摘要:
A semiconductor device comprising a ferroelectric capacitor having improved reliability is disclosed. According to one aspect of the present invention, it is provided a semiconductor device comprising a transistor formed on a semiconductor substrate, a ferroelectric capacitor formed above the transistor and comprising a lower electrode, a ferroelectric film and an upper electrode, a first hydrogen barrier film formed over the ferroelectric capacitor, an insulator formed over the first hydrogen barrier film, a contact plug disposed in the insulator and electrically connected with the upper electrode, a second hydrogen barrier film disposed between the contact plug and the insulator continuously, and a wiring connected with the contact plug.
摘要:
A semiconductor storage device has the ferroelectric capacitor has: a capacitor film formed above the MOS transistor with an interlayer insulating film interposed therebetween; a first capacitor electrode electrically connected to a source region of the MOS transistor and formed in contact with one side wall of the capacitor film; and a second capacitor electrode electrically connected to a drain region of the MOS transistor and formed in contact with the other side wall of the capacitor film, and the capacitor film is composed of a film stack including a plurality of films including a first insulating film intended to orient a film formed on an upper surface thereof in a predetermined direction and a ferroelectric film formed on the first insulating film to be oriented in a direction perpendicular to the semiconductor substrate.
摘要:
A semiconductor device includes: a semiconductor substrate and a transistor formed on the semiconductor substrate. The semiconductor device also includes: a first interlayer insulation film formed on the semiconductor substrate including the upper portion of the transistor, a first contact formed to be connected through the first interlayer insulation film to the transistor, a ferroelectric capacitor formed to be connected to the first contact, a second interlayer insulation film formed on the first interlayer insulation film, and a second contact formed to connect the ferroelectric capacitor to a wiring through the second interlayer insulation film. The contact surfaces between the second contact and the ferroelectric capacitor have the same planar shape.
摘要:
According to one embodiment, a semiconductor memory device having a ferroelectric film, includes a semiconductor substrate, a field effect transistor formed on the semiconductor substrate, an inter-layer insulating film formed on the field effect transistor and the semiconductor substrate, a plug constituted with a single-crystalline structure, the plug being formed in the inter-layer insulating film and being connected with a source or a drain of the field effect transistor, a lower electrode constituted with a single-crystalline structure formed on the plug, a ferroelectric film formed on the lower electrode an upper electrode formed on the ferroelectric film.
摘要:
This disclosure concerns a semiconductor device comprising a switching transistor provided on a semiconductor substrate; an interlayer dielectric film formed on the switching transistor; a ferroelectric capacitor including an upper electrode, a ferroelectric film, and a lower electrode formed on the interlayer dielectric film; a contact plug provided in the interlayer dielectric film and electrically connected to the lower electrode; a diffusion layer connecting between the contact plug and the switching transistor; a trench formed around the ferroelectric capacitor; and a barrier film filling in the trench and provided on a side surface of the ferroelectric capacitor and on an upper surface of the interlayer dielectric film, the barrier film suppressing percolation of hydrogen, wherein a thickness of the barrier film on the side surface of the ferroelectric capacitor is larger than a thickness of the barrier film on the upper surface of the interlayer dielectric film.
摘要:
According to one embodiment, a method of manufacturing a magnetic memory device, includes forming a lower structure, the lower structure includes a bottom electrode, an interlayer insulating film surrounding the bottom electrode, and a predetermined element containing portion which is in contact with the bottom electrode and which contains a predetermined element other than an element contained in at least a surface area of the bottom electrode and an element contained in at least a surface area of the interlayer insulating film, forming a stack film including a magnetic layer, on the lower structure, forming a hard mask on the stack film, and etching the stack film to expose the predetermined element containing portion.
摘要:
According to one embodiment, a magnetic memory device includes a bit line, a source line, a magnetoresistance effect element between the bit line and the source line, and a nonlinear element provided between the bit line and the source line and connected in series to the magnetoresistance effect element. The nonlinear element has a voltage-current characteristic in which current increases until a voltage to be applied becomes a predetermined applied voltage, when current flowing through the nonlinear element is within a range not exceeding a predetermined current, and current increases within an applied voltage range lower than the predetermined applied voltage, when current flowing through the nonlinear element is within a range exceeding the predetermined current.
摘要:
According to one embodiment, a semiconductor memory device includes a magnetic tunnel junction (MTJ) element, a contact layer and a first material layer. The contact layer is provided under the MTJ element and comprises a first material. The first material layer is provided around the contact layer and comprises the first material or an oxide of the first material.
摘要:
According to one embodiment, a magnetic memory device includes a first electrode, a second electrode having magnetism and having a major surface facing a major surface of the first electrode, a third electrode having a major surface facing the major surface of the first electrode and located away from the second electrode, and a movable member having magnetism and located between the first and second electrodes and between the first and third electrodes, the movable member being able to be brought into contact with the first electrode and being able to be selectively brought into contact with one of the second and third electrodes.
摘要:
A semiconductor storage device includes a memory cell having a ferroelectric capacitor and a cell transistor connected in parallel. The memory cell includes: a first conductive layer provided above a substrate; a ferroelectric layer formed on a top surface of the first conductive layer; a second conductive layer formed on a top surface of the ferroelectric layer; and a stopper layer formed in the same layer as the ferroelectric layer. A selection ratio of the stopper layer under CMP is higher than that of the ferroelectric layer under CMP.