公开(公告)号：US20110234325A1

公开(公告)日：2011-09-29

申请号：US13065040

申请日：2011-03-11

申请人： Yoshikatsu Tanaka

发明人： Yoshikatsu Tanaka

IPC分类号： H03B1/00

CPC分类号： H03L1/022

摘要： The invention provides a multifunctional VC-TCXO that, as well as promoting miniaturization, selectively configures the functions as needed, and furthermore, is suitable for power savings. In a VC-TCXO provided with a chamber body that accommodates an IC chip and a crystal blank, the IC chip has; basic functions consisting of a first oscillator output function, and a temperature compensating function, and additional functions comprising of a second oscillator output function, an operation/non-operation function of the first oscillator output, and a temperature voltage output function, and basic IC terminals and additional IC terminals for these functions, and basic mounting terminals, and additional mounting terminals. Two of the additional IC terminals are two functions among the additional functions, which are selectively connected according to changes in a circuit pattern of a surface layer of the circuit formation surface, and the basic mounting terminals are provided on four corner portions of an outside bottom surface of the chamber body, and the two additional mounting terminals that are connected to the two additional IC terminals are provided on a central portion of a long side facing the outside bottom surface.

摘要翻译： 本发明提供了一种多功能VC-TCXO，其还促进小型化，根据需要选择性地配置功能，此外，适合于节电。 在设置有容纳IC芯片和晶体空白的室主体的VC-TCXO中，IC芯片具有： 由第一振荡器输出功能和温度补偿功能组成的基本功能，以及包括第二振荡器输出功能，第一振荡器输出的操作/非操作功能和温度电压输出功能的附加功能，以及基本IC 端子和附加IC端子，以及基本安装端子和附加安装端子。 附加IC端子中的两个是附加功能中的两个功能，其根据电路形成表面的表面层的电路图案的变化选择性地连接，并且基本安装端子设置在外部底部的四个角部 并且连接到两个附加IC端子的两个附加安装端子设置在面向外侧底面的长边的中心部分上。

公开(公告)号：US20090058544A1

公开(公告)日：2009-03-05

申请号：US12205068

申请日：2008-09-05

申请人： Yoshikatsu Tanaka

发明人： Yoshikatsu Tanaka

IPC分类号： H03B1/00

CPC分类号： H03H9/1021 ,  H03H9/0547

摘要： A surface-mount crystal oscillator includes: a crystal blank; an IC chip in which at least an oscillation circuit using the crystal blank is integrated, a plurality of IC terminals are provided on one principal surface, and a plurality of mounting terminals for surface mounting are provided on the other principal surface; and a housing member joined to the one principal surface of the IC chip and formed into a recessed shape. The crystal blank is fixed to crystal connection terminals out of the IC terminals, and is hermetically encapsulated in a space formed by the IC chip and the housing member. At least a power supply terminal, an output terminal and a ground terminal out of the IC terminals are electrically connected to the mounting terminals by a through-electrode provided to penetrate through the IC chip.

摘要翻译： 表面贴装晶体振荡器包括：晶体空白; 集成了至少一个使用晶体坯的振荡电路的IC芯片，在一个主表面上设置多个IC端子，在另一个主表面上设置多个用于表面安装的安装端子; 以及与所述IC芯片的一个主面接合并形成为凹状的壳体部件。 晶体空白从IC端子固定到晶体连接端子，并被气密地封装在由IC芯片和壳体构件形成的空间中。 IC端子中的至少一个电源端子，输出端子和接地端子通过设置成穿过IC芯片的通孔电连接到安装端子。

公开(公告)号：US07239211B2

公开(公告)日：2007-07-03

申请号：US10783823

申请日：2004-02-20

申请人： Yoshikatsu Tanaka

发明人： Yoshikatsu Tanaka

IPC分类号： H03L1/00

CPC分类号： H03B5/04 ,  H03B5/32

摘要： A temperature-compensated quartz crystal oscillator includes a substrate having a circuit pattern disposed on a surface thereof and mounting electrodes disposed on a reverse side thereof and electrically connected to the circuit pattern, circuit components mounted on the surface of the substrate and electrically connected to the circuit pattern, and a surface-mounted quartz crystal unit having a hermetically sealed quartz crystal blank, and mounted on the surface of the substrate and electrically connected to the circuit pattern. The crystal unit has a cavity defined in a mounting surface thereof, at least one of the circuit components being housed in the cavity.

摘要翻译： 温度补偿石英晶体振荡器包括具有设置在其表面上的电路图案的基板和设置在其反面上并与电路图案电连接的安装电极，安装在基板的表面上并电连接到电路图案的电路部件 电路图案和具有气密密封的石英晶体坯的表面安装的石英晶体单元，并且安装在基板的表面上并电连接到电路图案。 晶体单元具有限定在其安装表面中的空腔，至少一个电路元件被容纳在空腔中。

公开(公告)号：US4785042A

公开(公告)日：1988-11-15

申请号：US120217

申请日：1987-11-10

申请人： Yutaka Azuma ,  Yoshikatsu Tanaka

发明人： Yutaka Azuma ,  Yoshikatsu Tanaka

IPC分类号： C08L23/06 ,  C08K3/34 ,  C08K5/00 ,  C08K5/20 ,  C08K3/10

CPC分类号： C08K5/0075 ,  C08K3/34 ,  C08K5/20

摘要： The object of the present invention is to provide a polyethylene resin composition which is improved in anti-blocking and slipping properties, and further in antistatic properties without deteriorating the excellent properties of polyethylene, such as transparency and heat sealability.The inventive polyethylene resin composition comprises(A) polyethylene,(B) a zeolite or an anhydrous amorphous aluminosilicate having the basic particle characteristics of zeolite as prepared by acid-treating zeolite,(C) fatty acid amide having a melting point of not more than 130.degree. C., and(D) an antistatic agent.

摘要翻译： 本发明的目的是提供一种聚乙烯树脂组合物，其抗粘连和滑动性能得到改善，并且还具有抗静电性能，而不会劣化聚乙烯的优异性能，例如透明性和热封性。 本发明的聚乙烯树脂组合物包含（A）聚乙烯，（B）具有通过酸处理沸石制备的沸石的碱性颗粒特性的沸石或无水无定形硅铝酸盐，（C）熔点不大于 130℃，（D）抗静电剂。

公开(公告)号：US07872537B2

公开(公告)日：2011-01-18

申请号：US12205068

申请日：2008-09-05

申请人： Yoshikatsu Tanaka

发明人： Yoshikatsu Tanaka

IPC分类号： H03B1/00

CPC分类号： H03H9/1021 ,  H03H9/0547

摘要： A surface-mount crystal oscillator includes: a crystal blank; an IC chip in which at least an oscillation circuit using the crystal blank is integrated, a plurality of IC terminals are provided on one principal surface, and a plurality of mounting terminals for surface mounting are provided on the other principal surface; and a housing member joined to the one principal surface of the IC chip and formed into a recessed shape. The crystal blank is fixed to crystal connection terminals out of the IC terminals, and is hermetically encapsulated in a space formed by the IC chip and the housing member. At least a power supply terminal, an output terminal and a ground terminal out of the IC terminals are electrically connected to the mounting terminals by a through-electrode provided to penetrate through the IC chip.

摘要翻译： 表面贴装晶体振荡器包括：晶体空白; 集成了至少一个使用晶体坯的振荡电路的IC芯片，在一个主表面上设置多个IC端子，在另一个主表面上设置多个用于表面安装的安装端子; 以及与所述IC芯片的一个主面接合并形成为凹状的壳体部件。 晶体空白从IC端子固定到晶体连接端子，并被气密地封装在由IC芯片和壳体构件形成的空间中。 IC端子中的至少一个电源端子，输出端子和接地端子通过设置成穿过IC芯片的通孔电连接到安装端子。

公开(公告)号：US4243474A

公开(公告)日：1981-01-06

申请号：US023883

申请日：1979-03-26

申请人： Haruo Shirai ,  Yoshikatsu Tanaka ,  Zinzo Kosuga ,  Kiyoshi Osaka

发明人： Haruo Shirai ,  Yoshikatsu Tanaka ,  Zinzo Kosuga ,  Kiyoshi Osaka

IPC分类号： H05K3/42 ,  H05K1/00 ,  H05K3/00 ,  H05K3/06 ,  H05K3/28 ,  H05K3/40 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06 ,  C23F1/02

CPC分类号： H05K3/28 ,  H05K3/0064 ,  H05K3/0094 ,  H05K1/0393 ,  H05K2201/0305 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/068 ,  H05K3/4038 ,  H05K3/427 ,  H05K3/428 ,  Y10S428/902 ,  Y10T156/1056 ,  Y10T29/49156

摘要： This invention relates to a process of producing a printed wiring board having first and second electrically conductive circuit layers provided on an insulating laminate. The insulating laminate includes a first insulating layer having metal foils provided on both sides thereof and a second insulating layer which is attached to one of the sides of the first insulating layer so as to place one of the electrically conductive circuit layers between the first and second insulating layers. The first electrically conductive circuit layer is formed in a predetermined pattern by printing and etching one of the metal foils. Then, connecting through-holes are formed in the first insulating layer across the first electrically conductive circuit layer and the remaining metal foil. The second insulating layer is attached onto the first insulating layer so that the first electrically conductive circuit layer is covered with the second insulating layer. Thereafter the second electrically conductive circuit layer is formed in a predetermined pattern from the remaining metal foil by printing and etching.

摘要翻译： 本发明涉及一种制造印刷电路板的方法，该印刷电路板具有设置在绝缘层压板上的第一和第二导电电路层。 所述绝缘层叠体包括：第一绝缘层，其具有设置在其两侧的金属箔;以及第二绝缘层，其附接到所述第一绝缘层的一侧，以将所述导电电路层之一置于所述第一和第二绝缘层之间 绝缘层。 通过印刷和蚀刻金属箔之一，以预定图案形成第一导电电路层。 然后，跨越第一导电电路层和剩余的金属箔在第一绝缘层中形成连接通孔。 第二绝缘层被附着在第一绝缘层上，使得第一导电电路层被第二绝缘层覆盖。 此后，第二导电电路层通过印刷和蚀刻从剩余的金属箔以预定图案形成。

公开(公告)号：US08299864B2

公开(公告)日：2012-10-30

申请号：US13065040

申请日：2011-03-11

申请人： Yoshikatsu Tanaka

发明人： Yoshikatsu Tanaka

IPC分类号： H03B5/32

CPC分类号： H03L1/022

摘要： The invention provides a multifunctional VC-TCXO that, as well as promoting miniaturization, selectively configures the functions as needed, and furthermore, is suitable for power savings. In a VC-TCXO provided with a chamber body that accommodates an IC chip and a crystal blank, the IC chip has; basic functions consisting of a first oscillator output function, and a temperature compensating function, and additional functions comprising of a second oscillator output function, an operation/non-operation function of the first oscillator output, and a temperature voltage output function, and basic IC terminals and additional IC terminals for these functions, and basic mounting terminals, and additional mounting terminals. Two of the additional IC terminals are two functions among the additional functions, which are selectively connected according to changes in a circuit pattern of a surface layer of the circuit formation surface, and the basic mounting terminals are provided on four corner portions of an outside bottom surface of the chamber body, and the two additional mounting terminals that are connected to the two additional IC terminals are provided on a central portion of a long side facing the outside bottom surface.

摘要翻译： 本发明提供了一种多功能VC-TCXO，其还促进小型化，根据需要选择性地配置功能，此外，适合于节电。 在设置有容纳IC芯片和晶体空白的室主体的VC-TCXO中，IC芯片具有： 由第一振荡器输出功能和温度补偿功能组成的基本功能，以及包括第二振荡器输出功能，第一振荡器输出的操作/非操作功能和温度电压输出功能的附加功能，以及基本IC 端子和附加IC端子，以及基本安装端子和附加安装端子。 附加IC端子中的两个是附加功能中的两个功能，其根据电路形成表面的表面层的电路图案的变化选择性地连接，并且基本安装端子设置在外部底部的四个角部 并且连接到两个附加IC端子的两个附加安装端子设置在面向外侧底面的长边的中心部分上。

公开(公告)号：US06847265B2

公开(公告)日：2005-01-25

申请号：US10459045

申请日：2003-06-11

申请人： Yoshikatsu Tanaka ,  Masaaki Arai

发明人： Yoshikatsu Tanaka ,  Masaaki Arai

IPC分类号： H03B5/32 ,  H03B5/04 ,  H03B5/36

CPC分类号： H03B5/04 ,  H03B5/368

摘要： A temperature-compensated crystal oscillator has a mounting substrate for surface-mounting, a crystal oscillator, a temperature compensating circuit for compensating for frequency vs. temperature characteristics of the crystal oscillator, and a frequency adjusting circuit for adjusting an oscillating frequency of the crystal oscillator. The crystal oscillator comprises at least a crystal blank, an IC chip which is electrically connected to the crystal blank and constitutes an oscillating circuit together with the crystal blank, and a surface-mount housing accommodating the crystal blank and the IC chip. The surface-mount housing is mounted on the mounting substrate. Components constituting the temperature compensating circuit and components constituting the frequency adjusting circuit are directly mounted on the mounting substrate.

摘要翻译： 温度补偿晶体振荡器具有用于表面安装的安装基板，晶体振荡器，用于补偿晶体振荡器的频率与温度特性的温度补偿电路，以及用于调节晶体振荡器的振荡频率的频率调节电路 。 晶体振荡器至少包括晶体坯，与晶体坯电连接并与晶体坯料一起构成振荡电路的IC芯片，以及容纳晶体坯和IC芯片的表面安装壳体。 表面安装壳体安装在安装基板上。 构成温度补偿电路的部件和构成频率调整电路的部件直接安装在安装基板上。