Resin additive, curable resin composition, and cured resin
    1.
    发明授权
    Resin additive, curable resin composition, and cured resin 失效
    树脂添加剂,可固化树脂组合物和固化树脂

    公开(公告)号:US06239245B1

    公开(公告)日:2001-05-29

    申请号:US09507867

    申请日:2000-02-22

    IPC分类号: C08G7708

    CPC分类号: C08J3/26 C08J3/12 C08J2383/04

    摘要: There is provided (i) a resin additive able to impart superior thermal shock resistance even in the case of resins that have absorbed moisture, (ii) a curable resin composition capable of forming a cured resin that has superior thermal shock resistance even after absorbing moisture, and (iii) a cured resin that has superior thermal shock resistance even after absorbing moisture. The resin additive consists of a powder with a mean particle size of 0.1 to 100 &mgr;m of silicone rubber. It has a moisture absorption rate of 0.20 weight percent or less after being treated for 20 hours at a temperature of about 121° C., a pressure of two atmospheres, and a relative humidity of 100 percent. The curable resin composition contains the resin additive, and the cured resin is formed by curing the curable resin composition.

    摘要翻译: 提供(i)即使在吸收了水分的树脂的情况下也能赋予优异的耐热冲击性的树脂添加剂,(ii)能够形成具有优异的耐热冲击性的固化树脂的固化性树脂组合物,即使在吸收水分后 ,和(iii)即使在吸收水分后也具有优异的耐热冲击性的固化树脂。 树脂添加剂由平均粒径为0.1〜100μm的硅橡胶的粉末构成。 在约121℃,两个大气压,相对湿度为100%的温度下处理20小时后,其吸湿率为0.20重量%以下。 固化性树脂组合物含有树脂添加剂,固化树脂通过使固化性树脂组合物固化而形成。

    Curable epoxy resin composition
    2.
    发明授权
    Curable epoxy resin composition 有权
    可固化环氧树脂组合物

    公开(公告)号:US07105614B2

    公开(公告)日:2006-09-12

    申请号:US10482323

    申请日:2002-06-28

    IPC分类号: C08L63/00

    摘要: A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.

    摘要翻译: 一种可固化环氧树脂组合物,其至少包含:(A)结晶环氧树脂,(B)酚醛树脂,和(C)由含环氧基的有机基团和苯基构成的有机硅树脂,其定义该组分的平均单元式 。 对于100重量份的组分(A)和(B)的重量之和,组分(C)的用量为0.1至500重量份。 本发明的组合物适用于转印和注射成型,可用作密封电子和电子器件部件的可固化环氧树脂组合物。

    Hydroxyphenyl-containing polyorganosiloxanes
    5.
    发明授权
    Hydroxyphenyl-containing polyorganosiloxanes 失效
    含羟基苯基的聚有机硅氧烷

    公开(公告)号:US5726271A

    公开(公告)日:1998-03-10

    申请号:US755921

    申请日:1996-11-25

    CPC分类号: C08G77/12 C08G77/48 C08G77/50

    摘要: The present invention relates to a hydroxyphenyl-functional polyorganosiloxane compound having the formula ##STR1## wherein R is independently a monovalent hydrocarbon group free of aliphatic unsaturation, A is a substituted or unsubstituted hydroxyphenyl group, B is selected from the group consisting of alkyleneoxyalkylene groups having at least two carbon atoms and alkylene groups having at least 2 carbon atoms, m is zero or 1, and n is an integer from 0 to 400. The hydroxyphenyl-functional polyorganosiloxanes of this invention are useful as surfactants or as additives for organic polymers.

    摘要翻译: 本发明涉及具有下式的羟基苯基官能的聚有机硅氧烷化合物,其中R独立地是不含脂肪族不饱和键的一价烃基,A是取代或未取代的羟基苯基,B选自由以下组成的组中的烷氧基亚烷基: 至少两个碳原子和具有至少2个碳原子的亚烷基,m为0或1,n为0至400的整数。本发明的羟基苯基官能聚有机硅氧烷可用作表面活性剂或作为有机聚合物的添加剂。

    Thermoplastic resin composition
    6.
    发明授权
    Thermoplastic resin composition 失效
    热塑性树脂组合物

    公开(公告)号:US5654366A

    公开(公告)日:1997-08-05

    申请号:US604138

    申请日:1996-02-20

    摘要: There is disclosed a thermoplastic resin composition wherein the dispersion of a polyorganosiloxane in a thermoplastic resin is improved by the inclusion of a copolymer of an organosiloxane compound and an ester of a vinylcarboxylic acid or a copolymer of an aromatic vinyl compound, an unsaturated aliphatic nitrile compound and an organosiloxane compound. As a consequence of the excellent dispersion, the composition has improved moldability compared with conventional thermoplastic resins containing only polyorganosiloxane and yields moldings that have a releasability, lubricity, water repellency and mechanical strength superior to moldings from the conventional thermoplastic resins containing only polyorganosiloxane.

    摘要翻译: 公开了一种热塑性树脂组合物,其中聚有机硅氧烷在热塑性树脂中的分散体通过包含有机硅氧烷化合物和乙烯基羧酸的酯的共聚物或芳族乙烯基化合物,不饱和脂族腈化合物 和有机硅氧烷化合物。 作为优异分散性的结果,与仅含有聚有机硅氧烷的常规热塑性树脂相比,组合物具有改进的成型性,并且得到具有优于仅含有聚有机硅氧烷的常规热塑性树脂的模制品的脱模性,润滑性,拒水性和机械强度的模制品。

    Silicone resin composition, curable resin composition, and curable resin
    7.
    发明授权
    Silicone resin composition, curable resin composition, and curable resin 有权
    硅树脂组合物,可固化树脂组合物和可固化树脂

    公开(公告)号:US07138467B2

    公开(公告)日:2006-11-21

    申请号:US10504338

    申请日:2003-02-14

    IPC分类号: C08L63/00

    摘要: The present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins. The present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins. The present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.

    摘要翻译: 本发明涉及一种熔体粘度低,反应性和分散性优异的有机树脂组合物。 本发明还涉及一种用于形成固化树脂的固化树脂组合物,其具有优异的成型性和优异的阻燃性能,同时由于不含氧化锑或卤化环氧树脂而对人体和环境几乎没有不利的影响。 本发明还涉及对人体或环境几乎没有不利影响且具有优异的阻燃性能的固化树脂。

    Flame retardant organic resin composition
    8.
    发明授权
    Flame retardant organic resin composition 有权
    阻燃有机树脂组合物

    公开(公告)号:US06534576B2

    公开(公告)日:2003-03-18

    申请号:US09907281

    申请日:2001-07-17

    IPC分类号: C08K504

    摘要: A flame retardant organic resin composition comprising (A) 100 parts by weight of an aromatic ring-containing organic resin and (B) 0.01-50 parts by weight of a branched organopolysiloxane described by average molecular formula (R13SiO1/2)a(R2SiO3/2)b(SiO4/2)c(R3O1/2)d(HO1/2)e, where each R1 is independently selected from alkyl groups comprising 1 to 12 carbon atoms and alkenyl groups comprising 2 to 12 carbon atoms; each R2 is independently selected from alkyl groups comprising 1 to 12 carbon atoms, alkenyl groups comprising 2 to 12 carbon atoms, and aryl groups comprising 6 to 12 carbon atoms, where the aryl groups of R2 are at least 30 mol % based on total monovalent hydrocarbon in R1 and R2, R3 represents an alkyl group, subscripts a and b are positive numbers, and subscripts c, d, and e are 0 or positive numbers.

    摘要翻译: 一种阻燃有机树脂组合物,其包含(A)100重量份的含芳环的有机树脂和(B)0.01-50重量份的由平均分子结构域所述的支链有机基聚硅氧烷,每个R 1独立地选自烷基, 1至12个碳原子和2至12个碳原子的链烯基; 每个R 2独立地选自包含1至12个碳原子的烷基,包含2至12个碳原子的烯基和包含6至12个碳原子的芳基,其中R 2的芳基基于总单价为至少30摩尔% R 1和R 2中的烃,R 3表示烷基,下标a和b为正数,下标c,d和e为0或正数。

    Silicon-containing polyimide resin and silicon-containing polyamic acid
    9.
    发明授权
    Silicon-containing polyimide resin and silicon-containing polyamic acid 有权
    含硅聚酰亚胺树脂和含硅聚酰胺酸

    公开(公告)号:US6001942A

    公开(公告)日:1999-12-14

    申请号:US217075

    申请日:1998-12-21

    摘要: The invention relates to a silicon-containing polyimide resin comprising (I) 0.1 to 100 mole % of structural units represented by the formula: ##STR1## where Ar.sup.1 is a tetra valent organic group having at least one aromatic ring, R independently represents a monovalent hydrocarbon group free of aliphatic unsaturated bonds, X is selected from an alkyleneoxyalkylene or an alkylene group having 2 or more carbon atoms, Y is an oxygen atom, an alkyleneoxyalkylene group, or an alkylene group having 2 or more carbon atoms, l, m, n are each integers having a value of 1 to 10, p is an integer having a value of 1 to 80, and a is 0 or 1; and (II) 99.9 to 0 mole % of structural units represented by the formula: ##STR2## where Ar.sup.2 is a tetravalent organic group having at least one aromatic ring, and Ar.sup.3 is a divalent organic group having at least one aromatic group.

    摘要翻译: 本发明涉及一种含硅聚酰亚胺树脂,其包含(I)0.1-100摩尔%的由下式表示的结构单元:其中Ar1是具有至少一个芳族环的四价有机基团,R独立地表示一价无烃基团 的脂肪族不饱和键,X选自亚烷氧基亚烷基或碳原子数2以上的亚烷基,Y为氧原子,亚烷基氧化烯基或碳原子数2以上的亚烷基,l,m,n分别为 整数值为1〜10,p为1〜80的整数,a为0或1; 和(II)99.9至0摩尔%的由下式表示的结构单元:其中Ar 2是具有至少一个芳环的四价有机基团,Ar 3是具有至少一个芳族基团的二价有机基团。

    Silicone Resin Composition, Curable Resin Composition, and Cured Resin
    10.
    发明申请
    Silicone Resin Composition, Curable Resin Composition, and Cured Resin 审中-公开
    硅树脂组合物,可固化树脂组合物和固化树脂

    公开(公告)号:US20080319144A1

    公开(公告)日:2008-12-25

    申请号:US11813339

    申请日:2005-12-15

    IPC分类号: C08G77/38

    摘要: A silicone resin composition comprising a mixture or a reaction mixture of (A) a silicone resin having a softening point above 25° C. and represented by the following average unit formula: (R1SiO3/2)a(R22SiO2/2)b(R33SiO1/2)c(SiO4/2)d(XO1/2)e, and (B) an epoxy-containing alkoxysilane, is characterized by low melt viscosity, excellent reactivity and dispersibility in organic resins; to provide a curable resin composition which is capable of forming a cured resin with excellent flame retardant properties and is free of antimony oxides or halogenated epoxy resins and therefore does not produce a harmful influence on the human body or the environment.

    摘要翻译: 一种有机硅树脂组合物,其包含(A)软化点高于25℃并由以下平均单元式表示的(A)有机硅树脂的混合物或反应混合物:(R1SiO3 / 2)a(R22SiO2 / 2)b(R33SiO1 / 2)c(SiO4 / 2)d(XO1 / 2)e和(B)含环氧基的烷氧基硅烷的特征在于低熔融粘度,优异的反应性和在有机树脂中的分散性; 提供能够形成具有优异阻燃性能的固化树脂并且不含氧化锑或卤化环氧树脂的可固化树脂组合物,因此不会对人体或环境产生有害影响。