Ferro-electric memory device and method of manufacturing the same
    1.
    发明授权
    Ferro-electric memory device and method of manufacturing the same 失效
    铁电记忆装置及其制造方法

    公开(公告)号:US06972990B2

    公开(公告)日:2005-12-06

    申请号:US10858441

    申请日:2004-06-02

    摘要: A ferro-electric memory device includes a gate electrode which is formed on a semiconductor substrate, first and second diffusion layers which are formed in the semiconductor substrate, a first contact which is electrically connected to the first diffusion layer, a first oxygen barrier film having insulating properties, which is formed on the first contact, a second contact which is electrically connected to the first contact, a second oxygen barrier film having insulating properties, which is formed on the second contact, a ferro-electric capacitor which has a lower electrode, a ferro-electric film, and an upper electrode, a third contact which is electrically connected to the upper electrode, a first interconnection which is electrically connected to the second and third contacts, and a third oxygen barrier film having insulating properties, which is arranged between the ferro-electric capacitor and the second contact and brought into contact with the first oxygen barrier film.

    摘要翻译: 铁电存储器件包括形成在半导体衬底上的栅电极,形成在半导体衬底中的第一和第二扩散层,与第一扩散层电连接的第一触点,具有第一氧阻隔膜, 绝缘性能,其形成在第一接触件上,与第一接触件电连接的第二接触件,形成在第二接触件上的具有绝缘性能的第二氧阻隔膜,具有下电极的铁电电容器 铁电膜和上电极,与上电极电连接的第三触点,与第二触头和第三触头电连接的第一互连件,以及具有绝缘性能的第三隔氧膜,其为 布置在铁电电容器和第二触点之间并与第一氧阻隔膜接触。

    FERRO-ELECTRIC MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    FERRO-ELECTRIC MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 失效
    电动记忆体装置及其制造方法

    公开(公告)号:US20050207202A1

    公开(公告)日:2005-09-22

    申请号:US10858441

    申请日:2004-06-02

    摘要: A ferro-electric memory device includes a gate electrode which is formed on a semiconductor substrate, first and second diffusion layers which are formed in the semiconductor substrate, a first contact which is electrically connected to the first diffusion layer, a first oxygen barrier film having insulating properties, which is formed on the first contact, a second contact which is electrically connected to the first contact, a second oxygen barrier film having insulating properties, which is formed on the second contact, a ferro-electric capacitor which has a lower electrode, a ferro-electric film, and an upper electrode, a third contact which is electrically connected to the upper electrode, a first interconnection which is electrically connected to the second and third contacts, and a third oxygen barrier film having insulating properties, which is arranged between the ferro-electric capacitor and the second contact and brought into contact with the first oxygen barrier film.

    摘要翻译: 铁电存储器件包括形成在半导体衬底上的栅电极,形成在半导体衬底中的第一和第二扩散层,与第一扩散层电连接的第一触点,具有第一氧阻隔膜, 绝缘性能,其形成在第一接触件上,与第一接触件电连接的第二接触件,形成在第二接触件上的具有绝缘性能的第二氧阻隔膜,具有下电极的铁电电容器 铁电膜和上电极,与上电极电连接的第三触点,与第二触头和第三触头电连接的第一互连件,以及具有绝缘性能的第三隔氧膜,其为 布置在铁电电容器和第二触点之间并与第一氧阻隔膜接触。

    SEMICONDUCTOR DEVICE
    3.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号:US20080173912A1

    公开(公告)日:2008-07-24

    申请号:US11941291

    申请日:2007-11-16

    IPC分类号: H01L29/00

    摘要: A semiconductor device comprising a ferroelectric capacitor having improved reliability is disclosed. According to one aspect of the present invention, it is provided a semiconductor device comprising a transistor formed on a semiconductor substrate, a ferroelectric capacitor formed above the transistor and comprising a lower electrode, a ferroelectric film and an upper electrode, a first hydrogen barrier film formed over the ferroelectric capacitor, an insulator formed over the first hydrogen barrier film, a contact plug disposed in the insulator and electrically connected with the upper electrode, a second hydrogen barrier film disposed between the contact plug and the insulator continuously, and a wiring connected with the contact plug.

    摘要翻译: 公开了一种包括具有改善的可靠性的铁电电容器的半导体器件。 根据本发明的一个方面,提供了一种半导体器件,包括形成在半导体衬底上的晶体管,形成在晶体管上方的铁电电容器,包括下电极,铁电体膜和上电极,第一氢阻挡膜 形成在所述铁电电容器上,形成在所述第一氢阻挡膜上的绝缘体,设置在所述绝缘体中并与所述上电极电连接的接触插塞,连续地配置在所述接触插塞和所述绝缘体之间的第二氢阻挡膜, 与接触插头。

    Semiconductor device
    4.
    发明申请
    Semiconductor device 失效
    半导体器件

    公开(公告)号:US20070045687A1

    公开(公告)日:2007-03-01

    申请号:US11288204

    申请日:2005-11-29

    IPC分类号: H01L29/94 H01L29/76 H01L31/00

    摘要: A semiconductor device comprising a ferroelectric capacitor having improved reliability is disclosed. According to one aspect of the present invention, it is provided a semiconductor device comprising a transistor formed on a semiconductor substrate, a ferroelectric capacitor formed above the transistor and comprising a lower electrode, a ferroelectric film and an upper electrode, a first hydrogen barrier film formed over the ferroelectric capacitor, an insulator formed over the first hydrogen barrier film, a contact plug disposed in the insulator and electrically connected with the upper electrode, a second hydrogen barrier film disposed between the contact plug and the insulator continuously, and a wiring connected with the contact plug.

    摘要翻译: 公开了一种包括具有改善的可靠性的铁电电容器的半导体器件。 根据本发明的一个方面,提供了一种半导体器件,包括形成在半导体衬底上的晶体管,形成在晶体管上方的铁电电容器,包括下电极,铁电体膜和上电极,第一氢阻挡膜 形成在所述铁电电容器上,形成在所述第一氢阻挡膜上的绝缘体,设置在所述绝缘体中并与所述上电极电连接的接触插塞,连续地配置在所述接触插塞和所述绝缘体之间的第二氢阻挡膜, 与接触插头。

    Semiconductor device
    5.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号:US07348617B2

    公开(公告)日:2008-03-25

    申请号:US11288204

    申请日:2005-11-29

    IPC分类号: H01L29/94

    摘要: A semiconductor device comprising a ferroelectric capacitor having improved reliability is disclosed. According to one aspect of the present invention, it is provided a semiconductor device comprising a transistor formed on a semiconductor substrate, a ferroelectric capacitor formed above the transistor and comprising a lower electrode, a ferroelectric film and an upper electrode, a first hydrogen barrier film formed over the ferroelectric capacitor, an insulator formed over the first hydrogen barrier film, a contact plug disposed in the insulator and electrically connected with the upper electrode, a second hydrogen barrier film disposed between the contact plug and the insulator continuously, and a wiring connected with the contact plug.

    摘要翻译: 公开了一种包括具有改善的可靠性的铁电电容器的半导体器件。 根据本发明的一个方面,提供了一种半导体器件,包括形成在半导体衬底上的晶体管,形成在晶体管上方的铁电电容器,包括下电极,铁电体膜和上电极,第一氢阻挡膜 形成在所述铁电电容器上,形成在所述第一氢阻挡膜上的绝缘体,设置在所述绝缘体中并与所述上电极电连接的接触插塞,连续地配置在所述接触插塞和所述绝缘体之间的第二氢阻挡膜, 与接触插头。

    Semiconductor storage device and method of manufacturing the same
    7.
    发明授权
    Semiconductor storage device and method of manufacturing the same 失效
    半导体存储装置及其制造方法

    公开(公告)号:US07612398B2

    公开(公告)日:2009-11-03

    申请号:US10931193

    申请日:2004-09-01

    IPC分类号: H01L21/02

    摘要: A semiconductor storage device wherein a plurality of ferroelectric capacitors are sufficiently covered with a hydrogen barrier film formed thereon comprises a field effect transistor formed on one surface side of a semiconductor substrate, a plurality of ferroelectric capacitors formed close to each other above the field effect transistor, an insulting film configured to cover the plurality of ferroelectric capacitors and planarised a space between adjacent ferroelectric capacitors in a self-aligned manner during formation thereof, and a hydrogen barrier film formed on the insulating film.

    摘要翻译: 一种半导体存储装置,其中多个强电介质电容器被形成在其上的氢阻挡膜充分覆盖,其包括形成在半导体衬底的一个表面侧的场效应晶体管,在场效应晶体管之上彼此靠近地形成的多个铁电电容器 被配置为覆盖多个铁电电容器的绝缘膜,并且在其形成期间以自对准的方式平铺相邻的铁电电容器之间的空间,以及形成在绝缘膜上的氢阻挡膜。

    Semiconductor memory device having ferroelectric capacitors with hydrogen barriers
    8.
    发明授权
    Semiconductor memory device having ferroelectric capacitors with hydrogen barriers 失效
    具有具有氢屏障的铁电电容器的半导体存储器件

    公开(公告)号:US07400005B2

    公开(公告)日:2008-07-15

    申请号:US11142441

    申请日:2005-06-02

    IPC分类号: H01L29/92

    摘要: A semiconductor memory device, which prevents the penetration of hydrogen or moisture to a ferroelectric capacitor from its surrounding area including a contact plug portion, comprises a ferroelectric capacitor formed above a semiconductor substrate, a first hydrogen barrier film formed on an upper surface of the ferroelectric capacitor to work as a mask in the formation of the ferroelectric capacitor, a second hydrogen barrier film formed on the upper surface and a side face of the ferroelectric capacitor including on the first hydrogen barrier film, and a contact plug disposed through the first and second hydrogen barrier films, and connected to an upper electrode of the ferroelectric capacitor, a side face thereof being surrounded with the hydrogen barrier films.

    摘要翻译: 一种半导体存储器件,其防止氢或水分从其包括接触插塞部分的周围区域渗入铁电电容器,包括形成在半导体衬底上的强电介质电容器,形成在铁电体的上表面上的第一氢阻挡膜 电容器在形成铁电电容器时用作掩模,在上表面上形成的第二氢阻挡膜和包括在第一氢阻挡膜上的强电介质电容器的侧面,以及通过第一和第二 氢阻挡膜,并连接到铁电电容器的上电极,其侧面被氢阻挡膜包围。

    Semiconductor memory device having ferroelectric capacitor and method of manufacturing the same
    9.
    发明授权
    Semiconductor memory device having ferroelectric capacitor and method of manufacturing the same 有权
    具有铁电电容器的半导体存储器件及其制造方法

    公开(公告)号:US07095068B2

    公开(公告)日:2006-08-22

    申请号:US10455376

    申请日:2003-06-06

    IPC分类号: H01L29/76 H01L27/108

    CPC分类号: H01L27/11502 H01L27/11507

    摘要: A semiconductor memory device includes a semiconductor substrate, a first transistor formed on the semiconductor substrate and including a first gate electrode and first and second diffusion layers, a first contact connected to the first diffusion layer, a first conductive oxygen barrier film electrically connected to the first contact and covering at least the upper surface of the first contact, a first ferroelectric capacitor including a first electrode, a second electrode, and a first ferroelectric film interposed between the first and second electrodes, and a first connecting member connected to the first electrode and to the first conductive oxygen barrier film.

    摘要翻译: 半导体存储器件包括半导体衬底,形成在半导体衬底上的第一晶体管,包括第一栅电极和第一和第二扩散层,与第一扩散层连接的第一触点,与第一导电氧阻隔膜电连接的第一导电氧阻隔膜 首先接触并且至少覆盖第一接触件的上表面;第一铁电电容器,包括插入在第一和第二电极之间的第一电极,第二电极和第一铁电体膜;以及连接到第一电极的第一连接构件 和第一导电氧阻隔膜。

    Semiconductor memory device and its manufacturing method
    10.
    发明申请
    Semiconductor memory device and its manufacturing method 失效
    半导体存储器件及其制造方法

    公开(公告)号:US20060180894A1

    公开(公告)日:2006-08-17

    申请号:US11142441

    申请日:2005-06-02

    IPC分类号: H01L29/00

    摘要: A semiconductor memory device, which prevents the penetration of hydrogen or moisture to a ferroelectric capacitor from its surrounding area including a contact plug portion, comprises a ferroelectric capacitor formed above a semiconductor substrate, a first hydrogen barrier film formed on an upper surface of the ferroelectric capacitor to work as a mask in the formation of the ferroelectric capacitor, a second hydrogen barrier film formed on the upper surface and a side face of the ferroelectric capacitor including on the first hydrogen barrier film, and a contact plug disposed through the first and second hydrogen barrier films, and connected to an upper electrode of the ferroelectric capacitor, a side face thereof being surrounded with the hydrogen barrier films.

    摘要翻译: 一种半导体存储器件,其防止氢或水分从其包括接触插塞部分的周围区域渗入铁电电容器,包括形成在半导体衬底上的强电介质电容器,形成在铁电体的上表面上的第一氢阻挡膜 电容器在形成铁电电容器时用作掩模,在上表面上形成的第二氢阻挡膜和包括在第一氢阻挡膜上的强电介质电容器的侧面,以及通过第一和第二 氢阻挡膜,并连接到铁电电容器的上电极,其侧面被氢阻挡膜包围。