By exploiting an intense correlation exhibited between the distribution of lattice distortions in a wafer and the distribution of the threshold voltages of field effect transistors, the distribution of the lattice distortions in the wafer is reduced, thereby to mitigate the distribution of the characteristics of the semiconductor elements in the wafer. The difference between the maximum value and minimum value of the lattice distortions of a III-V single crystal at a normal temperature is set to at most 4×10−5, and the density of Si atoms contained in the III-V single crystal is set to at most 1×1016 cm−3, whereby the characteristics of semiconductor elements whose parent material is the III-V single crystal can be made uniform.
摘要:
By exploiting an intense correlation exhibited between the distribution of lattice distortions in a wafer and the distribution of the threshold voltages of field effect transistors, the distribution of the lattice distortions in the wafer is reduced, thereby to mitigate the distribution of the characteristics of the semiconductor elements inthe wafer. The difference between the maximum value and minimum value of the lattice distortions of a GaAs single crystal at a normal temperature is set to at most 4×10−5, and the density of Si atoms contained in the GaAs single crystal is set to at most 1×1016 cm−3, whereby the characteristics of semiconductor elements whose parent matrial is the GaAs single crystal can be made uniform.
摘要翻译:通过利用晶片中的晶格畸变分布与场效应晶体管的阈值电压分布之间的强相关性,晶片中晶格畸变的分布减小,从而减轻半导体的特性分布 砷化镓单晶在正常温度下的晶格畸变的最大值和最小值之间的差设定为至多4×10 -5,GaAs单晶中所含的Si原子的密度设定为 最多为1×10 16 cm -3,由此可以使母体为GaAs单晶的半导体元件的特性均匀。
摘要:
By exploiting an intense correlation exhibited between the distribution of lattice distortions in a wafer and the distribution of the threshold voltages of field effect transistors, the distribution of the lattice distortions in the wafer is reduced, thereby to mitigate the distribution of the characteristics of the semiconductor elements inthe wafer. The difference between the maximum value and minimum value of the lattice distortions of a GaAs single crystal at a normal temperature is set to at most 4.times.10.sup.-5, and the density of Si atoms contained in the GaAs single crystal is set to at most 1.times.10.sup.16 cm.sup.-3, whereby the characteristics of semiconductor elements whose parent matrial is the GaAs single crystal can be made uniform.
摘要:
By exploiting an intense correlation exhibited between the distribution of lattice distortions in a wafer and the distribution of the threshold voltages of field effect transistors, the distribution of the lattice distortions in the wafer si reduced, thereby to mitigate the distribution of the characteristics of the semiconductor elements in the wafer. The difference between the maximum value and minimum value of the lattice distortions of a GaAs single crystal at a normal temperature is set to at most 4×10−5, and the density of Si atoms contained in the GaAs single crystal is set to at most 1×1016 cm−3, whereby the characteristics of semiconductor elements whose parent material is the GaAs single crystal can be made uniform.
摘要翻译:通过利用晶片中的晶格失真分布与场效应晶体管的阈值电压分布之间的强烈的相关性,晶片si中晶格畸变的分布减小,从而减轻半导体的特性分布 晶片中的元素。 将GaAs单晶在正常温度下的晶格畸变的最大值与最小值的差设定为4×10 -5以下,将GaAs单晶中所含的Si原子的密度设定为最多 1×10 16 cm -3,由此可以使其母材为GaAs单晶的半导体元件的特性均匀。
摘要:
By exploiting an intense correlation exhibited between the distribution of lattice distortions in a wafer and the distribution of the threshold voltages of field effect transistors, the distribution of the lattice distortions in the wafer is reduced, thereby to mitigate the distribution of the characteristics of the semiconductor elements in the wafer. The difference between the maximum value and minimum value of the lattice distortions of a GaAs single crystal at a normal temperature is set to at most 4×10−5 and the density of Si atoms contained in the GaAs single crystal is set to at most 1×1016 cm−3, whereby the characteristics of semiconductor elements whose parent material is the GaAs single crystal can be made uniform.
摘要:
By exploiting an intense correlation exhibited between the distribution of lattice distortions in a wafer and the distribution of the threshold voltages of field effect transistors, the distribution of the lattice distortions in the wafer is reduced, thereby to mitigate the distribution of the characteristics of the semiconductor elements in the wafer. The difference between the maximum value and the minimum value of the lattice distortions of a GaAs single crystal at a normal temperature is set to at most 4.times.10.sup.-5, and the density of Si atoms contained in the GaAs single crystal is set to at most 1.times.10.sup.16 cm.sup.-3, whereby the characteristics of semiconductor elements whose parent material (substrate) is the GaAs single crystal can be made uniform.
摘要:
In a semiconductor storage device such as a phase change memory, a technique which can realize high integration is provided. The semiconductor storage device includes a phase change thin film 101 having two stable phases of a crystal state with low electric resistance and an amorphous state with high electric resistance, upper plug electrodes 102 and 103 provided on one side of the phase change thin film 101, a lower electrode 104 provided on the other side of the phase change thin film 101, a selecting transistor 114 whose drain/source terminals are connected to the upper plug electrode 102 and the lower electrode 104, and a selecting transistor 115 whose drain/source terminals are connected to the upper plug electrode 103 and the lower electrode 104, and a first memory cell is configured with the selecting transistor 114 and a phase change region 111 in the phase change thin film 101 sandwiched between the upper plug electrode 102 and the lower electrode 104, and a second memory cell is configured with the selecting transistor 115 and a phase change region 112 in the phase change thin film 101 sandwiched between the upper plug electrode 103 and the lower electrode 104.
摘要:
A semiconductor device capable of high-speed read and has a high data-retention characteristic is provided. In a semiconductor device including a memory array having a plurality of memory cells provided at intersecting points of a plurality of word lines and a plurality of bit lines, where each memory cell includes an information memory section and a select element, when information is programmed by a first pulse (reset operation) for programming information flowing in the bit line and a second pulse (set operation) different from the first pulse and information is read by a third pulse (read operation), current directions of the second pulse and the third pulse are opposite to each other.
摘要:
A method for forming a semiconductor storage device includes steps of forming a memory cell transistor, forming a first plug connected to the memory cell transistor, forming a second plug of a hydrogen diffusion inhibiting layer, forming capacitor electrodes and a capacitor insulator between the capacitor electrodes and forming a hydrogen adsorption inhibiting layer.
摘要:
A semiconductor device includes a capacitor having a lower electrode (102), a high-dielectric-constant or ferroelectric thin film (103), and an upper electrode (104) which are subsequently stacked. An impurity having an action of suppressing the catalytic activity of a metal or a conductive oxide constituting the electrode is added to the upper electrode (104). The addition of the impurity is effective to prevent inconveniences such as a reduction in capacitance, an insulation failure, and the peeling of the electrode due to hydrogen heat-treatment performed after formation of the upper electrode (104), and to improve the long-term reliability.