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公开(公告)号：US09132524B2
公开(公告)日：2015-09-15
申请号：US13881341
申请日：2010-10-26
申请人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
发明人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
IPC分类号： B24B37/14 , B24D11/00 , B24B37/24 , H01L21/304
CPC分类号： B24B37/24 , H01L21/304
摘要： A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.
摘要翻译： 抛光垫具有包括非发泡聚氨酯的抛光层，其中非发泡聚氨酯是含有异氰酸酯封端的预聚物的聚氨酯原料组合物的反应固化体，其通过使含有二异氰酸酯的预聚物原料组合物， 高分子量多元醇和低分子量多元醇; 通过加入三种或更多种二异氰酸酯聚合的异氰酸酯改性体; 和增链剂，相对于100重量份异氰酸酯封端的预聚物，异氰酸酯改性体的添加量为5〜30重量份。 抛光垫几乎不会在待抛光物体的表面上产生划痕，并且具有改善的敷料性能。
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公开(公告)号：US09079288B2
公开(公告)日：2015-07-14
申请号：US13881336
申请日：2010-10-26
申请人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
发明人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
CPC分类号： B24B37/24 , B24B37/042 , B24D11/00
摘要： A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.
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公开(公告)号：US20130244545A1
公开(公告)日：2013-09-19
申请号：US13881336
申请日：2010-10-26
申请人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
发明人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
CPC分类号： B24B37/24 , B24B37/042 , B24D11/00
摘要： A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.
摘要翻译： 抛光垫具有包括非发泡聚氨酯的抛光层，其中非发泡聚氨酯是含有异氰酸酯封端的预聚物的聚氨酯原料组合物的反应固化体，其通过使含有二异氰酸酯的预聚物原料组合物， 高分子量多元醇和低分子量多元醇; 通过加入三种或更多种二异氰酸酯聚合的异氰酸酯改性体; 和增链剂，相对于100重量份异氰酸酯封端的预聚物，异氰酸酯改性体的添加量为5〜30重量份。 抛光垫几乎不会在被抛光物体的表面上产生划痕，并且具有改善的敷料性能。
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公开(公告)号：US20130217309A1
公开(公告)日：2013-08-22
申请号：US13881341
申请日：2010-10-26
申请人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
发明人： Yoshiyuki Nakai , Kazuyuki Ogawa , Kenji Nakamura
IPC分类号： B24B37/24 , H01L21/304
CPC分类号： B24B37/24 , H01L21/304
摘要： A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.
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公开(公告)号：US08303372B2
公开(公告)日：2012-11-06
申请号：US12439135
申请日：2007-08-22
IPC分类号： B24B1/00
CPC分类号： B24B37/24 , B24D3/26 , C08G18/12 , C08G18/4238 , C08G18/4854 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G18/7621 , C08J9/30 , C08J2375/04 , C08L83/00 , C08G18/3243
摘要： A polishing pad having excellent planarization performance and wear resistance includes a polishing layer including a polyurethane foam having fine cells. The polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 40° C. or less, and (3) 4,4′-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt%). The pad so made is used in the manufacture of semiconductor devices.
摘要翻译： 具有优异的平坦化性能和耐磨性的抛光垫包括包括具有细孔的聚氨酯泡沫的抛光层。 聚氨酯泡沫体是（1）异氰酸酯封端的预聚物（A）与4,4'-亚甲基双（邻氯苯胺）反应形成具有tanδ的非发泡聚氨酯的反应的固化产物 峰温度为100℃以上，（2）能与4,4'-亚甲基双（邻氯苯胺）反应形成具有tanδ峰的非发泡聚氨酯的异氰酸酯封端的预聚物（B） 温度为40℃以下，（3）4,4'-亚甲基双（邻氯苯胺）和异氰酸酯封端的预聚物（A）和（B）以（A）/（B）比 为50/50至90/10（重量％）。 如此制成的焊盘用于制造半导体器件。
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公开(公告)号：US20090253353A1
公开(公告)日：2009-10-08
申请号：US11720964
申请日：2005-12-08
申请人： Kazuyuki Ogawa , Tetsuo Shimomura , Atsushi Kazuno , Yoshiyuki Nakai , Masahiro Watanabe , Takatoshi Yamada , Masahiko Nakamori
发明人： Kazuyuki Ogawa , Tetsuo Shimomura , Atsushi Kazuno , Yoshiyuki Nakai , Masahiro Watanabe , Takatoshi Yamada , Masahiko Nakamori
CPC分类号： B24B37/205 , Y10T428/24339 , Y10T428/24992
摘要： It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been used for a long period. It is a second object of the invention to provide a polishing pad capable of suppression of deterioration of polishing characteristics (such as in-plane uniformity) and generation of scratches due to a difference in behavior of a polishing region and a light-transmitting region during polishing. It is a third object of the invention to provide a polishing pad having a polishing region and a light-transmitting region with a concentration of a specific metal equal to or lower than a specific value (threshold value).
摘要翻译： 本发明的目的是提供一种抛光垫，其能够在抛光过程中对端点进行高精度光学检测，并且即使在抛光垫之后也可防止在使用期间抛光区域和透光区域之间的浆料泄漏 已被使用了很长时间。 本发明的第二个目的是提供一种能够抑制抛光特性（例如面内均匀性）劣化的抛光垫以及由于抛光区域和透光区域的行为差异而产生的划痕 抛光。 本发明的第三个目的是提供一种具有抛光区域和特定金属浓度等于或低于特定值（阈值）的透光区域的抛光垫。
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公开(公告)号：US08309466B2
公开(公告)日：2012-11-13
申请号：US12065219
申请日：2006-08-22
IPC分类号： H01L21/302 , H01L21/461 , B32B5/00 , B32B3/26
CPC分类号： B24B37/24 , B24D3/32 , C08G18/36 , C08G2101/00 , Y10T428/24 , Y10T428/249953
摘要： A polishing pad has an excellent polishing rate and is superior in longevity without generating center slow. A method of manufacturing a semiconductor device with the polishing pad is also provided. The polishing pad has a polishing layer consisting of a polyurethane foam having fine cells, wherein a high-molecular-weight polyol component that is a starting component of the polyurethane foam contains a hydrophobic high-molecular-weight polyol A having a number-average molecular weight of 550 to 800 and a hydrophobic high-molecular-weight polyol B having a number-average molecular weight of 950 to 1300 in an A/B ratio of from 10/90 to 50/50 by weight.
摘要翻译： 抛光垫具有优异的抛光速率，寿命长，不会产生中心慢。 还提供了一种制造具有抛光垫的半导体器件的方法。 抛光垫具有由具有细小细胞的聚氨酯泡沫构成的抛光层，其中作为聚氨酯泡沫的起始成分的高分子量多元醇成分含有具有数均分子量的疏水性高分子量多元醇A 重量为550〜800的疏水性高分子量多元醇B，A / B比为10/90〜50/50的数均分子量为950〜1300的疏水性高分子量多元醇B.
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公开(公告)号：US20100003896A1
公开(公告)日：2010-01-07
申请号：US12439154
申请日：2007-08-17
CPC分类号： B24B37/24 , B24B29/00 , B24D3/26 , B24D3/32 , C08G18/10 , C08G18/14 , C08G18/4854 , C08G18/6674 , C08G18/724 , C08G18/7831 , C08G18/3814 , C08G18/792
摘要： A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.
摘要翻译： 能够在吸收水分或水的同时维持高水平的尺寸稳定性的抛光垫包括：抛光层，其包括具有细孔的聚氨酯泡沫，其中聚氨酯泡沫包括异氰酸酯封端的预聚物（A）的反应的固化产物， 聚合二异氰酸酯和扩链剂，异氰酸酯封端的预聚物（A）包括异氰酸酯单体，高分子量多元醇（a）和低分子量多元醇。 制造这种抛光垫的方法包括将含有异氰酸酯封端的预聚物的第一组分与含有扩链剂的第二组分混合并固化该混合物以形成聚氨酯泡沫。 如此制成的焊盘用于制造半导体器件。
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公开(公告)号：US20100048102A1
公开(公告)日：2010-02-25
申请号：US12593206
申请日：2008-03-13
CPC分类号： B24B37/24 , B24D3/32 , C08G18/10 , C08G18/12 , C08G18/4833 , C08G18/4854 , C08G18/6674 , C08G18/724 , C08G2101/0025 , C08G18/3802 , C08G18/792 , C08G18/3206
摘要： A polishing pad capable of maintaining a high level of dimensional stability upon moisture absorption or water absorption and providing high polishing rate includes a polishing layer of a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol, (2) an isocyanate-terminated prepolymer (B) that includes a polymerized diisocyanate and a polyethylene glycol with a number average molecular weight of 200 to 1,000, and (3) a chain extender.
摘要翻译： 能够在吸湿或吸水性上保持高水平的尺寸稳定性并提供高抛光速度的抛光垫包括具有细孔的聚氨酯泡沫的抛光层，其中聚氨酯泡沫包括（1）的反应的固化产物， 包括异氰酸酯单体，高分子量多元醇（a）和低分子量多元醇的异氰酸酯封端的预聚物（A），（2）包含聚合二异氰酸酯和聚乙二醇的异氰酸酯封端的预聚物（B） 数均分子量为200〜1000，（3）扩链剂。
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10.发明授权公开(公告)号：US07470170B2
公开(公告)日：2008-12-30
申请号：US10590067
申请日：2005-02-22
申请人： Tetsuo Shimomura , Atsushi Kazuno , Kazuyuki Ogawa , Yoshiyuki Nakai , Masahiko Nakamori , Takatoshi Yamada
发明人： Tetsuo Shimomura , Atsushi Kazuno , Kazuyuki Ogawa , Yoshiyuki Nakai , Masahiko Nakamori , Takatoshi Yamada
IPC分类号： B24B1/00
摘要： The present invention provides a polishing pad which imparts excellent planarity and uniformity thereof to a material to be polished, such as a semiconductor wafer, without forming scratches. The present invention relates to a semiconductor wafer polishing pad comprising a polishing layer and a cushion layer, wherein the polishing layer is formed from foamed polyurethane, has a flexural modulus of 250 to 350 MPa, the cushion layer is formed from closed-cell foam and has a thickness of 0.5 to 1.0 mm and a strain constant of 0.01 to 0.08 μm/(gf/cm2).
摘要翻译： 本发明提供了一种抛光垫，其对诸如半导体晶片的待抛光材料赋予优异的平面度和均匀性，而不会形成划痕。 本发明涉及一种包括抛光层和缓冲层的半导体晶片抛光垫，其中抛光层由发泡聚氨酯形成，其弯曲模量为250至350MPa，缓冲层由闭孔泡沫形成， 厚度为0.5〜1.0mm，应变常数为0.01〜0.08μm/（gf / cm 2）。
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