摘要:
There is provided (i) a resin additive able to impart superior thermal shock resistance even in the case of resins that have absorbed moisture, (ii) a curable resin composition capable of forming a cured resin that has superior thermal shock resistance even after absorbing moisture, and (iii) a cured resin that has superior thermal shock resistance even after absorbing moisture. The resin additive consists of a powder with a mean particle size of 0.1 to 100 &mgr;m of silicone rubber. It has a moisture absorption rate of 0.20 weight percent or less after being treated for 20 hours at a temperature of about 121° C., a pressure of two atmospheres, and a relative humidity of 100 percent. The curable resin composition contains the resin additive, and the cured resin is formed by curing the curable resin composition.
摘要:
A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.
摘要:
The present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins. The present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins. The present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.
摘要:
An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt % of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.
摘要:
The present invention relates to a hydroxyphenyl-functional polyorganosiloxane compound having the formula ##STR1## wherein R is independently a monovalent hydrocarbon group free of aliphatic unsaturation, A is a substituted or unsubstituted hydroxyphenyl group, B is selected from the group consisting of alkyleneoxyalkylene groups having at least two carbon atoms and alkylene groups having at least 2 carbon atoms, m is zero or 1, and n is an integer from 0 to 400. The hydroxyphenyl-functional polyorganosiloxanes of this invention are useful as surfactants or as additives for organic polymers.
摘要:
There is disclosed a thermoplastic resin composition wherein the dispersion of a polyorganosiloxane in a thermoplastic resin is improved by the inclusion of a copolymer of an organosiloxane compound and an ester of a vinylcarboxylic acid or a copolymer of an aromatic vinyl compound, an unsaturated aliphatic nitrile compound and an organosiloxane compound. As a consequence of the excellent dispersion, the composition has improved moldability compared with conventional thermoplastic resins containing only polyorganosiloxane and yields moldings that have a releasability, lubricity, water repellency and mechanical strength superior to moldings from the conventional thermoplastic resins containing only polyorganosiloxane.
摘要:
The present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins. The present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins. The present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.
摘要:
A flame retardant organic resin composition comprising (A) 100 parts by weight of an aromatic ring-containing organic resin and (B) 0.01-50 parts by weight of a branched organopolysiloxane described by average molecular formula (R13SiO1/2)a(R2SiO3/2)b(SiO4/2)c(R3O1/2)d(HO1/2)e, where each R1 is independently selected from alkyl groups comprising 1 to 12 carbon atoms and alkenyl groups comprising 2 to 12 carbon atoms; each R2 is independently selected from alkyl groups comprising 1 to 12 carbon atoms, alkenyl groups comprising 2 to 12 carbon atoms, and aryl groups comprising 6 to 12 carbon atoms, where the aryl groups of R2 are at least 30 mol % based on total monovalent hydrocarbon in R1 and R2, R3 represents an alkyl group, subscripts a and b are positive numbers, and subscripts c, d, and e are 0 or positive numbers.
摘要翻译:一种阻燃有机树脂组合物,其包含(A)100重量份的含芳环的有机树脂和(B)0.01-50重量份的由平均分子结构域所述的支链有机基聚硅氧烷,每个R 1独立地选自烷基, 1至12个碳原子和2至12个碳原子的链烯基; 每个R 2独立地选自包含1至12个碳原子的烷基,包含2至12个碳原子的烯基和包含6至12个碳原子的芳基,其中R 2的芳基基于总单价为至少30摩尔% R 1和R 2中的烃,R 3表示烷基,下标a和b为正数,下标c,d和e为0或正数。
摘要:
The invention relates to a silicon-containing polyimide resin comprising (I) 0.1 to 100 mole % of structural units represented by the formula: ##STR1## where Ar.sup.1 is a tetra valent organic group having at least one aromatic ring, R independently represents a monovalent hydrocarbon group free of aliphatic unsaturated bonds, X is selected from an alkyleneoxyalkylene or an alkylene group having 2 or more carbon atoms, Y is an oxygen atom, an alkyleneoxyalkylene group, or an alkylene group having 2 or more carbon atoms, l, m, n are each integers having a value of 1 to 10, p is an integer having a value of 1 to 80, and a is 0 or 1; and (II) 99.9 to 0 mole % of structural units represented by the formula: ##STR2## where Ar.sup.2 is a tetravalent organic group having at least one aromatic ring, and Ar.sup.3 is a divalent organic group having at least one aromatic group.
摘要:
A silicone resin composition comprising a mixture or a reaction mixture of (A) a silicone resin having a softening point above 25° C. and represented by the following average unit formula: (R1SiO3/2)a(R22SiO2/2)b(R33SiO1/2)c(SiO4/2)d(XO1/2)e, and (B) an epoxy-containing alkoxysilane, is characterized by low melt viscosity, excellent reactivity and dispersibility in organic resins; to provide a curable resin composition which is capable of forming a cured resin with excellent flame retardant properties and is free of antimony oxides or halogenated epoxy resins and therefore does not produce a harmful influence on the human body or the environment.