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公开(公告)号：US20130112566A1
公开(公告)日：2013-05-09
申请号：US13701063
申请日：2011-05-31
IPC分类号： H05K3/22
CPC分类号： H05K3/22 , C23F1/18 , C25D3/38 , C25D5/48 , H01L21/2885 , H01L21/32115 , H01L21/32134 , H01L21/7684 , H05K3/067 , H05K3/107 , H05K3/18
摘要： The present invention is concerned with improved means for etching circuit structures on printed circuit board or wafer substrates of copper or copper alloys in a manner effectively removing unwanted copper from such circuit structures leaving behind a smooth copper surface applying an etching solution containing an Fe(II)/Fe(III) redox system and sulfur containing organic additives. It is an advantage of the present invention that the solution can also applied for plating of copper prior to etching.
摘要翻译： 本发明涉及用于在铜或铜合金的印刷电路板或晶片衬底上蚀刻电路结构的改进方法，从而有效地从这种电路结构去除不需要的铜，留下光滑的铜表面，施加含有Fe（II ）/ Fe（III）氧化还原体系和含硫有机添加剂。 本发明的优点是，该溶液也可以在蚀刻之前用于镀铜。
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公开(公告)号：US5895563A
公开(公告)日：1999-04-20
申请号：US773300
申请日：1996-12-23
申请人： Yoshihisa Muranushi
发明人： Yoshihisa Muranushi
IPC分类号： C23C18/22 , C23C14/02 , C23C16/02 , C23C18/31 , C23C18/38 , C23F1/20 , C25D5/44 , C25D5/34 , C23F1/00
CPC分类号： C25D5/44
摘要： An iron immersion composition of matter is disclosed comprising a compound having a divalent or trivalent iron ion, a compound having a fluoride ion, and a compound having an acid hydrogen ion. A process for treating an aluminum substrate to improve the adhesion of metal layers to the substrate is also disclosed comprising contacting the substrate with the acidic iron immersion composition to produce an iron immersion coating on the alloy, and contacting the iron immersion coating with an etchant to substantially remove the coating and produce a microporous surface on the substrate.
摘要翻译： 公开了一种铁浸渍组合物，其包含具有二价或三价铁离子的化合物，具有氟离子的化合物和具有酸性氢离子的化合物。 还公开了一种用于处理铝基材以改善金属层对基材的粘合性的方法，包括使基材与酸性铁浸渍组合物接触以在合金上产生铁浸渍涂层，并将铁浸渍涂层与蚀刻剂接触 基本上除去涂层并在基底上产生微孔表面。
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公开(公告)号：US5601695A
公开(公告)日：1997-02-11
申请号：US487438
申请日：1995-06-07
申请人： Yoshihisa Muranushi
发明人： Yoshihisa Muranushi
CPC分类号： C25D5/44
摘要： A tin immersion composition of matter is disclosed comprising a compound comprising divalent tin ion, a compound comprising fluoride ion, and a compound comprising acid hydrogen ion. A process for treating an aluminum-copper or an aluminum-silicon alloy to improve the adhesion of metal layers to the alloy is also disclosed comprising contacting the alloy with an acidic tin immersion composition to produce a tin immersion coating on the alloy, and contacting the tin immersion coating with an etchant to substantially remove the tin immersion coating and produce an etched alloy surface.
摘要翻译： 公开了一种锡浸渍组合物，其包含包含二价锡离子的化合物，包含氟离子的化合物和包含酸性氢离子的化合物。 还公开了一种用于处理铝 - 铜或铝 - 硅合金以提高金属层对合金的粘附性的方法，其包括使该合金与酸性锡浸渍组合物接触以在合金上产生锡浸渍涂层， 锡浸渍涂层用蚀刻剂基本上去除锡浸渍涂层并产生蚀刻的合金表面。
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4.发明申请公开(公告)号：US20050139477A1
公开(公告)日：2005-06-30
申请号：US10502557
申请日：2003-02-17
CPC分类号： C25D21/14
摘要： To avoid change in plating performance, even where operation of the plating equipment is interrupted, the properties of the plating solution need to be preserved. For plating equipment having an insoluble anode, add a reservoir (7) for storing a replacement solution to the tank (4) having a metal ion supply source (copper ball (5)) and, upon termination of the plating operation, the entire plating solution is discharged from the tank (4) containing the metal ion supply source, while the solution for replacement is transferred from the reservoir (7) to the empty tank having a metal ion supply source, and immediately prior to the resumption of the plating operation transfer the solution for replacement back to the reservoir (7) and return the plating solution to the tank (4) containing the metal ion supply source.
摘要翻译： 为了避免电镀性能的变化，即使中断电镀设备的操作，需要保持电镀液的性能。 对于具有不溶性阳极的电镀设备，向具有金属离子供给源（铜球（5））的罐（4）添加用于储存替代溶液的储存器（7），并且在电镀操作结束时，将整个电镀 溶液从包含金属离子供应源的罐（4）排出，而用于更换的溶液从储存器（7）转移到具有金属离子供应源的空罐中，并且在恢复电镀操作之前 将溶液转移回储存器（7）并将电镀溶液返回到包含金属离子供应源的罐（4）。
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