摘要:
Disclosed is a pressure-sensitive adhesive tape which has a sufficient pressure-sensitive adhesive strength for an adherend, is excellent in heat resistance, and can be easily peeled without leaving a pressure-sensitive adhesive residue on the adherend particularly upon peeling. The pressure-sensitive adhesive tape includes, on a base material sheet, a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the pressure-sensitive adhesive composition, in which pieces of the layered clay mineral are arranged substantially perpendicular to the base material sheet.
摘要:
A pressure-sensitive adhesive tape, which has a pressure-sensitive adhesive layer with its storage modulus controlled within an adequate range, and which suitably prevents resin leakage during a sealing step in the production of a semiconductor device using a metal lead frame. The pressure-sensitive adhesive tape includes, on a base sheet, a pressure-sensitive adhesive layer containing a silicone-based pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the silicone-based pressure-sensitive adhesive composition.
摘要:
Provided is a cleaning member, which is capable of removing minute foreign matter, preferably foreign matter of a submicron level simply, exactly, and sufficiently, without contaminating a cleaning site. Further provided is a delivery member with a cleaning function having the cleaning member and a method of cleaning a substrate processing apparatus using the delivery member with a cleaning function. The cleaning member of the present invention includes a cleaning layer having a plurality of protrusions of a columnar structure on the surface, in which an aspect ratio of the protrusions of a columnar structure is 5 or more.
摘要:
Provided is a pressure-sensitive adhesive tape which has a sufficient pressure-sensitive adhesive strength for an adherend, is excellent in heat resistance, and can be easily peeled without leaving a pressure-sensitive adhesive residue on the adherend particularly upon peeling. The pressure-sensitive adhesive tape includes, on a substrate, a pressure-sensitive adhesive layer containing a lipophilic layered clay mineral, in which the layered clay mineral is in a state of being peeled and dispersed, and the interlayer distance of the layered clay mineral is 50 Å or more.
摘要:
Provided is a cleaning member capable of removing minute foreign matter, in particular foreign matter of a submicron level simply, exactly, and sufficiently without contaminating a cleaning site. Further provided is a carrying member provided with a cleaning function having the cleaning member and a method of cleaning a substrate processing equipment with the use of the cleaning member or the carrying member provided with a cleaning function. The cleaning member includes a layer member having a plurality of protrusions of a columnar structure on a surface, in which each of the protrusions of a columnar structure has a carbon-based nanostructure.
摘要:
An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.
摘要:
A flame-retardant thermally-conductive pressure-sensitive adhesive sheet includes a substrate and a flame-retardant thermally-conductive pressure-sensitive adhesive layer provided on at least one surface of the substrate. The substrate includes a polyester film and the thickness of the polyester film is 10 to 40 μm, and the thermal resistance of the flame-retardant thermally-conductive pressure-sensitive adhesive sheet is 10 cm2·K/W or less.
摘要:
The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.
摘要:
A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.
摘要:
An object is to provide a thermally conductive adhesive sheet capable of making a heat generating body and a heat radiating body adhere to each other easily and with a sufficient adhesive force. Provided is a thermally conductive adhesive sheet including an adhesive agent layer formed by molding a thermally conductive adhesive agent composition including an acrylic polymer component into a sheet-like shape, wherein the adhesive force at the time of 180° peeling is 1 N/20 mm or more and the contact thermal resistance is 0.6 cm2·K/W or less when the adhesive sheet is pressure bonded to an adherend with a pressure of 200 kPa.